Jui-Hung Weng

Person

MiaoLi County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating an image sensor package
- Patent number 9,484,385
- Issue date Nov 1, 2016
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 9,231,012
- Issue date Jan 5, 2016
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-vertical LED packaging structure
- Patent number 9,136,442
- Issue date Sep 15, 2015
- TSMC Solid State Lighting Ltd.
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing devices and methods for fabricating the same
- Patent number 8,153,458
- Issue date Apr 10, 2012
- Visera Technologies Company Limited
- Jui-Ping Weng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic assembly for image sensor device
- Patent number 7,994,598
- Issue date Aug 9, 2011
- Visera Technologies Company Limited
- Jui-Ping Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light-emitting diode device and method for fabricating the same
- Patent number 7,932,529
- Issue date Apr 26, 2011
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode device and method for fabricating the same
- Patent number 7,928,458
- Issue date Apr 19, 2011
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode device and method for fabricating the same
- Patent number 7,928,655
- Issue date Apr 19, 2011
- Visera Technologies Company Limited
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and fabrication method thereof
- Patent number 7,898,070
- Issue date Mar 1, 2011
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly for image sensor device
- Patent number 7,829,966
- Issue date Nov 9, 2010
- VisEra Technologies Company Limited
- Jui-Ping Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package and fabrication method thereof
- Patent number 7,595,220
- Issue date Sep 29, 2009
- Visera Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing devices and methods for fabricating the same
- Patent number 7,528,420
- Issue date May 5, 2009
- Visera Technologies Company Limited
- Jui-Peng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode package and process of making the same
- Patent number 7,521,724
- Issue date Apr 21, 2009
- Industrial Technology Research Institute
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS differential actuated nano probe and method for fabrication
- Patent number 7,176,457
- Issue date Feb 13, 2007
- Industrial Technology Research Institute
- Shih-Yi Wen
- G01 - MEASURING TESTING
Information Patent Grant
MEMS optical switch with self-assembly structure
- Patent number 7,133,185
- Issue date Nov 7, 2006
- Industrial Technology Research Institute
- Shih-Yi Wen
- G02 - OPTICS
Information Patent Grant
MEMS differential actuated nano probe and method for fabrication
- Patent number 6,995,368
- Issue date Feb 7, 2006
- Industrial Technology Research Institute
- Shih-Yi Wen
- G01 - MEASURING TESTING
Information Patent Grant
Electrostatic movable micro mirror chip
- Patent number 6,950,224
- Issue date Sep 27, 2005
- Industrial Technology Research Institute
- Bing-Ru Chen
- G02 - OPTICS
Information Patent Grant
Micro electromechanical differential actuator
- Patent number 6,771,158
- Issue date Aug 3, 2004
- Industrial Technology Research Institute
- Hsiao-Wen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING AN IMAGE SENSOR PACKAGE
- Publication number 20160079304
- Publication date Mar 17, 2016
- VISERA TECHNOLOGIES COMPANY LIMITED
- Jui-Ping WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Vertical LED Packaging Structure
- Publication number 20140209930
- Publication date Jul 31, 2014
- TSMC Solid State Lighting Ltd.
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE
- Publication number 20110018082
- Publication date Jan 27, 2011
- Jui-Ping Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20100237379
- Publication date Sep 23, 2010
- Wu-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100117530
- Publication date May 13, 2010
- Tzu-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100051982
- Publication date Mar 4, 2010
- Tzu-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100012957
- Publication date Jan 21, 2010
- VisEra Technologies Company Limited
- Tzu-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20090309178
- Publication date Dec 17, 2009
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20090181490
- Publication date Jul 16, 2009
- VISERA TECHNOLOGIES COMPANY LIMITED
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE
- Publication number 20090134483
- Publication date May 28, 2009
- Jui-Ping Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SUSPEND AND RESUME MECHANISMS ON A FLASH MEMORY
- Publication number 20090064129
- Publication date Mar 5, 2009
- MEDIATEK INC.
- Wen-Chih Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Image sensor package and fabrication method thereof
- Publication number 20090032893
- Publication date Feb 5, 2009
- VisEra Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package and fabrication method thereof
- Publication number 20090001495
- Publication date Jan 1, 2009
- VisEra Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20080290438
- Publication date Nov 27, 2008
- VISERA TECHNOLOGIES COMPANY LIMITED
- Jui-Peng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass dam structures for imaging devices chip scale package
- Publication number 20080191334
- Publication date Aug 14, 2008
- VisEra Technologies Company Limited
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic device package and packaging method thereof
- Publication number 20080169480
- Publication date Jul 17, 2008
- VisEra Technologies Company Limited
- Jui-Ping Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting diode package and process of making the same
- Publication number 20060138436
- Publication date Jun 29, 2006
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS differential actuated nano probe and method for fabrication
- Publication number 20060016986
- Publication date Jan 26, 2006
- INDUSTRIAL TECHNOLOGY RESEARCH INSTUTITE
- Shih-Yi Wen
- G01 - MEASURING TESTING
Information Patent Application
MEMS optical switch with self-assembly structure
- Publication number 20050286110
- Publication date Dec 29, 2005
- Industrial Technology Research Institute
- Shih-Yi Wen
- G02 - OPTICS
Information Patent Application
MEMS differential actuated nano probe and method for fabrication
- Publication number 20050082474
- Publication date Apr 21, 2005
- Shih-Yi Wen
- G01 - MEASURING TESTING
Information Patent Application
Micro electromechanical differential actuator
- Publication number 20040027225
- Publication date Feb 12, 2004
- Hsiao-Wen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jui-Hung Weng

Person

Patents Grantslast 30 patents

Method for fabricating an image sensor package

Image sensor package

Multi-vertical LED packaging structure

Image sensing devices and methods for fabricating the same

Electronic assembly for image sensor device

Light-emitting diode device and method for fabricating the same

Light-emitting diode device and method for fabricating the same

Light-emitting diode device and method for fabricating the same

Image sensor package and fabrication method thereof

Electronic assembly for image sensor device

Image sensor package and fabrication method thereof

Image sensing devices and methods for fabricating the same

Light emitting diode package and process of making the same

MEMS differential actuated nano probe and method for fabrication

MEMS optical switch with self-assembly structure

MEMS differential actuated nano probe and method for fabrication

Electrostatic movable micro mirror chip

Micro electromechanical differential actuator

Patents Applicationslast 30 patents

METHOD FOR FABRICATING AN IMAGE SENSOR PACKAGE

Multi-Vertical LED Packaging Structure

ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE

LIGHT EMITTING DEVICE

LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME

LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME

LIGHT-EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME

IMAGE SENSOR PACKAGE AND FABRICATION METHOD THEREOF

IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME

ELECTRONIC ASSEMBLY FOR IMAGE SENSOR DEVICE

SUSPEND AND RESUME MECHANISMS ON A FLASH MEMORY

Image sensor package and fabrication method thereof

Image sensor package and fabrication method thereof

IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME

Glass dam structures for imaging devices chip scale package

Optoelectronic device package and packaging method thereof

Light emitting diode package and process of making the same

MEMS differential actuated nano probe and method for fabrication

MEMS optical switch with self-assembly structure

MEMS differential actuated nano probe and method for fabrication

Micro electromechanical differential actuator