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Ju Yung Sohn
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Inchon, KR
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Patents Grants
last 30 patents
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Patent Grant
Methods for forming ground vias in semiconductor packages
Patent number
6,395,582
Issue date
May 28, 2002
Signetics
Ju Yung Sohn
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Ground via structures in semiconductor packages
Publication number
20020050407
Publication date
May 2, 2002
SIGNETICS KP CO., LTD.
Ju Yung Sohn
H01 - BASIC ELECTRIC ELEMENTS