Jumyong PARK

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer structure and semiconductor device
- Patent number 12,224,256
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,541
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having a through electrode and semiconductor pac...
- Patent number 12,027,482
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 12,021,034
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Solji Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 12,009,288
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having first and second redistribution patterns
- Patent number 11,996,358
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,978,688
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including fine redistribution patterns
- Patent number 11,923,309
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,854,893
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 11,798,872
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and semiconductor package including the same
- Patent number 11,637,058
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via protective layer
- Patent number 11,476,176
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer loaders having buffer zones
- Patent number 9,502,274
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Yi Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 9,070,748
- Issue date Jun 30, 2015
- Samsung Electronics Co., Ltd.
- Pil-Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250029941
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- HYUNSU HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014958
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347510
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...
- Publication number 20240321794
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240312923
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240312894
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240290702
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICA...
- Publication number 20240237349
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- G11 - INFORMATION STORAGE
Information Patent Application
RING ASSEMBLY AND SEMICONDUCTOR WAFER ETCHING DEVICE
- Publication number 20240234103
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203888
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MAN...
- Publication number 20240178202
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Byeongchan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP...
- Publication number 20240162104
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128239
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...
- Publication number 20240105680
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105679
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KUN JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030169
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Woon Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240006288
- Publication date Jan 4, 2024
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230420397
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230238316
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230132272
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- JUN YOUNG OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230112006
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER
- Publication number 20230111136
- Publication date Apr 13, 2023
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230096678
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230089399
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Solji SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20230070532
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230073690
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Hyunsu HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230010936
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220068779
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220059442
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Dongjoon OH
- H01 - BASIC ELECTRIC ELEMENTS

Jumyong PARK

Person

Patents Grantslast 30 patents

Wafer structure and semiconductor device

Semiconductor device, semiconductor package and method of manufactu...

Semiconductor package

Semiconductor chip having a through electrode and semiconductor pac...

Semiconductor package and method of manufacturing the semiconductor...

Interconnection structure and semiconductor package including the same

Semiconductor packages having first and second redistribution patterns

Semiconductor device having via protective layer

Semiconductor package including fine redistribution patterns

Method of manufacturing semiconductor package

Interconnection structure and semiconductor package including the same

Interconnection structure and semiconductor package including the same

Semiconductor device having via protective layer

Wafer loaders having buffer zones

Semiconductor devices having through-vias and methods for fabricati...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR CHIP HAVING A THROUGH ELECTRODE AND SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICA...

RING ASSEMBLY AND SEMICONDUCTOR WAFER ETCHING DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES INCLUDING BONDED SEMICONDUCTOR LAYERS AND MAN...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

WAFER STRUCTURE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERCONNECTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME