Juergen Schredl

Person

Mering, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Chip carrier structure, chip package and method of manufacturing th...
- Patent number 9,824,958
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral element isolation device
- Patent number 9,786,584
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing with rear-side structuring
- Patent number 9,627,292
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having multiple lead frames and methods of f...
- Patent number 9,449,902
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a chip arrangement
- Patent number 9,412,626
- Issue date Aug 9, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,397,018
- Issue date Jul 19, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 9,362,240
- Issue date Jun 7, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement, a method for manufacturing a chip arrangement, in...
- Patent number 9,362,193
- Issue date Jun 7, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor arrangement and package having the same
- Patent number 9,263,440
- Issue date Feb 16, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,230,880
- Issue date Jan 5, 2016
- Infineon Technolgies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements and methods for manufacturing a chip arrangement
- Patent number 9,184,066
- Issue date Nov 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device having a heat sink
- Patent number 9,147,631
- Issue date Sep 29, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module, an insulation material and a method for fabricating a...
- Patent number 9,117,786
- Issue date Aug 25, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power transistor arrangement and method for manufacturing the same
- Patent number 9,099,441
- Issue date Aug 4, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having multiple lead frames and methods of f...
- Patent number 8,896,106
- Issue date Nov 25, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package arrangement and a method of manufacturing a package arrange...
- Patent number 8,853,849
- Issue date Oct 7, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of manufacturing thereof
- Patent number 8,698,293
- Issue date Apr 15, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module for a switched-mode power supply and method fo...
- Patent number 7,923,827
- Issue date Apr 12, 2011
- Infineon Technologies AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,821,141
- Issue date Oct 26, 2010
- Infineon Technologies AG
- Wae Chet Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for electronic device
- Patent number D609191
- Issue date Feb 2, 2010
- Infineon Technologies AG
- Mario Feldvoss
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor component having a semiconductor die and a leadframe
- Patent number 7,629,676
- Issue date Dec 8, 2009
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Component Having Inner and Outer Semiconductor Compon...
- Publication number 20160111346
- Publication date Apr 21, 2016
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20160064255
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method for Fabricating an Electronic Device
- Publication number 20150214133
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device
- Publication number 20150162287
- Publication date Jun 11, 2015
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having Multiple Lead Frames and Methods of F...
- Publication number 20150060878
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Power Device Having a Heat Sink
- Publication number 20140312360
- Publication date Oct 23, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND CHIP ARRANGEMENT
- Publication number 20140306331
- Publication date Oct 16, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER STRUCTURE, CHIP PACKAGE AND METHOD OF MANUFACTURING TH...
- Publication number 20140252577
- Publication date Sep 11, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARRANGEMENT AND A METHOD OF MANUFACTURING A PACKAGE ARRANGE...
- Publication number 20140252537
- Publication date Sep 11, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND PACKAGE HAVING THE SAME
- Publication number 20140225124
- Publication date Aug 14, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217596
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...
- Publication number 20140197552
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Module, an Insulation Material and a Method for Fabricating a...
- Publication number 20140151856
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140138803
- Publication date May 22, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Housing with Rear-Side Structuring
- Publication number 20140084449
- Publication date Mar 27, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL ELEMENT ISOLATION DEVICE
- Publication number 20140063766
- Publication date Mar 6, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having Multiple Lead Frames and Methods of F...
- Publication number 20140008702
- Publication date Jan 9, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package and Method of Manufacturing Thereof
- Publication number 20130313712
- Publication date Nov 28, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabrication Method
- Publication number 20130154123
- Publication date Jun 20, 2013
- INFINEON TECHNOLOGIES AG
- Yong Chern Poh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20090212417
- Publication date Aug 27, 2009
- Wae Chet Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module for a Switched-Mode Power Supply and Method fo...
- Publication number 20090001535
- Publication date Jan 1, 2009
- INFINEON TECHNOLOGIES AG
- Yang Hong Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component having a semiconductor die and a leadframe
- Publication number 20080061413
- Publication date Mar 13, 2008
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Juergen Schredl

Person

Patents Grantslast 30 patents

Chip carrier structure, chip package and method of manufacturing th...

Lateral element isolation device

Semiconductor housing with rear-side structuring

Semiconductor packages having multiple lead frames and methods of f...

Method for manufacturing a chip arrangement

Chip arrangement, a method for manufacturing a chip arrangement, in...

Electronic device

Chip arrangement, a method for manufacturing a chip arrangement, in...

Power transistor arrangement and package having the same

Electronic device and method for fabricating an electronic device

Chip arrangements and methods for manufacturing a chip arrangement

Semiconductor power device having a heat sink

Package-in-packages and methods of formation thereof

Chip module, an insulation material and a method for fabricating a...

Power transistor arrangement and method for manufacturing the same

Semiconductor device using diffusion soldering

Semiconductor packages having multiple lead frames and methods of f...

Package arrangement and a method of manufacturing a package arrange...

Multi-chip package and method of manufacturing thereof

Power semiconductor chip having two metal layers on one face

Semiconductor module for a switched-mode power supply and method fo...

Semiconductor device

Package for electronic device

Semiconductor component having a semiconductor die and a leadframe

Patents Applicationslast 30 patents

Semiconductor Component Having Inner and Outer Semiconductor Compon...

METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

Electronic Device and Method for Fabricating an Electronic Device

Electronic Device

Semiconductor Packages Having Multiple Lead Frames and Methods of F...

Semiconductor Power Device Having a Heat Sink

CHIP AND CHIP ARRANGEMENT

CHIP CARRIER STRUCTURE, CHIP PACKAGE AND METHOD OF MANUFACTURING TH...

PACKAGE ARRANGEMENT AND A METHOD OF MANUFACTURING A PACKAGE ARRANGE...

POWER TRANSISTOR ARRANGEMENT AND PACKAGE HAVING THE SAME

POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

CHIP ARRANGEMENT, A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT, IN...

Chip Module, an Insulation Material and a Method for Fabricating a...

CHIP ARRANGEMENTS AND METHODS FOR MANUFACTURING A CHIP ARRANGEMENT

Semiconductor Housing with Rear-Side Structuring

LATERAL ELEMENT ISOLATION DEVICE

Semiconductor Packages Having Multiple Lead Frames and Methods of F...

Package-In-Packages and Methods of Formation Thereof

Multi-Chip Package and Method of Manufacturing Thereof

Semiconductor Device Using Diffusion Soldering

Semiconductor Device and Fabrication Method

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device

Semiconductor Module for a Switched-Mode Power Supply and Method fo...

Semiconductor component having a semiconductor die and a leadframe