JULIUS A. KOVATS

Person

MANITOU, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 12,205,910
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposers bonded to each other
- Patent number 12,040,282
- Issue date Jul 16, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package module including a bonding system
- Patent number 11,935,824
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 11,682,641
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable passive components
- Patent number 8,822,270
- Issue date Sep 2, 2014
- Atmel Corporation
- Julius Andrew Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal leadframe package with secure feature
- Patent number 8,022,516
- Issue date Sep 20, 2011
- Atmel Corporation
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal interconnect die
- Patent number 7,271,031
- Issue date Sep 18, 2007
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal interconnect die
- Patent number 7,078,792
- Issue date Jul 18, 2006
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile carrier for non-wafer form device testing
- Patent number 6,972,486
- Issue date Dec 6, 2005
- Atmel Corporation
- Ken M. Lam
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating metal redistribution layer having solderable...
- Patent number 6,762,117
- Issue date Jul 13, 2004
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal redistribution layer having solderable pads and wire bondable...
- Patent number 6,577,008
- Issue date Jun 10, 2003
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal redistribution layer having solderable pads and wire bondable...
- Patent number 6,511,901
- Issue date Jan 28, 2003
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-die integrated circuit package
- Patent number 6,376,914
- Issue date Apr 23, 2002
- Atmel Corporation
- Julius A. Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless array package
- Patent number 6,177,722
- Issue date Jan 23, 2001
- Atmel Corporation
- Julius A. Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for constructing a leadless array package
- Patent number 6,004,833
- Issue date Dec 21, 1999
- Atmel Corporation
- Julius A. Kovats
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE
- Publication number 20250054912
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Julius Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...
- Publication number 20240282723
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...
- Publication number 20240282740
- Publication date Aug 22, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20230260938
- Publication date Aug 17, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSERS BONDED TO EACH OTHER
- Publication number 20230109629
- Publication date Apr 6, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM
- Publication number 20230099856
- Publication date Mar 30, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20220052001
- Publication date Feb 17, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE PASSIVE COMPONENTS
- Publication number 20140021582
- Publication date Jan 23, 2014
- ATMEL CORPORATION
- Julius Andrew Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Leadframe Package with Secure Feature
- Publication number 20100038760
- Publication date Feb 18, 2010
- ATMEL CORPORATION
- Ken Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE
- Publication number 20080036098
- Publication date Feb 14, 2008
- ATMEL CORPORATION
- Julius A. Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal interconnect die
- Publication number 20060216866
- Publication date Sep 28, 2006
- Atmel Corporation
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal interconnect die
- Publication number 20050253278
- Publication date Nov 17, 2005
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile carrier for non-wafer form device testing
- Publication number 20050060115
- Publication date Mar 17, 2005
- Ken M. Lam
- G01 - MEASURING TESTING
Information Patent Application
Metal redistribution layer having solderable pads and wire bondable...
- Publication number 20030119297
- Publication date Jun 26, 2003
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal redistribution layer having solderable pads and wire bondable...
- Publication number 20020025585
- Publication date Feb 28, 2002
- Ken M. Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-DIE INTEGRATED CIRCUIT PACKAGE
- Publication number 20010003375
- Publication date Jun 14, 2001
- JULIUS A. KOVATS
- H01 - BASIC ELECTRIC ELEMENTS

JULIUS A. KOVATS

Person

Patents Grantslast 30 patents

Integrated circuit bond pad with multi-material toothed structure

Electronic device including interposers bonded to each other

Integrated circuit package module including a bonding system

Integrated circuit bond pad with multi-material toothed structure

Configurable passive components

Metal leadframe package with secure feature

Universal interconnect die

Universal interconnect die

Low profile carrier for non-wafer form device testing

Method of fabricating metal redistribution layer having solderable...

Metal redistribution layer having solderable pads and wire bondable...

Metal redistribution layer having solderable pads and wire bondable...

Dual-die integrated circuit package

Leadless array package

Method for constructing a leadless array package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING AN INDUCTIVE DEVICE FORME...

INTEGRATED CIRCUIT (IC) PACKAGE INCLUDING A CAPACITOR FORMED IN A C...

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

ELECTRONIC DEVICE INCLUDING INTERPOSERS BONDED TO EACH OTHER

INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

CONFIGURABLE PASSIVE COMPONENTS

Metal Leadframe Package with Secure Feature

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Universal interconnect die

Universal interconnect die

Low profile carrier for non-wafer form device testing

Metal redistribution layer having solderable pads and wire bondable...

Metal redistribution layer having solderable pads and wire bondable...

DUAL-DIE INTEGRATED CIRCUIT PACKAGE