Joshua D. Heppner

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular system for internet of things and method of assembling the...
- Patent number 11,653,467
- Issue date May 16, 2023
- Intel Corporation
- Chris D. Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with electromagnetic interference shielding s...
- Patent number 11,024,559
- Issue date Jun 1, 2021
- Intel Corporation
- Joshua Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretching retention plate for electronic assemblies
- Patent number 10,825,714
- Issue date Nov 3, 2020
- Intel Corporation
- Daniel Chavez-Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible packaging for a wearable electronic device
- Patent number 10,820,437
- Issue date Oct 27, 2020
- Intel Corporation
- Aleksandar Aleksov
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 10,707,171
- Issue date Jul 7, 2020
- Intel Corporation
- Tomita Yoshihiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with recessed substrate for underfill con...
- Patent number 10,672,625
- Issue date Jun 2, 2020
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-mold structures
- Patent number 10,636,716
- Issue date Apr 28, 2020
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 10,615,128
- Issue date Apr 7, 2020
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complex cavity formation in molded packaging structures
- Patent number 10,446,461
- Issue date Oct 15, 2019
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 10,325,866
- Issue date Jun 18, 2019
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetically shielded electronic devices and related systems...
- Patent number 10,224,290
- Issue date Mar 5, 2019
- Intel Corporation
- Rajendra Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket contact techniques and configurations
- Patent number 10,205,292
- Issue date Feb 12, 2019
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface solar cell packaging for self-powered electronic devices
- Patent number 10,193,493
- Issue date Jan 29, 2019
- Intel Corporation
- Joshua Heppner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flexible substrate retention on a reusable carrier
- Patent number 10,111,368
- Issue date Oct 23, 2018
- Intel Corporation
- Yoshihiro Tomita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic particle embedded flex or printed flex for magnetic tray o...
- Patent number 10,070,520
- Issue date Sep 4, 2018
- Intel Corporation
- Yoshihiro Tomita
- A43 - FOOTWEAR
Information Patent Grant
Surface-mount inductor structures for forming one or more inductors...
- Patent number 10,056,182
- Issue date Aug 21, 2018
- Intel Corporation
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,991,211
- Issue date Jun 5, 2018
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electromagnetic interference shielding
- Patent number 9,953,929
- Issue date Apr 24, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array (BGA) with anchoring pins
- Patent number 9,953,909
- Issue date Apr 24, 2018
- Intel Corporation
- Zuyang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with conformal EMI shielding and related...
- Patent number 9,847,304
- Issue date Dec 19, 2017
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complex cavity formation in molded packaging structures
- Patent number 9,824,901
- Issue date Nov 21, 2017
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package that includes finned vias
- Patent number 9,795,026
- Issue date Oct 17, 2017
- Intel Corporation
- Nayandeep K. Mahanta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket contact techniques and configurations
- Patent number 9,780,510
- Issue date Oct 3, 2017
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space-efficient underfilling techniques for electronic assemblies
- Patent number 9,728,425
- Issue date Aug 8, 2017
- Intel Corporation
- Joshua D. Heppner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Perforated conductive material for EMI shielding of semiconductor d...
- Patent number 9,704,811
- Issue date Jul 11, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an EMI shielding layer
- Patent number 9,685,413
- Issue date Jun 20, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method that utilize a shape memory material
- Patent number 9,635,764
- Issue date Apr 25, 2017
- Intel Corporation
- Shipeng Qiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques and configurations associated with a package load assembly
- Patent number 9,615,483
- Issue date Apr 4, 2017
- Intel Corporation
- Gaurav Chawla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20240213171
- Publication date Jun 27, 2024
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20220344273
- Publication date Oct 27, 2022
- Intel Corporation
- Toshihiro TOMITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SYSTEM FOR INTERNET OF THINGS
- Publication number 20210307189
- Publication date Sep 30, 2021
- Intel Corporation
- Chris D. Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20200286834
- Publication date Sep 10, 2020
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PACKAGING FOR A WEARABLE ELECTRONIC DEVICE
- Publication number 20190281717
- Publication date Sep 12, 2019
- Intel Corporation
- Aleksandar Aleksov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190074199
- Publication date Mar 7, 2019
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...
- Publication number 20180376591
- Publication date Dec 27, 2018
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED...
- Publication number 20180366421
- Publication date Dec 20, 2018
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...
- Publication number 20180337135
- Publication date Nov 22, 2018
- Intel Corporation
- Tomita YOSHIHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MOLD STRUCTURES
- Publication number 20180277458
- Publication date Sep 27, 2018
- Intel Corporation
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20180226358
- Publication date Aug 9, 2018
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING S...
- Publication number 20180166363
- Publication date Jun 14, 2018
- Intel Corporation
- Joshua D. Heppner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEX CAVITY FORMATION IN MOLDED PACKAGING STRUCTURES
- Publication number 20180096862
- Publication date Apr 5, 2018
- Intel Corporation
- Sasha N. Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SURFACE SOLAR CELL PACKAGING FOR SELF-POWERED ELECTRONIC DEVICES
- Publication number 20180083569
- Publication date Mar 22, 2018
- Intel Corporation
- Joshua HEPPNER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES
- Publication number 20180061673
- Publication date Mar 1, 2018
- Intel Corporation
- JOSHUA D. HEPPNER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BALL GRID ARRAY (BGA) WITH ANCHORING PINS
- Publication number 20180019193
- Publication date Jan 18, 2018
- Intel Corporation
- Zuyang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET CONTACT TECHNIQUES AND CONFIGURATIONS
- Publication number 20180019558
- Publication date Jan 18, 2018
- Intel Corporation
- Dhanya Athreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER
- Publication number 20170287851
- Publication date Oct 5, 2017
- Intel Corporation
- Anna M. Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEX CAVITY FORMATION IN MOLDED PACKAGING STRUCTURES
- Publication number 20170287736
- Publication date Oct 5, 2017
- Sasha Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHING RETENTION PLATE FOR ELECTRONIC ASSEMBLIES
- Publication number 20170287771
- Publication date Oct 5, 2017
- Intel Corporation
- DANIEL CHAVEZ-CLEMENTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD
- Publication number 20170287847
- Publication date Oct 5, 2017
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20170271270
- Publication date Sep 21, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SQUEEGEE HEAD APPARATUS FOR PRINTING MATERIALS
- Publication number 20170266948
- Publication date Sep 21, 2017
- Intel Corporation
- Joshua D. Heppner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...
- Publication number 20170250145
- Publication date Aug 31, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic particle embedded flex or printed flex for magnetic tray o...
- Publication number 20170188455
- Publication date Jun 29, 2017
- Intel Corporation
- Yoshihiro Tomita
- A41 - WEARING APPAREL
Information Patent Application
Electromagnetically shielded electronic devices and related systems...
- Publication number 20170186697
- Publication date Jun 29, 2017
- Intel Corporation
- Rajendra Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device packages with conformal emi shielding and related...
- Publication number 20170186708
- Publication date Jun 29, 2017
- Intel Corporation
- Eric Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...
- Publication number 20170179040
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SUBSTRATE RETENTION ON A REUSABLE CARRIER
- Publication number 20170181338
- Publication date Jun 22, 2017
- Intel Corporation
- YOSHIHIRO TOMITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TRENCHED MOLDING-BASED ELECTROMAGNETIC I...
- Publication number 20170179041
- Publication date Jun 22, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS

Joshua D. Heppner

Person

Patents Grantslast 30 patents

Ultra small molded module integrated with die by module-on-wafer as...

Modular system for internet of things and method of assembling the...

Semiconductor package with electromagnetic interference shielding s...

Stretching retention plate for electronic assemblies

Flexible packaging for a wearable electronic device

Ultra small molded module integrated with die by module-on-wafer as...

Electronic device package with recessed substrate for underfill con...

Through-mold structures

Systems and methods for electromagnetic interference shielding

Complex cavity formation in molded packaging structures

Electronic device packages with conformal EMI shielding and related...

Electromagnetically shielded electronic devices and related systems...

Socket contact techniques and configurations

Multi-surface solar cell packaging for self-powered electronic devices

Flexible substrate retention on a reusable carrier

Magnetic particle embedded flex or printed flex for magnetic tray o...

Surface-mount inductor structures for forming one or more inductors...

Semiconductor package having an EMI shielding layer

Systems and methods for electromagnetic interference shielding

Ball grid array (BGA) with anchoring pins

Electronic device packages with conformal EMI shielding and related...

Complex cavity formation in molded packaging structures

Electronic package that includes finned vias

Socket contact techniques and configurations

Space-efficient underfilling techniques for electronic assemblies

Perforated conductive material for EMI shielding of semiconductor d...

Semiconductor package having an EMI shielding layer

Integrated circuit and method that utilize a shape memory material

Techniques and configurations associated with a package load assembly

Electronic assembly that includes a plurality of electronic packages

Patents Applicationslast 30 patents

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

MODULAR SYSTEM FOR INTERNET OF THINGS

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

FLEXIBLE PACKAGING FOR A WEARABLE ELECTRONIC DEVICE

ELECTRONIC DEVICE PACKAGE

MAGNETIC PARTICLE EMBEDDED FLEX OR PRINTED FLEX FOR MAGNETIC TRAY O...

ELECTRONIC DEVICE PACKAGES WITH CONFORMAL EMI SHIELDING AND RELATED...

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER AS...

THROUGH-MOLD STRUCTURES

SYSTEMS AND METHODS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING S...

COMPLEX CAVITY FORMATION IN MOLDED PACKAGING STRUCTURES

MULTI-SURFACE SOLAR CELL PACKAGING FOR SELF-POWERED ELECTRONIC DEVICES

SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES

BALL GRID ARRAY (BGA) WITH ANCHORING PINS

SOCKET CONTACT TECHNIQUES AND CONFIGURATIONS

SEMICONDUCTOR PACKAGE HAVING AN EMI SHIELDING LAYER

COMPLEX CAVITY FORMATION IN MOLDED PACKAGING STRUCTURES

STRETCHING RETENTION PLATE FOR ELECTRONIC ASSEMBLIES

INTEGRATED CIRCUIT PACKAGE HAVING INTEGRATED EMI SHIELD

SYSTEMS AND METHODS FOR ELOECTROMAGNETIC INTERFERENCE SHIELDING

MODULAR SQUEEGEE HEAD APPARATUS FOR PRINTING MATERIALS

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...

Magnetic particle embedded flex or printed flex for magnetic tray o...

Electromagnetically shielded electronic devices and related systems...

Electronic device packages with conformal emi shielding and related...

PERFORATED CONDUCTIVE MATERIAL FOR EMI SHIELDING OF SEMICONDUCTOR D...

FLEXIBLE SUBSTRATE RETENTION ON A REUSABLE CARRIER

SEMICONDUCTOR PACKAGE WITH TRENCHED MOLDING-BASED ELECTROMAGNETIC I...