Jui-Hsiang Hung

Person

Chunghua, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Filled through-silicon via with conductive composite material
- Patent number 8,456,017
- Issue date Jun 4, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with short-prevented l...
- Patent number 7,410,835
- Issue date Aug 12, 2008
- Siliconware Precision Industries Co., Ltd.
- Jui-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame-based semiconductor package and fabrication method thereof
- Patent number 7,008,826
- Issue date Mar 7, 2006
- Siliconware Precision Industries, Co., Ltd.
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short-prevented lead frame and method for fabricating semiconductor...
- Patent number 6,979,886
- Issue date Dec 27, 2005
- Siliconware Precision Industries Co., Ltd.
- Jui-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with die pad having recessed portion
- Patent number 6,809,408
- Issue date Oct 26, 2004
- Siliconware Precision Industries Co., Ltd.
- Chen Shih Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame-based semiconductor package and fabrication method thereof
- Patent number 6,806,565
- Issue date Oct 19, 2004
- Siliconware Precision Industries Co., Ltd.
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 6,680,531
- Issue date Jan 20, 2004
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided chip package without a die pad
- Patent number 6,437,447
- Issue date Aug 20, 2002
- Siliconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF
- Publication number 20120273939
- Publication date Nov 1, 2012
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with short-prevented l...
- Publication number 20060088956
- Publication date Apr 27, 2006
- Siliconware Precision Industries Co., Ltd.
- Jui-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame-based semiconductor package and fabrication method thereof
- Publication number 20050029639
- Publication date Feb 10, 2005
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based non-leaded semiconductor package and method of fabr...
- Publication number 20040217450
- Publication date Nov 4, 2004
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame-based semiconductor package and fabrication method thereof
- Publication number 20040004275
- Publication date Jan 8, 2004
- Siliconware Precision Industries Co., Ltd.
- Holman Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with die pad having recessed portion
- Publication number 20030141575
- Publication date Jul 31, 2003
- Siliconware Precision Industries Co., Ltd.
- Chen Shih Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Short-prevented lead frame and method for fabricating semiconductor...
- Publication number 20030141577
- Publication date Jul 31, 2003
- Siliconware Precision Industries Co., Ltd.
- Jui-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip semiconductor package
- Publication number 20030047754
- Publication date Mar 13, 2003
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Jui-Hsiang Hung

Person

Patents Grantslast 30 patents

Filled through-silicon via with conductive composite material

Method for fabricating semiconductor package with short-prevented l...

Lead-frame-based semiconductor package and fabrication method thereof

Short-prevented lead frame and method for fabricating semiconductor...

Semiconductor package with die pad having recessed portion

Lead-frame-based semiconductor package and fabrication method thereof

Multi-chip semiconductor package

Dual-sided chip package without a die pad

Patents Applicationslast 30 patents

FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF

Method for fabricating semiconductor package with short-prevented l...

Lead-frame-based semiconductor package and fabrication method thereof

Leadframe-based non-leaded semiconductor package and method of fabr...

Lead-frame-based semiconductor package and fabrication method thereof

Semiconductor package with die pad having recessed portion

Short-prevented lead frame and method for fabricating semiconductor...

Multi-chip semiconductor package