Julien Cuzzocrea

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 9,455,239
- Issue date Sep 27, 2016
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 9,093,505
- Issue date Jul 28, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip and fabrication method
- Patent number 8,980,738
- Issue date Mar 17, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for formation of an electrically conducting through via
- Patent number 8,673,740
- Issue date Mar 18, 2014
- STMicroelectronics (Crolles 2) SAS
- Julien Cuzzocrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating integrated-circuit chips
- Patent number 8,518,802
- Issue date Aug 27, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating integrated-circuit chips
- Patent number 8,466,038
- Issue date Jun 18, 2013
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND ITS METHOD OF FABRICATION
- Publication number 20240162259
- Publication date May 16, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20230060870
- Publication date Mar 2, 2023
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20150287689
- Publication date Oct 8, 2015
- STMicroelectronics (Crolles 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMATION OF AN ELECTRICALLY CONDUCTING THROUGH VIA
- Publication number 20130084687
- Publication date Apr 4, 2013
- STMicroelectronics (Crolles 2) SAS
- Julien CUZZOCREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20120171877
- Publication date Jul 5, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS
- Publication number 20120153425
- Publication date Jun 21, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS
- Publication number 20120156859
- Publication date Jun 21, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD
- Publication number 20120146226
- Publication date Jun 14, 2012
- STMICROELECTRONICS (CROLLES 2) SAS
- Laurent-Luc Chapelon
- H01 - BASIC ELECTRIC ELEMENTS

Julien Cuzzocrea

Person

Patents Grantslast 30 patents

Integrated circuit chip and fabrication method

Integrated circuit chip and fabrication method

Integrated circuit chip and fabrication method

Method for formation of an electrically conducting through via

Process for fabricating integrated-circuit chips

Process for fabricating integrated-circuit chips

Patents Applicationslast 30 patents

CHIP PACKAGE AND ITS METHOD OF FABRICATION

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

METHOD FOR FORMATION OF AN ELECTRICALLY CONDUCTING THROUGH VIA

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD

PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS

PROCESS FOR FABRICATING INTEGRATED-CIRCUIT CHIPS

INTEGRATED CIRCUIT CHIP AND FABRICATION METHOD