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Joze E. Antol
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Hamburg, PA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bond pad support structure for semiconductor device
Patent number
8,183,698
Issue date
May 22, 2012
Agere Systems Inc.
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package including wire bonds
Patent number
7,888,257
Issue date
Feb 15, 2011
Agere Systems Inc.
Joze Eura Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacture of devices including solder bumps
Patent number
7,727,781
Issue date
Jun 1, 2010
Agere Systems Inc.
Joze Eura Antol
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Reinforced bond pad for a semiconductor device
Patent number
7,301,231
Issue date
Nov 27, 2007
Agere Systems, INC
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reinforced bond pad for a semiconductor device
Patent number
7,115,985
Issue date
Oct 3, 2006
Agere Systems, INC
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BOND PAD SUPPORT STRUCTURE FOR SEMICONDUCTOR DEVICE
Publication number
20100201000
Publication date
Aug 12, 2010
Agere Systems Inc.
Joze F. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacture of devices including solder bumps
Publication number
20100022034
Publication date
Jan 28, 2010
Joze Eura Antol
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Integrated circuit package including wire bonds
Publication number
20090098687
Publication date
Apr 16, 2009
Joze Eura Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reinforced bond pad for a semiconductor device
Publication number
20060226535
Publication date
Oct 12, 2006
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reinforced bond pad for a semiconductor device
Publication number
20060065969
Publication date
Mar 30, 2006
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS