JUN HE

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,170,327
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for wafer-level testing
- Patent number 12,066,484
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Stacked semiconductor devices and methods of forming thereof
- Patent number 12,051,624
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 12,025,655
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,754,621
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for wafer-level testing
- Patent number 11,630,149
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for wafer-level testing
- Patent number 11,448,692
- Issue date Sep 20, 2022
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Jun He
- G01 - MEASURING TESTING
Information Patent Grant
Dicing method for stacked semiconductor devices
- Patent number 11,081,392
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer-level testing
- Patent number 11,073,551
- Issue date Jul 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jun He
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20240395621
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
- Publication number 20240395666
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
- Publication number 20240395750
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Shen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240379825
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20240361380
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20240310434
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038682
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING
- Publication number 20230420438
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chung YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES
- Publication number 20230402324
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE-METAL HYBRID INTERCONNECT
- Publication number 20230402384
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20230366925
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS
- Publication number 20230290747
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20230251306
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
DELAMINATION CONTROL OF DIELECTRIC LAYERS OF INTEGRATED CIRCUIT CHIPS
- Publication number 20230178475
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE PROFILE CONTROL OF INTEGRATED CIRCUIT CHIPS
- Publication number 20230170258
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Same
- Publication number 20230045422
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20220326300
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220320319
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Method for Stacked Semiconductor Devices
- Publication number 20210358808
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20210311110
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR WAFER-LEVEL TESTING
- Publication number 20210199710
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING
Information Patent Application
Dicing Method for Stacked Semiconductor Devices
- Publication number 20200105600
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Hsing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER-LEVEL TESTING
- Publication number 20200064396
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JUN HE
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method of the same

Method and device for wafer-level testing

Stacked semiconductor devices and methods of forming thereof

Method and system for wafer-level testing

Semiconductor package and method of forming same

Package component and forming method thereof

Method and device for wafer-level testing

Method and system for wafer-level testing

Method and device for wafer-level testing

Dicing method for stacked semiconductor devices

Method and system for wafer-level testing

Patents Applicationslast 30 patents

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES

Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

PACKAGE COMPONENT

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGING

DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES

GRAPHENE-METAL HYBRID INTERCONNECT

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

PACKAGE COMPONENT AND FORMING METHOD THEREOF

HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

DELAMINATION CONTROL OF DIELECTRIC LAYERS OF INTEGRATED CIRCUIT CHIPS

EDGE PROFILE CONTROL OF INTEGRATED CIRCUIT CHIPS

Semiconductor Package and Method of Forming Same

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

Dicing Method for Stacked Semiconductor Devices

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING

METHOD AND DEVICE FOR WAFER-LEVEL TESTING

Dicing Method for Stacked Semiconductor Devices

METHOD AND SYSTEM FOR WAFER-LEVEL TESTING