Judith Marie Rubino

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduced electromigration and stressed induced migration of copper w...
- Patent number 7,468,320
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,407,605
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ferromagnetic liner for conductive lines of magnetic memory cells
- Patent number 7,259,025
- Issue date Aug 21, 2007
- Infineon Technologies AG
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable CoWP metal cap process for copper interconnects
- Patent number 7,253,106
- Issue date Aug 7, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplated CoWP composite structures as copper barrier layers
- Patent number 7,217,655
- Issue date May 15, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated CoWP composite structures as copper barrier layers
- Patent number 7,193,323
- Issue date Mar 20, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned corrosion stop for copper C4 and wirebond
- Patent number 7,081,680
- Issue date Jul 25, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 7,064,064
- Issue date Jun 20, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper recess process with application to selective capping and ele...
- Patent number 6,975,032
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned corrosion stop for copper C4 and wirebond
- Patent number 6,779,711
- Issue date Aug 24, 2004
- International Business Machines Corporation
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming an antenna and a radio frequency transponder
- Patent number 6,662,430
- Issue date Dec 16, 2003
- International Business Machines Corporation
- Michael John Brady
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for testing chips on flat solder bumps
- Patent number 6,656,750
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming Co-W-P-Au films
- Patent number 6,646,345
- Issue date Nov 11, 2003
- International Business Machines Corporation
- Carlos Juan Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process to increase reliability CuBEOL structures
- Patent number 6,503,834
- Issue date Jan 7, 2003
- International Business Machines Corp.
- Xiaomeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing self-aligned corrosion stop for copper C4...
- Patent number 6,457,234
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced electromigration and stressed induced migration of Cu wires...
- Patent number 6,342,733
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced integrated circuits
- Patent number 6,339,024
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a conductive pad for electrical connection and...
- Patent number 6,335,104
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Carlos J. Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming Co-W-P-Au films
- Patent number 6,323,128
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Carlos Juan Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Radio frequency (RF) transponder (Tag) with composite antenna
- Patent number 6,271,793
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Michael John Brady
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
RFID transponders with paste antennas and flip-chip attachment
- Patent number 6,259,408
- Issue date Jul 10, 2001
- Intermec IP Corp.
- Michael John Brady
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...
- Publication number 20090142924
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ALLOY LAYER OVER CONDUCTIVE REGION OF TRANSISTOR DEVICE OF DI...
- Publication number 20070284654
- Publication date Dec 13, 2007
- Judith M. Rubino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20070215842
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ferromagnetic liner for conductive lines of magnetic memory cells
- Publication number 20070105241
- Publication date May 10, 2007
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
- Publication number 20060134911
- Publication date Jun 22, 2006
- Darryl D. Restaino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ferromagnetic liner for conductive lines of magnetic memory cells
- Publication number 20060022286
- Publication date Feb 2, 2006
- Rainer Leuschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced electromigration and stressed induced migration of copper w...
- Publication number 20050266673
- Publication date Dec 1, 2005
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20050158985
- Publication date Jul 21, 2005
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated CoWP composite structures as copper barrier layers
- Publication number 20050127518
- Publication date Jun 16, 2005
- International Business Machines Corporation
- Cyril Cabral
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated CoWP composite structures as copper barrier layers
- Publication number 20050104216
- Publication date May 19, 2005
- International Business Machines Corporation
- Cyril Cabral
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self-aligned corrosion stop for copper C4 and wirebond
- Publication number 20040234679
- Publication date Nov 25, 2004
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper recess process with application to selective capping and ele...
- Publication number 20040113279
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for testing chips on flat solder bumps
- Publication number 20040087046
- Publication date May 6, 2004
- International Business Machines Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-aligned corrosion stop for copper C4 and wirebond
- Publication number 20030072928
- Publication date Apr 17, 2003
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming Co-W-P-Au films
- Publication number 20020123220
- Publication date Sep 5, 2002
- International Business Machines Corporation
- Carlos Juan Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduced electromigration and stressed induced migration of Cu wires...
- Publication number 20020098681
- Publication date Jul 25, 2002
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless metal liner formation methods
- Publication number 20020081842
- Publication date Jun 27, 2002
- Carlos J. Sambucetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming an antenna and a radio frequency transponder
- Publication number 20010030628
- Publication date Oct 18, 2001
- International Business Machines Corporation
- Michael John Brady
- G06 - COMPUTING CALCULATING COUNTING

Judith Marie Rubino

Person

Patents Grantslast 30 patents

Reduced electromigration and stressed induced migration of copper w...

Manufacturable CoWP metal cap process for copper interconnects

Ferromagnetic liner for conductive lines of magnetic memory cells

Manufacturable CoWP metal cap process for copper interconnects

Electroplated CoWP composite structures as copper barrier layers

Electroplated CoWP composite structures as copper barrier layers

Self-aligned corrosion stop for copper C4 and wirebond

Copper recess process with application to selective capping and ele...

Copper recess process with application to selective capping and ele...

Self-aligned corrosion stop for copper C4 and wirebond

Method for forming an antenna and a radio frequency transponder

Method for testing chips on flat solder bumps

Method for forming Co-W-P-Au films

Process to increase reliability CuBEOL structures

Process for manufacturing self-aligned corrosion stop for copper C4...

Reduced electromigration and stressed induced migration of Cu wires...

Reinforced integrated circuits

Method for preparing a conductive pad for electrical connection and...

Method for forming Co-W-P-Au films

Radio frequency (RF) transponder (Tag) with composite antenna

RFID transponders with paste antennas and flip-chip attachment

Patents Applicationslast 30 patents

REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...

METAL ALLOY LAYER OVER CONDUCTIVE REGION OF TRANSISTOR DEVICE OF DI...

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Ferromagnetic liner for conductive lines of magnetic memory cells

MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS

Ferromagnetic liner for conductive lines of magnetic memory cells

Reduced electromigration and stressed induced migration of copper w...

Copper recess process with application to selective capping and ele...

Electroplated CoWP composite structures as copper barrier layers

Electroplated CoWP composite structures as copper barrier layers

Self-aligned corrosion stop for copper C4 and wirebond

Copper recess process with application to selective capping and ele...

Method for testing chips on flat solder bumps

Self-aligned corrosion stop for copper C4 and wirebond

Method for forming Co-W-P-Au films

Reduced electromigration and stressed induced migration of Cu wires...

Electroless metal liner formation methods

Method for forming an antenna and a radio frequency transponder