Joseph T. DiBene II

Person

San Marcos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated power delivery and cooling system for high power micropr...
- Patent number 6,801,431
- Issue date Oct 5, 2004
- INCEP Technologies, Inc.
- David J Hartke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated magnetic buck converter with magnetically coupled synchr...
- Patent number 6,754,086
- Issue date Jun 22, 2004
- INCEP Technologies, Inc.
- Philip M. Harris
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated power delivery with flex circuit interconnection for hig...
- Patent number 6,741,480
- Issue date May 25, 2004
- INCEP Technologies, Inc.
- David H. Hartke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vortex heatsink for high performance thermal applications
- Patent number 6,698,511
- Issue date Mar 2, 2004
- INCEP Technologies, Inc.
- Joseph Ted DiBene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separable power delivery connector
- Patent number 6,623,279
- Issue date Sep 23, 2003
- INCEP Technologies, Inc.
- Edward J. Derian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for delivering power to high performance electronic assem...
- Patent number 6,618,268
- Issue date Sep 9, 2003
- INCEP Technologies, Inc.
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High speed and density circular connector for board-to-board interc...
- Patent number 6,609,914
- Issue date Aug 26, 2003
- INCEP Technologies, Inc.
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra-low impedance power interconnection system for electronic pac...
- Patent number 6,556,455
- Issue date Apr 29, 2003
- INCEP Technologies, Inc.
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vapor chamber with integrated pin array
- Patent number 6,490,160
- Issue date Dec 3, 2002
- INCEP Technologies, Inc.
- Joseph T. Dibene
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus for providing power to a microprocessor with integrated t...
- Patent number 6,452,113
- Issue date Sep 17, 2002
- INCEP Technologies, Inc.
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for thermal and mechanical management of a pow...
- Patent number 6,452,804
- Issue date Sep 17, 2002
- INCEP Technologies, Inc.
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imbedded die-scale interconnect for ultra-high speed digital commun...
- Patent number 6,429,386
- Issue date Aug 6, 2002
- NCR Corporation
- Joseph T. DiBene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated venting EMI shield and heatsink component for electronic...
- Patent number 6,401,805
- Issue date Jun 11, 2002
- NCR Corporation
- Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-circuit encapsulated packaging for power delivery
- Patent number 6,356,448
- Issue date Mar 12, 2002
- IncepTechnologies, Inc.
- Joseph Ted DiBene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inter-circuit encapsulated packaging
- Patent number 6,304,450
- Issue date Oct 16, 2001
- INCEP Technologies, Inc.
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Centralized cooling interconnect for electronic packages
- Patent number 6,243,269
- Issue date Jun 5, 2001
- NCR Corporation
- Joseph T. Dibene
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imbedded PCB AC coupling capacitors for high data rate signal transfer
- Patent number 5,972,231
- Issue date Oct 26, 1999
- NCR Corporation
- Joseph T. DiBene
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ECL pulse amplitude modulated encoder driver circuit
- Patent number 5,969,579
- Issue date Oct 19, 1999
- NCR Corporation
- David Hartke
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High pressure jackscrew connector
- Patent number 5,785,449
- Issue date Jul 28, 1998
- NCR Corporation
- Joseph T. DiBene
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Cable connector locking arrangement
- Patent number 5,044,975
- Issue date Sep 3, 1991
- NCR Corporation
- Joseph T. DiBene
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT
- Publication number 20070268677
- Publication date Nov 22, 2007
- Molex Incorporated
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for processor power delivery and thermal management
- Publication number 20070004240
- Publication date Jan 4, 2007
- Molex Incorporated
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for processor power delivery and thermal management
- Publication number 20050277310
- Publication date Dec 15, 2005
- Molex Incorporated
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for processor power delivery and thermal management
- Publication number 20030214800
- Publication date Nov 20, 2003
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Micro-spring interconnect systems for low impedance high power appl...
- Publication number 20030183406
- Publication date Oct 2, 2003
- Joseph T. DiBene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for providing power to a microprocessor with i...
- Publication number 20030156400
- Publication date Aug 21, 2003
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated power delivery and cooling system for high power micropr...
- Publication number 20030057548
- Publication date Mar 27, 2003
- INCEP Technologies, Inc.
- David H. Hartke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Ultra-low impedance power interconnection system for electronic pac...
- Publication number 20030002268
- Publication date Jan 2, 2003
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for providing power to a microprocessor with i...
- Publication number 20020196614
- Publication date Dec 26, 2002
- INCEP Technologies, Inc.
- Joseph T. DiBene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Separable power delivery connector
- Publication number 20020176229
- Publication date Nov 28, 2002
- INCEP Technologies, Inc.
- Edward J. Derian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Vortex heatsink for high performance thermal applications
- Publication number 20020174980
- Publication date Nov 28, 2002
- INCEP Technologies, Inc.
- Joseph Ted DiBene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing power to a microprocessor with i...
- Publication number 20020172022
- Publication date Nov 21, 2002
- INCEP Technologies, Inc.
- Joseph Ted DiBene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated power delivery with flex circuit interconnection for hig...
- Publication number 20020164895
- Publication date Nov 7, 2002
- INCEP Technologies, Inc.
- David H. Hartke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Power interconnect method utilizing a flexible circuit between a vo...
- Publication number 20020151195
- Publication date Oct 17, 2002
- INCEP Technologies, Inc.
- Joseph Ted DiBene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Ultra-low impedance power interconnection system for electronic pac...
- Publication number 20020114129
- Publication date Aug 22, 2002
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Graded-dielectric structures for phase-shifting high speed signals...
- Publication number 20020063269
- Publication date May 30, 2002
- Joseph T. DiBene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for thermal and mechanical management of a pow...
- Publication number 20020057554
- Publication date May 16, 2002
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Vapor chamber with integrated pin array
- Publication number 20020021556
- Publication date Feb 21, 2002
- Joseph T. Dibene
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
High speed and density circular connector for board-to-board interc...
- Publication number 20020016092
- Publication date Feb 7, 2002
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High performance thermal/mechanical interface for fixed-gap referen...
- Publication number 20020015288
- Publication date Feb 7, 2002
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Imbedded die-scale interconnect for ultra-high speed digital commun...
- Publication number 20010038530
- Publication date Nov 8, 2001
- Joseph T. DiBene
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inter-circuit encapsulated packaging
- Publication number 20010038527
- Publication date Nov 8, 2001
- INCEP Technologies, Inc.
- Joseph Ted DiBene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for delivering power to high performance elect...
- Publication number 20010036066
- Publication date Nov 1, 2001
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thermal/mechanical springbeam mechanism for heat transfer from heat...
- Publication number 20010033476
- Publication date Oct 25, 2001
- Joseph T. Dibene
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for providing power to a microprocessor with i...
- Publication number 20010032738
- Publication date Oct 25, 2001
- Joseph Ted Dibene
- G06 - COMPUTING CALCULATING COUNTING

Joseph T. DiBene II

Person

Patents Grantslast 30 patents

Integrated power delivery and cooling system for high power micropr...

Integrated magnetic buck converter with magnetically coupled synchr...

Integrated power delivery with flex circuit interconnection for hig...

Vortex heatsink for high performance thermal applications

Separable power delivery connector

Apparatus for delivering power to high performance electronic assem...

High speed and density circular connector for board-to-board interc...

Ultra-low impedance power interconnection system for electronic pac...

Vapor chamber with integrated pin array

Apparatus for providing power to a microprocessor with integrated t...

Method and apparatus for thermal and mechanical management of a pow...

Imbedded die-scale interconnect for ultra-high speed digital commun...

Integrated venting EMI shield and heatsink component for electronic...

Inter-circuit encapsulated packaging for power delivery

Inter-circuit encapsulated packaging

Centralized cooling interconnect for electronic packages

Imbedded PCB AC coupling capacitors for high data rate signal transfer

ECL pulse amplitude modulated encoder driver circuit

High pressure jackscrew connector

Cable connector locking arrangement

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT

System and method for processor power delivery and thermal management

System and method for processor power delivery and thermal management

System and method for processor power delivery and thermal management

Micro-spring interconnect systems for low impedance high power appl...

Method and apparatus for providing power to a microprocessor with i...

Integrated power delivery and cooling system for high power micropr...

Ultra-low impedance power interconnection system for electronic pac...

Method and apparatus for providing power to a microprocessor with i...

Separable power delivery connector

Vortex heatsink for high performance thermal applications

Method and apparatus for providing power to a microprocessor with i...

Integrated power delivery with flex circuit interconnection for hig...

Power interconnect method utilizing a flexible circuit between a vo...

Ultra-low impedance power interconnection system for electronic pac...

Graded-dielectric structures for phase-shifting high speed signals...

Method and apparatus for thermal and mechanical management of a pow...

Vapor chamber with integrated pin array

High speed and density circular connector for board-to-board interc...

High performance thermal/mechanical interface for fixed-gap referen...

Imbedded die-scale interconnect for ultra-high speed digital commun...

Inter-circuit encapsulated packaging

Method and apparatus for delivering power to high performance elect...

Thermal/mechanical springbeam mechanism for heat transfer from heat...

Method and apparatus for providing power to a microprocessor with i...