Joung-Min OH

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Chungcheongnam-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Die attaching method
- Patent number 7,582,542
- Issue date Sep 1, 2009
- Samsung Electronics Co., Ltd.
- Dae-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer sawing apparatus
- Patent number 6,578,567
- Issue date Jun 17, 2003
- Samsung Electronics Co., Ltd.
- Joung-Min Oh
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND PHOSPHOR-CONTAINI...
- Publication number 20130177998
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- Jee Hun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHING METHOD
- Publication number 20070184564
- Publication date Aug 9, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Dae-Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer sawing apparatus
- Publication number 20020166428
- Publication date Nov 14, 2002
- Samsung Electronics Co., Ltd.
- Joung-Min Oh
- B28 - WORKING CEMENT, CLAY, OR STONE