Juil Choi

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,176,313
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,541
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,021,034
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Solji Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,984,420
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,978,688
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,783
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,476,176
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038081
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014958
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240312923
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266309
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240213223
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Jaemok JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096851
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Unbyoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE
- Publication number 20240088094
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Hyojin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079394
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Juil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071899
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuho KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230361046
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Juil Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER
- Publication number 20230111136
- Publication date Apr 13, 2023
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102285
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230060115
- Publication date Feb 23, 2023
- Samsung Electronics Co., Ltd.
- Sechul PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230042063
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- SEONGHOON BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230038603
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Juil Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230011778
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220059466
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER
- Publication number 20210335688
- Publication date Oct 28, 2021
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305189
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210035878
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device

Semiconductor device having via protective layer

Semiconductor device

Semiconductor device having via protective layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND SYSTEM INCLUDING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE