Joyce C. Liu

Person

Carmel, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing CXCR4 expression and/or function to enhance engraftment of...
- Patent number 11,278,572
- Issue date Mar 22, 2022
- The United States of America, as represented by the Secretary, Department of...
- Jiliang Gao
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Through-silicon via with improved substrate contact for reduced thr...
- Patent number 10,446,484
- Issue date Oct 15, 2019
- GLOBALFOUNDRIES Inc.
- John M. Safran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via with improved substrate contact for reduced thr...
- Patent number 9,847,290
- Issue date Dec 19, 2017
- GLOBALFOUNDRIES Inc.
- John M. Safran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain engineering devices using partial depth films in through-sub...
- Patent number 9,728,506
- Issue date Aug 8, 2017
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical leakage reduction in stacked integrated circuits having...
- Patent number 9,252,133
- Issue date Feb 2, 2016
- GLOBALFOUNDRIES Inc.
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical leakage reduction in stacked integrated circuits having...
- Patent number 8,907,494
- Issue date Dec 9, 2014
- International Business Machines Corporation
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for manufacturing trench capacitance
- Patent number 7,858,485
- Issue date Dec 28, 2010
- International Business Machines Corporation
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced dielectric constant spacer materials integration for high s...
- Patent number 7,081,393
- Issue date Jul 25, 2006
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing line edge roughness of oxide material using che...
- Patent number 6,838,347
- Issue date Jan 4, 2005
- International Business Machines Corporation
- Joyce C. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for uniform reactive ion etching of dual pre-doped polysilic...
- Patent number 6,828,187
- Issue date Dec 7, 2004
- International Business Machines Corporation
- Joyce C. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving adhesion to copper
- Patent number 6,821,890
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene flowable oxide insulation structure and metallic bar...
- Patent number 6,727,589
- Issue date Apr 27, 2004
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective hardmask for producing interconnect structures
- Patent number 6,720,249
- Issue date Apr 13, 2004
- International Business Machines Corporation
- Timothy J. Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming active devices of different gatelengths using lit...
- Patent number 6,703,312
- Issue date Mar 9, 2004
- International Business Machines Corporation
- John Walter Golz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer hard mask for eDRAM gate etch process
- Patent number 6,518,151
- Issue date Feb 11, 2003
- International Business Machines Corporation
- David Mark Dobuzinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interim oxidation of silsesquioxane dielectric for dual damascene p...
- Patent number 6,479,884
- Issue date Nov 12, 2002
- International Business Machines Corporation
- Robert Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual mask process for semiconductor devices
- Patent number 6,429,067
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Joyce C. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ formation of protective layer on silsesquioxane dielectric...
- Patent number 6,348,736
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for mechanical polishing (CMP) of metals and use thereof
- Patent number 6,348,076
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Donald F. Canaperi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interim oxidation of silsesquioxane dielectric for dual damascene p...
- Patent number 6,329,280
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Robert Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing heat dissipating structure for semiconductor de...
- Patent number 6,284,574
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Kevin Shawn Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving adhesion to copper
- Patent number 6,271,595
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene flowable oxide insulation structure and metallic bar...
- Patent number 6,221,780
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-SILICON VIA WITH IMPROVED SUBSTRATE CONTACT FOR REDUCED THR...
- Publication number 20180166381
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- John M. SAFRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS WITH A DIFFUSION PAD
- Publication number 20180047807
- Publication date Feb 15, 2018
- GLOBALFOUNDRIES INC.
- Herbert L. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING CXCR4 EXPRESSION AND/OR FUNCTION TO ENHANCE ENGRAFTMENT OF...
- Publication number 20170196911
- Publication date Jul 13, 2017
- The United States of America, as represented by the Secretary, Department of...
- Jiliang Gao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STRAIN ENGINEERING DEVICES USING PARTIAL DEPTH FILMS IN THROUGH-SUB...
- Publication number 20170162508
- Publication date Jun 8, 2017
- GLOBALFOUNDRIES INC.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LEAKAGE REDUCTION IN STACKED INTEGRATED CIRCUITS HAVING...
- Publication number 20150004749
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT
- Publication number 20140264756
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Christopher N. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MANUFACTURING TRENCH CAPACITANCE
- Publication number 20100038751
- Publication date Feb 18, 2010
- International Business Machines Corporation
- HUILONG ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING NESTED AND ISOLATED LINES IN SEMICONDUCTOR DEVICES
- Publication number 20090104776
- Publication date Apr 23, 2009
- International Business Machines Corporation
- David M. Dobuzinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PLASMA ETCHING HAVING IMPROVED ACROSS-WAFER E...
- Publication number 20080194112
- Publication date Aug 14, 2008
- International Business Machines Corporation
- Qingyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DISPOSABLE SPACERS FOR IMPROVED STRESSED NITRIDE...
- Publication number 20080182372
- Publication date Jul 31, 2008
- International Business Machines Corporation
- Joyce C. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED DIELECTRIC CONSTANT SPACER MATERIALS INTEGRATION FOR HIGH S...
- Publication number 20050260819
- Publication date Nov 24, 2005
- International Business Machines Corporation
- Michael P. Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming active devices of different gatelengths using lit...
- Publication number 20030216050
- Publication date Nov 20, 2003
- International Business Machines Corporation
- John Walter Golz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LAYER HARD MASK FOR EDRAM GATE ETCH PROCESS
- Publication number 20030032269
- Publication date Feb 13, 2003
- International Business Machines Corporation
- David Mark Dobuzinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MASK PROCESS FOR SEMICONDUCTOR DEVICES
- Publication number 20020094637
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Joyce C. Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interim oxidation of silsesquioxane dielectric for dual damascene p...
- Publication number 20010036739
- Publication date Nov 1, 2001
- Robert Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving adhesion to copper
- Publication number 20010023987
- Publication date Sep 27, 2001
- Vincent J. Mcgahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene flowable oxide insulation structure and metallic bar...
- Publication number 20010000115
- Publication date Apr 5, 2001
- Stephen E. Greco
- H01 - BASIC ELECTRIC ELEMENTS

Joyce C. Liu

Person

Patents Grantslast 30 patents

Reducing CXCR4 expression and/or function to enhance engraftment of...

Through-silicon via with improved substrate contact for reduced thr...

Through-silicon via with improved substrate contact for reduced thr...

Strain engineering devices using partial depth films in through-sub...

Electrical leakage reduction in stacked integrated circuits having...

Electrical leakage reduction in stacked integrated circuits having...

Structure and method for manufacturing trench capacitance

Reduced dielectric constant spacer materials integration for high s...

Method for reducing line edge roughness of oxide material using che...

Method for uniform reactive ion etching of dual pre-doped polysilic...

Method for improving adhesion to copper

Dual damascene flowable oxide insulation structure and metallic bar...

Protective hardmask for producing interconnect structures

Method of forming active devices of different gatelengths using lit...

Dual layer hard mask for eDRAM gate etch process

Interim oxidation of silsesquioxane dielectric for dual damascene p...

Dual mask process for semiconductor devices

In situ formation of protective layer on silsesquioxane dielectric...

Slurry for mechanical polishing (CMP) of metals and use thereof

Interim oxidation of silsesquioxane dielectric for dual damascene p...

Method of producing heat dissipating structure for semiconductor de...

Method for improving adhesion to copper

Dual damascene flowable oxide insulation structure and metallic bar...

Patents Applicationslast 30 patents

THROUGH-SILICON VIA WITH IMPROVED SUBSTRATE CONTACT FOR REDUCED THR...

DEEP TRENCH CAPACITORS WITH A DIFFUSION PAD

REDUCING CXCR4 EXPRESSION AND/OR FUNCTION TO ENHANCE ENGRAFTMENT OF...

STRAIN ENGINEERING DEVICES USING PARTIAL DEPTH FILMS IN THROUGH-SUB...

ELECTRICAL LEAKAGE REDUCTION IN STACKED INTEGRATED CIRCUITS HAVING...

STACKED INTEGRATED CIRCUIT

STRUCTURE AND METHOD FOR MANUFACTURING TRENCH CAPACITANCE

METHODS FOR FORMING NESTED AND ISOLATED LINES IN SEMICONDUCTOR DEVICES

METHOD AND SYSTEM FOR PLASMA ETCHING HAVING IMPROVED ACROSS-WAFER E...

METHOD OF FORMING DISPOSABLE SPACERS FOR IMPROVED STRESSED NITRIDE...

REDUCED DIELECTRIC CONSTANT SPACER MATERIALS INTEGRATION FOR HIGH S...

Method of forming active devices of different gatelengths using lit...

DUAL LAYER HARD MASK FOR EDRAM GATE ETCH PROCESS

DUAL MASK PROCESS FOR SEMICONDUCTOR DEVICES

Interim oxidation of silsesquioxane dielectric for dual damascene p...

Method for improving adhesion to copper

Dual damascene flowable oxide insulation structure and metallic bar...