Joseph T. Lindgren

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor constructions; and methods for providing electrically...
- Patent number 10,879,113
- Issue date Dec 29, 2020
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions; and methods for providing electrically...
- Patent number 10,121,697
- Issue date Nov 6, 2018
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions
- Patent number 9,177,917
- Issue date Nov 3, 2015
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wirebond sites and methods of maki...
- Patent number 9,054,099
- Issue date Jun 9, 2015
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 8,592,254
- Issue date Nov 26, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wirebond sites and methods of maki...
- Patent number 8,569,161
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stable electroless fine pitch interconnect plating
- Patent number 8,431,484
- Issue date Apr 30, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 8,291,966
- Issue date Oct 23, 2012
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wirebond sites and methods of maki...
- Patent number 7,939,949
- Issue date May 10, 2011
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 7,485,565
- Issue date Feb 3, 2009
- Micron Technologies, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective passivation of exposed silicon
- Patent number 7,312,164
- Issue date Dec 25, 2007
- Micron Technology, Inc.
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Asymmetric plating
- Patent number 7,256,115
- Issue date Aug 14, 2007
- Micron Technology, Inc.
- Warren M. Farnworth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with oxide coatings selectively positioned ov...
- Patent number 7,190,052
- Issue date Mar 13, 2007
- Micron Technology, Inc.
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 7,186,636
- Issue date Mar 6, 2007
- Micron Technology, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 7,183,133
- Issue date Feb 27, 2007
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 7,067,924
- Issue date Jun 27, 2006
- Micron Technology, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable electroless fine pitch interconnect plating
- Patent number 7,052,922
- Issue date May 30, 2006
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation of exposed silicon
- Patent number 6,905,953
- Issue date Jun 14, 2005
- Micron Technology, Inc.
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nickel bonding cap over copper metalized bondpads
- Patent number 6,825,564
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetric plating
- Patent number 6,767,817
- Issue date Jul 27, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 6,710,442
- Issue date Mar 23, 2004
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation of exposed silicon
- Patent number 6,593,221
- Issue date Jul 15, 2003
- Micron Technology, Inc.
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Constructions; and Methods for Providing Electrically...
- Publication number 20180374745
- Publication date Dec 27, 2018
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions; and Methods for Providing Electrically...
- Publication number 20160056073
- Publication date Feb 25, 2016
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKI...
- Publication number 20140054777
- Publication date Feb 27, 2014
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...
- Publication number 20130003303
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BARRIER MATERIAL DEVICE AND METHOD
- Publication number 20120315754
- Publication date Dec 13, 2012
- Micron Technology, Inc.
- Xiaoyun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions; And Methods For Providing Electrically...
- Publication number 20120043658
- Publication date Feb 23, 2012
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKI...
- Publication number 20110212578
- Publication date Sep 1, 2011
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABLE ELECTROLESS FINE PITCH INTERCONNECT PLATING
- Publication number 20110183514
- Publication date Jul 28, 2011
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKI...
- Publication number 20090085209
- Publication date Apr 2, 2009
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices with oxide coatings selectively positioned ov...
- Publication number 20070170551
- Publication date Jul 26, 2007
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...
- Publication number 20070075407
- Publication date Apr 5, 2007
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20060276016
- Publication date Dec 7, 2006
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stable electroless fine pitch interconnect plating
- Publication number 20060180461
- Publication date Aug 17, 2006
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective passivation of exposed silicon
- Publication number 20050164500
- Publication date Jul 28, 2005
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Asymmetric plating
- Publication number 20050032387
- Publication date Feb 10, 2005
- Warren M. Farnworth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20050023685
- Publication date Feb 3, 2005
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20050020069
- Publication date Jan 27, 2005
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stable electroless fine pitch interconnect plating
- Publication number 20050020064
- Publication date Jan 27, 2005
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric plating
- Publication number 20040238952
- Publication date Dec 2, 2004
- Warren M. Farnworth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Microelectronic devices with improved heat dissipation and methods...
- Publication number 20040195677
- Publication date Oct 7, 2004
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...
- Publication number 20040041255
- Publication date Mar 4, 2004
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nickel bonding cap over copper metalized bondpads
- Publication number 20040036137
- Publication date Feb 26, 2004
- Jeffery N. Gleason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective passivation of exposed silicon
- Publication number 20040033680
- Publication date Feb 19, 2004
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective passivation of exposed silicon
- Publication number 20040033682
- Publication date Feb 19, 2004
- Joseph T. Lindgren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for protecting tooling in a lead-free bath
- Publication number 20040026256
- Publication date Feb 12, 2004
- Joseph T. Lindgren
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Asymmetric plating
- Publication number 20040007611
- Publication date Jan 15, 2004
- Warren M. Farnworth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Joseph T. Lindgren

Person

Patents Grantslast 30 patents

Semiconductor constructions; and methods for providing electrically...

Semiconductor constructions; and methods for providing electrically...

Semiconductor constructions

Semiconductor device with copper wirebond sites and methods of maki...

Microelectronic devices with improved heat dissipation and methods...

Semiconductor device with copper wirebond sites and methods of maki...

Stable electroless fine pitch interconnect plating

Microelectronic devices with improved heat dissipation and methods...

Semiconductor device with copper wirebond sites and methods of maki...

Nickel bonding cap over copper metalized bondpads

Selective passivation of exposed silicon

Asymmetric plating

Semiconductor devices with oxide coatings selectively positioned ov...

Nickel bonding cap over copper metalized bondpads

Microelectronic devices with improved heat dissipation and methods...

Nickel bonding cap over copper metalized bondpads

Stable electroless fine pitch interconnect plating

Selective passivation of exposed silicon

Nickel bonding cap over copper metalized bondpads

Asymmetric plating

Microelectronic devices with improved heat dissipation and methods...

Selective passivation of exposed silicon

Patents Applicationslast 30 patents

Semiconductor Constructions; and Methods for Providing Electrically...

Semiconductor Constructions; and Methods for Providing Electrically...

SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKI...

MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...

INTERCONNECTION BARRIER MATERIAL DEVICE AND METHOD

Semiconductor Constructions; And Methods For Providing Electrically...

SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKI...

STABLE ELECTROLESS FINE PITCH INTERCONNECT PLATING

SEMICONDUCTOR DEVICE WITH COPPER WIREBOND SITES AND METHODS OF MAKI...

Semiconductor devices with oxide coatings selectively positioned ov...

MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...

Nickel bonding cap over copper metalized bondpads

Stable electroless fine pitch interconnect plating

Selective passivation of exposed silicon

Asymmetric plating

Nickel bonding cap over copper metalized bondpads

Nickel bonding cap over copper metalized bondpads

Stable electroless fine pitch interconnect plating

Asymmetric plating

Microelectronic devices with improved heat dissipation and methods...

MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...

Nickel bonding cap over copper metalized bondpads

Selective passivation of exposed silicon

Selective passivation of exposed silicon

Method and apparatus for protecting tooling in a lead-free bath

Asymmetric plating