Jui Yi Chiu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming image sensor integrated circuit packages
- Patent number 10,418,395
- Issue date Sep 17, 2019
- Semiconductor Components Industries, LLC
- Jui Yi Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming image sensor integrated circuit packages
- Patent number 9,634,059
- Issue date Apr 25, 2017
- Semiconductor Components Industries, LLC
- Jui Yi Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...
- Publication number 20240322417
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
- Publication number 20240321507
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...
- Publication number 20240258363
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE
- Publication number 20240258995
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...
- Publication number 20240204039
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
- Publication number 20240105760
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...
- Publication number 20240038439
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20190363121
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Jui Yi Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20170186792
- Publication date Jun 29, 2017
- Semiconductor Components Industries, LLC
- Jui Yi Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20160190204
- Publication date Jun 30, 2016
- Semiconductor Components Industries, LLC
- Jui Yi Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Jui Yi Chiu

Person

Patents Grantslast 30 patents

Methods of forming image sensor integrated circuit packages

Methods of forming image sensor integrated circuit packages

Patents Applicationslast 30 patents

RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...

THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES

INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...

COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE

DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...

INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD

INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...

METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES

METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES

METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES