Julien Sylvestre

Person

Chambly, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 10,134,704
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,735,125
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 9,287,230
- Issue date Mar 15, 2016
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression for semiconductor chip assembly
- Patent number 8,932,909
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill adhesion measurements at a microscopic scale
- Patent number 8,796,049
- Issue date Aug 5, 2014
- International Business Machines Corporation
- Maxime Cadotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization of metallurgical properties of a solder joint
- Patent number 8,197,612
- Issue date Jun 12, 2012
- International Business Machines Corporation
- James A Busby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary structure to reduce stress and warpage in a flip chip org...
- Patent number 7,538,432
- Issue date May 26, 2009
- International Business Machines Corporation
- David Danovitch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for measuring thin layers in solid state devices
- Patent number 7,512,518
- Issue date Mar 31, 2009
- International Business Machines Corporation
- Alexandre Blander
- G01 - MEASURING TESTING
Information Patent Grant
Structure and method for stress reduction in flip chip microelectro...
- Patent number 7,498,198
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize the manufacturing of interconnects in microelect...
- Patent number 7,484,190
- Issue date Jan 27, 2009
- International Business Machines Corporation
- Eric Duchesne
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for determining the impact of layer thicknesses on laminate...
- Patent number 7,482,180
- Issue date Jan 27, 2009
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary structure to reduce stress and warpage in a flip chip org...
- Patent number 7,473,618
- Issue date Jan 6, 2009
- International Business Machines Corporation
- David Danovitch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR ACOUSTICALLY SCANNING A SAMPLE
- Publication number 20180172644
- Publication date Jun 21, 2018
- SOCPRA - SCIENCES ET GENIE S.E.C.
- Julien Sylvestre
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20170309586
- Publication date Oct 26, 2017
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20160093585
- Publication date Mar 31, 2016
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20160049345
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20150255312
- Publication date Sep 10, 2015
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A SEMICONDUCTOR DEVICE AND A SUBSTRATE BASED ON OSCILLATI...
- Publication number 20150156889
- Publication date Jun 4, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20150123271
- Publication date May 7, 2015
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY
- Publication number 20140131855
- Publication date May 15, 2014
- International Business Machines Corporation
- Julien Sylvestre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL ADHESION MEASUREMENTS AT A MICROSCOPIC SCALE
- Publication number 20140030827
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Maxime CADOTTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
Methods and Systems Involving Soldering
- Publication number 20120205424
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS TO MINIMIZE STRESS DURING REFLOW PROCESS
- Publication number 20090298206
- Publication date Dec 3, 2009
- International Business Machines
- Eric Duchesne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT
- Publication number 20090266447
- Publication date Oct 29, 2009
- International Business Machines Corporation
- JAMES A. BUSBY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...
- Publication number 20080265435
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CA...
- Publication number 20080230901
- Publication date Sep 25, 2008
- International Business Machines Corporation
- Eric Duchesne
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
NON-CONTACT THERMAL IMAGING SYSTEM FOR HETEROGENEOUS COMPONENTS
- Publication number 20080224030
- Publication date Sep 18, 2008
- International Business Machines Corporation
- Julien Sylvestre
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MEASURING THIN LAYERS IN SOLID STATE DEVICES
- Publication number 20080021673
- Publication date Jan 24, 2008
- Alexandre Blander
- G01 - MEASURING TESTING

Julien Sylvestre

Person

Patents Grantslast 30 patents

Thermocompression for semiconductor chip assembly

Thermocompression for semiconductor chip assembly

Low-stress dual underfill packaging

Low-stress dual underfill packaging

Thermocompression for semiconductor chip assembly

Methods and systems involving soldering

Thermocompression for semiconductor chip assembly

Additives for grain fragmentation in Pb-free Sn-based solder

Underfill adhesion measurements at a microscopic scale

Additives for grain fragmentation in Pb-free Sn-based solder

Optimization of metallurgical properties of a solder joint

Temporary structure to reduce stress and warpage in a flip chip org...

Method for measuring thin layers in solid state devices

Structure and method for stress reduction in flip chip microelectro...

Method to optimize the manufacturing of interconnects in microelect...

Method for determining the impact of layer thicknesses on laminate...

Temporary structure to reduce stress and warpage in a flip chip org...

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR ACOUSTICALLY SCANNING A SAMPLE

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

LOW-STRESS DUAL UNDERFILL PACKAGING

LOW-STRESS DUAL UNDERFILL PACKAGING

SOLDERING A SEMICONDUCTOR DEVICE AND A SUBSTRATE BASED ON OSCILLATI...

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

THERMOCOMPRESSION FOR SEMICONDUCTOR CHIP ASSEMBLY

UNDERFILL ADHESION MEASUREMENTS AT A MICROSCOPIC SCALE

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

Methods and Systems Involving Soldering

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

METHOD AND APPARATUS TO MINIMIZE STRESS DURING REFLOW PROCESS

OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT

STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CA...

NON-CONTACT THERMAL IMAGING SYSTEM FOR HETEROGENEOUS COMPONENTS

METHOD FOR MEASURING THIN LAYERS IN SOLID STATE DEVICES