JUN HE

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Delamination control of dielectric layers of integrated circuit chips
- Patent number 12,354,946
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 12,334,465
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating features for laser drilling process
- Patent number 12,322,716
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,313,675
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,270,852
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 12,237,226
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,170,327
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,066,484
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor devices and methods of forming thereof
- Patent number 12,051,624
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,025,655
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,754,621
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for wafer-level testing
- Patent number 11,630,149
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,448,692
- Issue date Sep 20, 2022
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 11,081,392
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 11,073,551
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE
- Publication number 20250221310
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...
- Publication number 20250218986
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES
- Publication number 20250133770
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
- Publication number 20250079354
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Steven Sze Hang Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250072028
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
- Publication number 20240395666
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
- Publication number 20240395750
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Shen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379825
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20240361380
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20240310434
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038682
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING
- Publication number 20230420438
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20230402324
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-CLAD METAL INTERCONNECT
- Publication number 20230402385
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20230366925
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Delamination control of dielectric layers of integrated circuit chips

Package component

Semiconductor package and method of forming same

Heat dissipating features for laser drilling process

Method and device for wafer-level testing

Method and system for wafer-level testing

Dicing method for stacked semiconductor devices

Semiconductor structure and manufacturing method of the same

Method and device for wafer-level testing

Stacked semiconductor devices and methods of forming thereof

Method and system for wafer-level testing

Semiconductor package and method of forming same

Package component and forming method thereof

Method and device for wafer-level testing

Method and system for wafer-level testing

Method and device for wafer-level testing

Dicing method for stacked semiconductor devices

Method and system for wafer-level testing

Patents Applicationslast 30 patents

ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

INTEGRATED CIRCUIT PACKAGES AND METHODS

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

SEMICONDUCTOR STRUCTURES FOR MONITORING PLASMA PROCESS-INDUCED DAMAGES

LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES

Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

PACKAGE COMPONENT

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGING

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

GRAPHENE-CLAD METAL INTERCONNECT

GRAPHENE-METAL HYBRID INTERCONNECT

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

PACKAGE COMPONENT AND FORMING METHOD THEREOF