Juan E. Dominguez

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
System in package with interconnected modules
- Patent number 11,817,438
- Issue date Nov 14, 2023
- Intel Corporationd
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active package substrate having anisotropic conductive layer
- Patent number 11,694,987
- Issue date Jul 4, 2023
- Intel Corporation
- Juan Eduardo Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density die package configuration on system boards
- Patent number 11,145,632
- Issue date Oct 12, 2021
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active package substrate having anisotropic conductive layer
- Patent number 10,790,257
- Issue date Sep 29, 2020
- Intel Corporation
- Juan Eduardo Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid die stacking
- Patent number 10,497,669
- Issue date Dec 3, 2019
- Intel Corporation
- Juan Eduardo Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface charge enhanced atomic layer deposition of pure metallic films
- Patent number 8,425,987
- Issue date Apr 23, 2013
- Intel Corporation
- Juan E. Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Using unstable nitrides to form semiconductor structures
- Patent number 8,344,352
- Issue date Jan 1, 2013
- Intel Corporation
- Juan E. Dominguez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tunable gate electrode work function material for transistor applic...
- Patent number 8,319,287
- Issue date Nov 27, 2012
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal barrier layers
- Patent number 8,222,746
- Issue date Jul 17, 2012
- Intel Corporation
- Adrien R. Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Using unstable nitrides to form semiconductor structures
- Patent number 7,982,204
- Issue date Jul 19, 2011
- Intel Corporation
- Juan E. Dominguez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper precursors for CVD/ALD/digital CVD of copper metal films
- Patent number 7,964,746
- Issue date Jun 21, 2011
- Advanced Technology Materials, Inc.
- Tianniu Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nanotube growth and device formation
- Patent number 7,964,174
- Issue date Jun 21, 2011
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fluorine-free precursors and methods for the deposition of conforma...
- Patent number 7,858,525
- Issue date Dec 28, 2010
- Intel Corporation
- Juan E. Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organometallic precursors for seed/barrier processes and methods th...
- Patent number 7,851,360
- Issue date Dec 14, 2010
- Intel Corporation
- Juan Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Using unstable nitrides to form semiconductor structures
- Patent number 7,749,906
- Issue date Jul 6, 2010
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method for high-k dielectric materials
- Patent number 7,704,895
- Issue date Apr 27, 2010
- Intel Corporation
- Adrien R. Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Optical coatings
- Patent number 7,687,225
- Issue date Mar 30, 2010
- Intel Corporation
- Sergei V. Koveshnikov
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Silicon-alloy based barrier layers for integrated circuit metal int...
- Patent number 7,687,911
- Issue date Mar 30, 2010
- Intel Corporation
- Juan E. Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tunable gate electrode work function material for transistor applic...
- Patent number 7,682,891
- Issue date Mar 23, 2010
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite metal films and carbon nanotube fabrication
- Patent number 7,635,503
- Issue date Dec 22, 2009
- Intel Corporation
- Juan E. Dominguez
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of fabricating a carbon nanotube interconnect structures
- Patent number 7,625,817
- Issue date Dec 1, 2009
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amine-free deposition of metal-nitride films
- Patent number 7,550,385
- Issue date Jun 23, 2009
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based optically degraded arc for lithographic patterning
- Patent number 7,507,521
- Issue date Mar 24, 2009
- Intel Corporation
- Kyle Y. Flanigan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition process for iodine-doped ruthenium barrier layers
- Patent number 7,476,615
- Issue date Jan 13, 2009
- Intel Corporation
- Joseph H. Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Noble metal barrier and seed layer for semiconductors
- Patent number 7,459,392
- Issue date Dec 2, 2008
- Intel Corporation
- Steven W. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloyed underlayer for microelectronic interconnects
- Patent number 7,435,679
- Issue date Oct 14, 2008
- Intel Corporation
- Steven W. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalytically enhanced atomic layer deposition process
- Patent number 7,354,849
- Issue date Apr 8, 2008
- Intel Corporation
- John J. Plombon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organometallic precursors for the chemical phase deposition of meta...
- Patent number 7,220,671
- Issue date May 22, 2007
- Intel Corporation
- Harsono Simka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PACKAGE SUBSTRATE HAVING ANISOTROPIC CONDUCTIVE LAYER
- Publication number 20200388587
- Publication date Dec 10, 2020
- Intel Corporation
- Juan Eduardo DOMINGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY DIE PACKAGE CONFIGURATION ON SYSTEM BOARDS
- Publication number 20200381406
- Publication date Dec 3, 2020
- Intel Corporation
- Juan E. DOMINGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES
- Publication number 20200227393
- Publication date Jul 16, 2020
- Intel Corporation
- Hyoung Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20200075446
- Publication date Mar 5, 2020
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PACKAGE SUBSTRATE HAVING ANISOTROPIC CONDUCTIVE LAYER
- Publication number 20200066670
- Publication date Feb 27, 2020
- Intel Corporation
- Juan Eduardo DOMINGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190229093
- Publication date Jul 25, 2019
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PACKAGE SUBSTRATE HAVING EMBEDDED INTERPOSER
- Publication number 20190181093
- Publication date Jun 13, 2019
- Intel Corporation
- Juan Eduardo DOMINGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE WITH CAVITY
- Publication number 20180190776
- Publication date Jul 5, 2018
- Sireesha Gogineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DIE STACKING
- Publication number 20180175000
- Publication date Jun 21, 2018
- Intel Corporation
- Juan Eduardo Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON CHIP (COC) PACKAGE WITH INTERPOSER
- Publication number 20180041003
- Publication date Feb 8, 2018
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING UNSTABLE NITRIDES TO FORM SEMICONDUCTOR STRUCTURES
- Publication number 20110272811
- Publication date Nov 10, 2011
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using Unstable Nitrides to Form Semiconductor Structures
- Publication number 20100230817
- Publication date Sep 16, 2010
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE CHARGE ENHANCED ATOMIC LAYER DEPOSITION OF PURE METALLIC FILMS
- Publication number 20100166981
- Publication date Jul 1, 2010
- JUAN E. DOMINGUEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABLE GATE ELECTRODE WORK FUNCTION MATERIAL FOR TRANSISTOR APPLIC...
- Publication number 20100140717
- Publication date Jun 10, 2010
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INSULATOR NANOLAMINATE DEVICE FOR INTEGRATED SILICON VOLTA...
- Publication number 20100098960
- Publication date Apr 22, 2010
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE INTERCONNECT STRUCTURES
- Publication number 20100022083
- Publication date Jan 28, 2010
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION METHOD FOR HIGH-K DIELECTRIC MATERIALS
- Publication number 20090253270
- Publication date Oct 8, 2009
- Adrien R. Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND...
- Publication number 20090209777
- Publication date Aug 20, 2009
- David M. Thompson
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND...
- Publication number 20090200524
- Publication date Aug 13, 2009
- David M. Thompson
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SPUTTER DEPOSITION OF METAL ALLOY TARGETS CONTAINING A HIGH VAPOR P...
- Publication number 20090166181
- Publication date Jul 2, 2009
- Christopher J. Jezewski
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AMORPHOUS METAL-METALLOID ALLOY BARRIER LAYER FOR IC DEVICES
- Publication number 20090022958
- Publication date Jan 22, 2009
- John J. Plombon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTUBE GROWTH AND DEVICE FORMATION
- Publication number 20080311400
- Publication date Dec 18, 2008
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER PRECURSORS FOR CVD/ALD/DIGITAL CVD OF COPPER METAL FILMS
- Publication number 20080242880
- Publication date Oct 2, 2008
- Tianniu Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Novel Fluorine-Free Precursors and Methods for the Deposition of Co...
- Publication number 20080237861
- Publication date Oct 2, 2008
- Juan E. Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced ALD process for copper alloy seed layers
- Publication number 20080223287
- Publication date Sep 18, 2008
- Adrien R. Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ORGANOMETALLIC PRECURSORS FOR SEED/BARRIER PROCESSES AND METHODS TH...
- Publication number 20080194105
- Publication date Aug 14, 2008
- Juan Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Continuous ultra-thin copper film formed using a low thermal budget
- Publication number 20080182021
- Publication date Jul 31, 2008
- Harsono S. Simka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tunable gate electrode work function material for transistor applic...
- Publication number 20080157212
- Publication date Jul 3, 2008
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition process for iodine-doped ruthenium barrier layers
- Publication number 20080102632
- Publication date May 1, 2008
- Joseph H. Han
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Juan E. Dominguez

Person

Patents Grantslast 30 patents

System in package with interconnected modules

Active package substrate having anisotropic conductive layer

High density die package configuration on system boards

Active package substrate having anisotropic conductive layer

Hybrid die stacking

Surface charge enhanced atomic layer deposition of pure metallic films

Using unstable nitrides to form semiconductor structures

Tunable gate electrode work function material for transistor applic...

Noble metal barrier layers

Using unstable nitrides to form semiconductor structures

Copper precursors for CVD/ALD/digital CVD of copper metal films

Nanotube growth and device formation

Fluorine-free precursors and methods for the deposition of conforma...

Organometallic precursors for seed/barrier processes and methods th...

Using unstable nitrides to form semiconductor structures

Deposition method for high-k dielectric materials

Optical coatings

Silicon-alloy based barrier layers for integrated circuit metal int...

Tunable gate electrode work function material for transistor applic...

Composite metal films and carbon nanotube fabrication

Method of fabricating a carbon nanotube interconnect structures

Amine-free deposition of metal-nitride films

Silicon based optically degraded arc for lithographic patterning

Deposition process for iodine-doped ruthenium barrier layers

Noble metal barrier and seed layer for semiconductors

Alloyed underlayer for microelectronic interconnects

Catalytically enhanced atomic layer deposition process

Organometallic precursors for the chemical phase deposition of meta...

Patents Applicationslast 30 patents

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

ACTIVE PACKAGE SUBSTRATE HAVING ANISOTROPIC CONDUCTIVE LAYER

HIGH DENSITY DIE PACKAGE CONFIGURATION ON SYSTEM BOARDS

SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES

ELECTRONIC DEVICE PACKAGE

ACTIVE PACKAGE SUBSTRATE HAVING ANISOTROPIC CONDUCTIVE LAYER

ELECTRONIC DEVICE PACKAGE

ACTIVE PACKAGE SUBSTRATE HAVING EMBEDDED INTERPOSER

SEMICONDUCTOR CHIP PACKAGE WITH CAVITY

HYBRID DIE STACKING

CHIP ON CHIP (COC) PACKAGE WITH INTERPOSER

USING UNSTABLE NITRIDES TO FORM SEMICONDUCTOR STRUCTURES

Using Unstable Nitrides to Form Semiconductor Structures

SURFACE CHARGE ENHANCED ATOMIC LAYER DEPOSITION OF PURE METALLIC FILMS

TUNABLE GATE ELECTRODE WORK FUNCTION MATERIAL FOR TRANSISTOR APPLIC...

MAGNETIC INSULATOR NANOLAMINATE DEVICE FOR INTEGRATED SILICON VOLTA...

CARBON NANOTUBE INTERCONNECT STRUCTURES

DEPOSITION METHOD FOR HIGH-K DIELECTRIC MATERIALS

ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND...

ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND...

SPUTTER DEPOSITION OF METAL ALLOY TARGETS CONTAINING A HIGH VAPOR P...

AMORPHOUS METAL-METALLOID ALLOY BARRIER LAYER FOR IC DEVICES

NANOTUBE GROWTH AND DEVICE FORMATION

COPPER PRECURSORS FOR CVD/ALD/DIGITAL CVD OF COPPER METAL FILMS

Novel Fluorine-Free Precursors and Methods for the Deposition of Co...

Plasma enhanced ALD process for copper alloy seed layers

ORGANOMETALLIC PRECURSORS FOR SEED/BARRIER PROCESSES AND METHODS TH...

Continuous ultra-thin copper film formed using a low thermal budget

Tunable gate electrode work function material for transistor applic...

Deposition process for iodine-doped ruthenium barrier layers