Juik Lee

Person

Anyang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal pad, semiconductor chip including the same and method of ma...
- Patent number 12,159,859
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including TSV and multiple insulating layers
- Patent number 12,040,231
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 11,769,742
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,616,018
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip formed using a cover insulation layer and semico...
- Patent number 11,362,053
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a thick metal layer
- Patent number 11,133,253
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,600,791
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Dong-Wan Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices with alignment keys
- Patent number 10,332,842
- Issue date Jun 25, 2019
- Samsung Electronics Co., Ltd.
- Kiseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with alignment keys
- Patent number 10,026,694
- Issue date Jul 17, 2018
- Samsung Electronics Co., Ltd.
- Kiseok Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...
- Publication number 20250054916
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230077803
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...
- Publication number 20230078980
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230030117
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220278061
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD FOR MANUFACTURING THE...
- Publication number 20220084885
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Junghoon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
- Publication number 20210375759
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210134745
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Eunyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER
- Publication number 20210104462
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20190206877
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Dong-Wan KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS
- Publication number 20180331046
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- KISEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS
- Publication number 20180096947
- Publication date Apr 5, 2018
- Samsung Electronics Co., Ltd.
- KISEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal pad, semiconductor chip including the same and method of ma...

Semiconductor device including TSV and multiple insulating layers

Semiconductor chip and semiconductor package including the same

Semiconductor devices including a thick metal layer

Semiconductor chip formed using a cover insulation layer and semico...

Semiconductor devices including a thick metal layer

Semiconductor memory device

Semiconductor devices with alignment keys

Semiconductor devices with alignment keys

Patents Applicationslast 30 patents

THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...

SEMICONDUCTOR DEVICES

THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS

SEMICONDUCTOR DEVICES WITH ALIGNMENT KEYS