Jumpei FUJIKATA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder supply apparatus and plating system
- Patent number 12,116,687
- Issue date Oct 15, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, processing apparatus having the paddle, and method of produ...
- Patent number 11,891,715
- Issue date Feb 6, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
- Patent number 11,717,796
- Issue date Aug 8, 2023
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak check method, leak check apparatus, plating method, and platin...
- Patent number 11,686,647
- Issue date Jun 27, 2023
- Ebara Corporation
- Kiyoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device for measuring bump height, apparatus for processing substrat...
- Patent number 11,604,150
- Issue date Mar 14, 2023
- Ebara Corporation
- Takahisa Okuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,535,949
- Issue date Dec 27, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,447,885
- Issue date Sep 20, 2022
- Ebara Corporation
- Jumpei Fujikata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Leak check method, leak check apparatus, plating method, and platin...
- Patent number 11,385,125
- Issue date Jul 12, 2022
- Ebara Corporation
- Kiyoshi Suzuki
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 11,371,155
- Issue date Jun 28, 2022
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Powder supply apparatus and plating system
- Patent number 11,359,304
- Issue date Jun 14, 2022
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 11,315,812
- Issue date Apr 26, 2022
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of removing liquid from seal of a substrate holder
- Patent number 11,230,789
- Issue date Jan 25, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 11,047,063
- Issue date Jun 29, 2021
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder, plating apparatus, plating method, and electric c...
- Patent number 10,954,603
- Issue date Mar 23, 2021
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
- Patent number 10,946,351
- Issue date Mar 16, 2021
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wave absorbing member attachable to paddle and plating apparatus in...
- Patent number 10,914,020
- Issue date Feb 9, 2021
- Ebara Corporation
- Shao Hua Chang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,914,019
- Issue date Feb 9, 2021
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device for inspecting a bump height surrounded by resist, device fo...
- Patent number 10,910,334
- Issue date Feb 2, 2021
- Ebara Corporation
- Takahisa Okuzono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,865,492
- Issue date Dec 15, 2020
- Ebara Corporation
- Jumpei Fujikata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating device, plating method, substrate holder, resistance measur...
- Patent number 10,676,838
- Issue date Jun 9, 2020
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,641,677
- Issue date May 5, 2020
- Ebara Corporation
- Yoshio Minami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, plating method, and recording medium
- Patent number 10,633,757
- Issue date Apr 28, 2020
- Ebara Corporation
- Masashi Shimoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic plating apparatus
- Patent number 10,607,842
- Issue date Mar 31, 2020
- Ebara Corporation
- Takehiko Higaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,577,714
- Issue date Mar 3, 2020
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder, plating apparatus, and method for manufacturing s...
- Patent number 10,577,713
- Issue date Mar 3, 2020
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, substrate holder, plating apparatus controlling...
- Patent number 10,533,262
- Issue date Jan 14, 2020
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Feeder capable of feeding anode and plating apparatus
- Patent number 10,508,354
- Issue date Dec 17, 2019
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 10,508,352
- Issue date Dec 17, 2019
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of adjusting plating apparatus, and measuring apparatus
- Patent number 10,487,415
- Issue date Nov 26, 2019
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20250003108
- Publication date Jan 2, 2025
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PROCESSING SUBSTRATE AND APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240383000
- Publication date Nov 21, 2024
- EBARA CORPORATION
- Jumpei FUJIKATA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD
- Publication number 20240087919
- Publication date Mar 14, 2024
- EBARA CORPORATION
- Jumpei FUJIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATIN...
- Publication number 20220307938
- Publication date Sep 29, 2022
- EBARA CORPORATION
- Kiyoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20220243356
- Publication date Aug 4, 2022
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...
- Publication number 20220181180
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Jumpei FUJIKATA
- G05 - CONTROLLING REGULATING
Information Patent Application
DEVICE FOR MEASURING BUMP HEIGHT, APPARATUS FOR PROCESSING SUBSTRAT...
- Publication number 20210285893
- Publication date Sep 16, 2021
- EBARA CORPORATION
- Takahisa Okuzono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...
- Publication number 20210262111
- Publication date Aug 26, 2021
- EBARA CORPORATION
- Yasuyuki Masuda
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD
- Publication number 20210154629
- Publication date May 27, 2021
- EBARA CORPORATION
- Yasuyuki MASUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20210062354
- Publication date Mar 4, 2021
- EBARA CORPORATION
- Jumpei FUJIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGULATION PLATE, PLATING APPARATUS EQUIPPED WITH THE SAME, AND PLA...
- Publication number 20200270760
- Publication date Aug 27, 2020
- EBARA CORPORATION
- Yoichi NAKAGAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE-HOLDER INSPECTION APPARATUS, PLATING APPARATUS INCLUDING...
- Publication number 20200255968
- Publication date Aug 13, 2020
- EBARA CORPORATION
- Yoshitaka MUKAIYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATIN...
- Publication number 20200209099
- Publication date Jul 2, 2020
- EBARA CORPORATION
- Kiyoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF REMOVING LIQUID FROM SEAL OF A SUBSTRATE HOLDER
- Publication number 20200199769
- Publication date Jun 25, 2020
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OXIDE POWDER FOR USE IN PLATING OF A SUBSTRATE
- Publication number 20200165737
- Publication date May 28, 2020
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20200080218
- Publication date Mar 12, 2020
- EBARA CORPORATION
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20190390359
- Publication date Dec 26, 2019
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE FOR INSPECTING A BUMP HEIGHT, DEVICE FOR PROCESSING A SUBSTR...
- Publication number 20190348384
- Publication date Nov 14, 2019
- EBARA CORPORATION
- Takahisa OKUZONO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM
- Publication number 20190309436
- Publication date Oct 10, 2019
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20190249325
- Publication date Aug 15, 2019
- EBARA CORPORATION
- Yoshio MINAMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20190226114
- Publication date Jul 25, 2019
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, TRANSPORT SYSTEM CAPABLE OF TRANSPORTING SUBSTRAT...
- Publication number 20190203373
- Publication date Jul 4, 2019
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POWDER SUPPLY APPARATUS AND PLATING SYSTEM
- Publication number 20190203374
- Publication date Jul 4, 2019
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, SUBSTRATE HOLDER, PLATING APPARATUS CONTROLLING...
- Publication number 20190186039
- Publication date Jun 20, 2019
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAVE ABSORBING MEMBER ATTACHABLE TO PADDLE AND PLATING APPARATUS IN...
- Publication number 20190186038
- Publication date Jun 20, 2019
- EBARA CORPORATION
- SHAO HUA CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20190127875
- Publication date May 2, 2019
- EBARA CORPORATION
- Shao Hua CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS
- Publication number 20180371636
- Publication date Dec 27, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...
- Publication number 20180294174
- Publication date Oct 11, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20180282892
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER, PLATING APPARATUS, PLATING METHOD, AND ELECTRIC C...
- Publication number 20180230620
- Publication date Aug 16, 2018
- EBARA CORPORATION,
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Jumpei FUJIKATA

Person

Patents Grantslast 30 patents

Semiconductor manufacturing apparatus, failure prediction method fo...

Powder supply apparatus and plating system

Paddle, processing apparatus having the paddle, and method of produ...

Paddle, plating apparatus equipped with the paddle, and plating method

Leak check method, leak check apparatus, plating method, and platin...

Device for measuring bump height, apparatus for processing substrat...

Substrate holder and plating apparatus

Plating method and plating apparatus

Leak check method, leak check apparatus, plating method, and platin...

Method and apparatus for processing a substrate

Powder supply apparatus and plating system

Semiconductor manufacturing apparatus, failure prediction method fo...

Method of removing liquid from seal of a substrate holder

Plating apparatus and plating method

Substrate holder, plating apparatus, plating method, and electric c...

Paddle, plating apparatus equipped with the paddle, and plating method

Wave absorbing member attachable to paddle and plating apparatus in...

Plating apparatus and plating method

Device for inspecting a bump height surrounded by resist, device fo...

Plating method and plating apparatus

Plating device, plating method, substrate holder, resistance measur...

Plating method and plating apparatus

Plating apparatus, plating method, and recording medium

Electrolytic plating apparatus

Plating apparatus and plating method

Substrate holder, plating apparatus, and method for manufacturing s...

Plating apparatus, substrate holder, plating apparatus controlling...

Feeder capable of feeding anode and plating apparatus

Method and apparatus for processing a substrate

Method of adjusting plating apparatus, and measuring apparatus

Patents Applicationslast 30 patents

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

METHOD OF PROCESSING SUBSTRATE AND APPARATUS FOR PROCESSING SUBSTRATE

SUBSTRATE PROCESSING APPARATUS AND PROTECTIVE LAYER FORMING METHOD

LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATIN...

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...

DEVICE FOR MEASURING BUMP HEIGHT, APPARATUS FOR PROCESSING SUBSTRAT...

PADDLE, PROCESSING APPARATUS HAVING THE PADDLE, AND METHOD OF PRODU...

PADDLE, PLATING APPARATUS EQUIPPED WITH THE PADDLE, AND PLATING METHOD

PLATING METHOD AND PLATING APPARATUS

REGULATION PLATE, PLATING APPARATUS EQUIPPED WITH THE SAME, AND PLA...

SUBSTRATE-HOLDER INSPECTION APPARATUS, PLATING APPARATUS INCLUDING...

LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATIN...

METHOD OF REMOVING LIQUID FROM SEAL OF A SUBSTRATE HOLDER

COPPER OXIDE POWDER FOR USE IN PLATING OF A SUBSTRATE

METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE

SUBSTRATE HOLDER AND PLATING APPARATUS

DEVICE FOR INSPECTING A BUMP HEIGHT, DEVICE FOR PROCESSING A SUBSTR...

PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM

PLATING METHOD AND PLATING APPARATUS

PLATING APPARATUS AND PLATING METHOD

SUBSTRATE HOLDER, TRANSPORT SYSTEM CAPABLE OF TRANSPORTING SUBSTRAT...

POWDER SUPPLY APPARATUS AND PLATING SYSTEM

PLATING APPARATUS, SUBSTRATE HOLDER, PLATING APPARATUS CONTROLLING...

WAVE ABSORBING MEMBER ATTACHABLE TO PADDLE AND PLATING APPARATUS IN...

PLATING APPARATUS AND PLATING METHOD

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...

PLATING METHOD AND PLATING APPARATUS

SUBSTRATE HOLDER, PLATING APPARATUS, PLATING METHOD, AND ELECTRIC C...