Jr-Ching Lin

Person

Kao-Hsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic package and method of manufacturing the same
- Patent number 11,982,853
- Issue date May 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Optoelectronic package structure and method of manufacturing the same
- Patent number 11,929,357
- Issue date Mar 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device
- Patent number 11,867,956
- Issue date Jan 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,837,566
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package and method for manufacturing the same
- Patent number 11,835,757
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- G02 - OPTICS
Information Patent Grant
Method of forming a dummy fin between first and second semiconducto...
- Patent number 11,764,222
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for FinFET comprising patterned oxide and diel...
- Patent number 11,721,746
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for communication
- Patent number 11,714,243
- Issue date Aug 1, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Optoelectronic structure
- Patent number 11,675,136
- Issue date Jun 13, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Metal gate electrode of a semiconductor device
- Patent number 11,670,711
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jr-Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure with desired profile for semiconductor devices
- Patent number 11,605,719
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for FinFET isolation
- Patent number 11,605,564
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy FIN profile control to enlarge gate process window
- Patent number 11,600,717
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device
- Patent number 11,598,927
- Issue date Mar 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Chip on film package
- Patent number 11,581,261
- Issue date Feb 14, 2023
- Novatek Microelectronics Corp.
- Chun-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for communication
- Patent number 11,474,301
- Issue date Oct 18, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng You
- G02 - OPTICS
Information Patent Grant
Mechanisms for forming FinFET device
- Patent number 11,380,590
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,257,763
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure of field effect transistor with footing
- Patent number 11,257,931
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having dummy fin physically separating the fir...
- Patent number 11,217,586
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for manufacturing the same
- Patent number 11,183,474
- Issue date Nov 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package structures and methods of manufacturing the same
- Patent number 11,152,529
- Issue date Oct 19, 2021
- Advanced Semiconductor Engineering, Inc.
- JR-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,145,621
- Issue date Oct 12, 2021
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structures and methods of forming the same
- Patent number 11,121,039
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,120,974
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package
- Patent number 10,937,713
- Issue date Mar 2, 2021
- Novatek Microelectronics Corp.
- Chun-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device with controlled end-to-...
- Patent number 10,923,353
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for FinFET isolation
- Patent number 10,867,865
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,854,504
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal gate electrode of a semiconductor device
- Patent number 10,854,742
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jr-Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20240142727
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240113061
- Publication date Apr 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240094460
- Publication date Mar 21, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240019647
- Publication date Jan 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240006396
- Publication date Jan 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A DUMMY FIN BETWEEN FIRST AND SECOND SEMICONDUCTO...
- Publication number 20230361123
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Structure with Desired Profile for Semiconductor Devices
- Publication number 20230223453
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Profile Control to Enlarge Gate Process Window
- Publication number 20230207670
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for FinFET Isolation
- Publication number 20230154800
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230120036
- Publication date Apr 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230121954
- Publication date Apr 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230122292
- Publication date Apr 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230105803
- Publication date Apr 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230103713
- Publication date Apr 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20230081194
- Publication date Mar 16, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230063039
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230054600
- Publication date Feb 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
Mechanisms for Forming FinFET Device
- Publication number 20220328356
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR COMMUNICATION
- Publication number 20220214488
- Publication date Jul 7, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng YOU
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220196918
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
DEVICE FOR COMMUNICATION
- Publication number 20220196934
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220181264
- Publication date Jun 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fins and Methods of Forming Thereof
- Publication number 20220122972
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220084972
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Fin Profile Control to Enlarge Gate Process Window
- Publication number 20210367059
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY FINS AND METHODS OF FORMING THEREOF
- Publication number 20210242206
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE
- Publication number 20210183781
- Publication date Jun 17, 2021
- NOVATEK MICROELECTRONICS CORP.
- Chun-Yu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210175385
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- JR-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210167016
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Mei-Ju LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for FinFET Isolation
- Publication number 20210134680
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Jr-Ching Lin

Person

Patents Grantslast 30 patents

Optoelectronic package and method of manufacturing the same

Optoelectronic package structure and method of manufacturing the same

Optoelectronic device

Electronic device package and method for manufacturing the same

Optoelectronic package and method for manufacturing the same

Method of forming a dummy fin between first and second semiconducto...

Method and structure for FinFET comprising patterned oxide and diel...

Device for communication

Optoelectronic structure

Metal gate electrode of a semiconductor device

Gate structure with desired profile for semiconductor devices

Method and structure for FinFET isolation

Dummy FIN profile control to enlarge gate process window

Optoelectronic device

Chip on film package

Device for communication

Mechanisms for forming FinFET device

Electronic device package and method for manufacturing the same

Gate structure of field effect transistor with footing

Semiconductor device having dummy fin physically separating the fir...

Electronic device package and method for manufacturing the same

Semicondutor package structures and methods of manufacturing the same

Semiconductor package device and method of manufacturing the same

FinFET structures and methods of forming the same

Semiconductor device

Chip on film package

Fin field effect transistor (FinFET) device with controlled end-to-...

Method and structure for FinFET isolation

Semiconductor structure and manufacturing method thereof

Metal gate electrode of a semiconductor device

Patents Applicationslast 30 patents

OPTOELECTRONIC DEVICE

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC PACKAGE

OPTOELECTRONIC PACKAGE

OPTICAL DEVICE

METHOD OF FORMING A DUMMY FIN BETWEEN FIRST AND SECOND SEMICONDUCTO...

Gate Structure with Desired Profile for Semiconductor Devices

Dummy Fin Profile Control to Enlarge Gate Process Window

Method and Structure for FinFET Isolation

OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

OPTOELECTRONIC DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Mechanisms for Forming FinFET Device

DEVICE FOR COMMUNICATION

OPTOELECTRONIC STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

DEVICE FOR COMMUNICATION

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Dummy Fins and Methods of Forming Thereof

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Dummy Fin Profile Control to Enlarge Gate Process Window

DUMMY FINS AND METHODS OF FORMING THEREOF

CHIP ON FILM PACKAGE

SEMICONDUTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Method and Structure for FinFET Isolation