Judith Marie Roldan

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,281,105
- Issue date Aug 28, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,221,503
- Issue date Apr 24, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free conductive composites for electrical interconnections
- Patent number 6,197,222
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Ravi F. Saraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion and dissolution protection of a conductive silver/polymer...
- Patent number 6,174,606
- Issue date Jan 16, 2001
- International Business Machine Corporation
- Vlasta Agnes Brusic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free interconnection for electronic devices
- Patent number 6,127,253
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Judith Marie Roldan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesion between a vapor deposited metal and an organic po...
- Patent number 6,099,939
- Issue date Aug 8, 2000
- International Business Machines Corporation
- Kashmiri L. Mittal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition containing a polymer and conductive filler and use thereof
- Patent number 6,015,509
- Issue date Jan 18, 2000
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,013,713
- Issue date Jan 11, 2000
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free interconnection for electronic devices
- Patent number 6,005,292
- Issue date Dec 21, 1999
- International Business Machines Corporation
- Judith Marie Roldan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing discharge protection or shielding
- Patent number 5,997,773
- Issue date Dec 7, 1999
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Housing for electromagnetic interference shielding
- Patent number 5,985,458
- Issue date Nov 16, 1999
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composite comprising a metal substrate and a corrosion protecting l...
- Patent number 5,922,466
- Issue date Jul 13, 1999
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for providing discharge protection or shielding
- Patent number 5,916,486
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Direct chip attach for low alpha emission interconnect system
- Patent number 5,897,336
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Guy Paul Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free conductive composites for electrical interconnections
- Patent number 5,866,044
- Issue date Feb 2, 1999
- International Business Machines
- Ravi F. Saraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free interconnection for electronic devices
- Patent number 5,854,514
- Issue date Dec 29, 1998
- International Buisness Machines Corporation
- Judith Marie Roldan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting multilayer ceramic substrate
- Patent number 5,834,405
- Issue date Nov 10, 1998
- International Business Machines Corporation
- Byung Tae Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively filled adhesives for semiconductor chip interconnection...
- Patent number 5,813,870
- Issue date Sep 29, 1998
- International Business Machines Corporation
- Michael Anthony Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising a substrate and a semiconductor devic...
- Patent number 5,776,587
- Issue date Jul 7, 1998
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Direct chip attachment (DCA) with electrically conductive adhesives
- Patent number 5,747,101
- Issue date May 5, 1998
- International Business Machines Corporation
- Richard B. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition containing a polymer and conductive filler and use thereof
- Patent number 5,700,398
- Issue date Dec 23, 1997
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fabrication of double side fully metallized plated thru-holes, in p...
- Patent number 5,545,429
- Issue date Aug 13, 1996
- International Business Machines Corporation
- Richard B. Booth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct chip attachment (DCA) with electrically conductive adhesives
- Patent number 5,543,585
- Issue date Aug 6, 1996
- International Business Machines Corporation
- Richard B. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless metal adhesion to organic dielectric material with phas...
- Patent number 5,310,580
- Issue date May 10, 1994
- International Business Machines Corporation
- Eugene J. O'Sullivan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Palladium enhanced soldering and bonding of semiconductor device co...
- Patent number 5,225,711
- Issue date Jul 6, 1993
- International Business Machines Corporation
- Chin-An Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium enhanced fluxless soldering and bonding of semiconductor...
- Patent number 5,048,744
- Issue date Sep 17, 1991
- International Business Machines Corporation
- Chin-An Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS
- Publication number 20020005247
- Publication date Jan 17, 2002
- TERESITA ORDONEZ GRAHAM
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Judith Marie Roldan

Person

Patents Grantslast 30 patents

Electrode modification using an unzippable polymer paste

Electrode modification using an unzippable polymer paste

Lead free conductive composites for electrical interconnections

Corrosion and dissolution protection of a conductive silver/polymer...

Lead-free interconnection for electronic devices

Enhanced adhesion between a vapor deposited metal and an organic po...

Composition containing a polymer and conductive filler and use thereof

Electrode modification using an unzippable polymer paste

Lead-free interconnection for electronic devices

Method for providing discharge protection or shielding

Housing for electromagnetic interference shielding

Composite comprising a metal substrate and a corrosion protecting l...

Method for providing discharge protection or shielding

Direct chip attach for low alpha emission interconnect system

Lead free conductive composites for electrical interconnections

Lead-free interconnection for electronic devices

Superconducting multilayer ceramic substrate

Selectively filled adhesives for semiconductor chip interconnection...

Electronic package comprising a substrate and a semiconductor devic...

Direct chip attachment (DCA) with electrically conductive adhesives

Composition containing a polymer and conductive filler and use thereof

Fabrication of double side fully metallized plated thru-holes, in p...

Direct chip attachment (DCA) with electrically conductive adhesives

Electroless metal adhesion to organic dielectric material with phas...

Palladium enhanced soldering and bonding of semiconductor device co...

Palladium enhanced fluxless soldering and bonding of semiconductor...

Patents Applicationslast 30 patents

ELECTRICALLY CONDUCTIVE PASTE MATERIALS AND APPLICATIONS