Jun Abatake

Person

Ota-Ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate for acoustic wave device
- Patent number 11,165,408
- Issue date Nov 2, 2021
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Saw filter manufacturing method and saw filter
- Patent number 11,088,674
- Issue date Aug 10, 2021
- Disco Corporation
- Jun Abatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BAW device and method of manufacturing BAW device
- Patent number 10,050,599
- Issue date Aug 14, 2018
- Disco Corporation
- Jun Abatake
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer dividing apparatus and laser processing apparatus
- Patent number 8,642,920
- Issue date Feb 4, 2014
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dividing method
- Patent number 8,415,234
- Issue date Apr 9, 2013
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SAW FILTER MANUFACTURING METHOD AND SAW FILTER
- Publication number 20200343878
- Publication date Oct 29, 2020
- Disco Corporation
- Jun ABATAKE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR ACOUSTIC WAVE DEVICE
- Publication number 20190044494
- Publication date Feb 7, 2019
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BAW DEVICE AND BAW DEVICE MANUFACTURING METHOD
- Publication number 20170257075
- Publication date Sep 7, 2017
- Disco Corporation
- Jun Abatake
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BAW DEVICE AND METHOD OF MANUFACTURING BAW DEVICE
- Publication number 20170063334
- Publication date Mar 2, 2017
- Disco Corporation
- Jun Abatake
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SAW DEVICE MANUFACTURING METHOD
- Publication number 20160380605
- Publication date Dec 29, 2016
- Disco Corporation
- Hirokazu Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DIVIDING METHOD
- Publication number 20120289028
- Publication date Nov 15, 2012
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS DEVICE MANUFACTURING METHOD
- Publication number 20110230000
- Publication date Sep 22, 2011
- Disco Corporation
- Jun Abatake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS
- Publication number 20110147349
- Publication date Jun 23, 2011
- Disco Corporation
- Chikara Aikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Jun Abatake

Person

Patents Grantslast 30 patents

Method of manufacturing substrate for acoustic wave device

Saw filter manufacturing method and saw filter

BAW device and method of manufacturing BAW device

Wafer dividing apparatus and laser processing apparatus

Wafer dividing method

Patents Applicationslast 30 patents

SAW FILTER MANUFACTURING METHOD AND SAW FILTER

METHOD OF MANUFACTURING SUBSTRATE FOR ACOUSTIC WAVE DEVICE

BAW DEVICE AND BAW DEVICE MANUFACTURING METHOD

BAW DEVICE AND METHOD OF MANUFACTURING BAW DEVICE

SAW DEVICE MANUFACTURING METHOD

WAFER DIVIDING METHOD

MEMS DEVICE MANUFACTURING METHOD

WAFER DIVIDING APPARATUS AND LASER PROCESSING APPARATUS