JUN LIAO

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stiffener and package substrate for a semiconductor package
- Patent number 11,295,998
- Issue date Apr 5, 2022
- Intel Corporation
- Stephen Christianson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete circuit having cross-talk noise cancellation circuitry and...
- Patent number 11,116,072
- Issue date Sep 7, 2021
- Intel Corporation
- Jun Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Connector with active circuit
- Patent number 10,965,047
- Issue date Mar 30, 2021
- Intel Corporation
- Jong-Ru Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packed interconnect structure with reduced cross coupled noise
- Patent number 10,950,536
- Issue date Mar 16, 2021
- Intel Corporation
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Snap-on electromagnetic interference (EMI)-shielding without mother...
- Patent number 10,938,161
- Issue date Mar 2, 2021
- Intel Corporation
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reducing connector pin geometry
- Patent number 10,923,859
- Issue date Feb 16, 2021
- Intel Corporation
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding having a magnetically attrac...
- Patent number 10,736,246
- Issue date Aug 4, 2020
- Apple Inc.
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, system and method to mitigate signal noise in communication...
- Patent number 10,729,002
- Issue date Jul 28, 2020
- Intel Corporation
- Jun Liao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Printed circuit board (PCB) with three-dimensional interconnects to...
- Patent number 10,617,000
- Issue date Apr 7, 2020
- Intel Corporation
- Daqiao Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory channel having more than one DIMM per motherboard DIMM conne...
- Patent number 10,467,160
- Issue date Nov 5, 2019
- Intel Corporation
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
FAN MODULES FOR ELECTRONIC DEVICES
- Publication number 20250008685
- Publication date Jan 2, 2025
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DYNAMIC SWITCH FOR MEMORY DEVICES
- Publication number 20240028531
- Publication date Jan 25, 2024
- Intel Corporation
- John R. DREW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS
- Publication number 20230006374
- Publication date Jan 5, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GDDR MEMORY EXPANDER USING CMT CONNECTOR
- Publication number 20230007775
- Publication date Jan 5, 2023
- Intel Corporation
- Xiang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER CARD WITH COMPRESSION ATTACHED MEMORY MODULES
- Publication number 20220368047
- Publication date Nov 17, 2022
- Intel Corporation
- George VERGIS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY MODULE ADAPTER CARD WITH MULTIPLEXER CIRCUITRY
- Publication number 20220358072
- Publication date Nov 10, 2022
- Intel Corporation
- George VERGIS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIFFERENTIAL I/O CARD USING CMT CONNECTOR
- Publication number 20220360002
- Publication date Nov 10, 2022
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER CONVERSION MODULE USING CMT CONNECTOR
- Publication number 20220361328
- Publication date Nov 10, 2022
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE PACKAGE WITH NOISE SHIELDING
- Publication number 20200219825
- Publication date Jul 9, 2020
- Intel Corporation
- Jaejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING FOR A CIRCUIT BOARD
- Publication number 20200107476
- Publication date Apr 2, 2020
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE, SYSTEM AND METHOD TO MITIGATE SIGNAL NOISE IN COMMUNICATION...
- Publication number 20190342990
- Publication date Nov 7, 2019
- Jun Liao
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190311963
- Publication date Oct 10, 2019
- Intel Corporation
- Stephen CHRISTIANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR WITH ACTIVE CIRCUIT
- Publication number 20190288421
- Publication date Sep 19, 2019
- Intel Corporation
- Jong-Ru Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCING CONNECTOR PIN GEOMETRY
- Publication number 20190245309
- Publication date Aug 8, 2019
- Jaejin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAP-ON ELECTROMAGNETIC INTERFERENCE (EMI)-SHIELDING WITHOUT MOTHER...
- Publication number 20190229473
- Publication date Jul 25, 2019
- Intel Corporation
- Jaejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHANNEL HAVING MORE THAN ONE DIMM PER MOTHERBOARD DIMM CONNE...
- Publication number 20190102331
- Publication date Apr 4, 2019
- Intel Corporation
- Xiang LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKED INTERCONNECT STRUCTURE WITH REDUCED CROSS COUPLED NOISE
- Publication number 20190043796
- Publication date Feb 7, 2019
- Intel Corporation
- Zhen ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE CIRCUIT HAVING CROSS-TALK NOISE CANCELLATION CIRCUITRY
- Publication number 20190045622
- Publication date Feb 7, 2019
- Intel Corporation
- Jun LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR, BOARD ASSEMBLY, COMPUTING SYSTEM, AND METHODS THEREOF
- Publication number 20190045632
- Publication date Feb 7, 2019
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SODIMM CONNECTOR SHIELD TO REDUCE RADIO FREQUENCY INTERFERENCE (RFI)
- Publication number 20190044289
- Publication date Feb 7, 2019
- Intel Corporation
- XIANG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD (PCB) WITH THREE-DIMENSIONAL INTERCONNECTS TO...
- Publication number 20190037689
- Publication date Jan 31, 2019
- Intel Corporation
- DAQIAO DU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Stiffener and package substrate for a semiconductor package

Discrete circuit having cross-talk noise cancellation circuitry and...

Connector with active circuit

Packed interconnect structure with reduced cross coupled noise

Snap-on electromagnetic interference (EMI)-shielding without mother...

Crosstalk reducing connector pin geometry

Electromagnetic interference shielding having a magnetically attrac...

Device, system and method to mitigate signal noise in communication...

Printed circuit board (PCB) with three-dimensional interconnects to...

Memory channel having more than one DIMM per motherboard DIMM conne...

Patents Applicationslast 30 patents

FAN MODULES FOR ELECTRONIC DEVICES

DYNAMIC SWITCH FOR MEMORY DEVICES

MEMORY ON PACKAGE WITH INTERPOSER WITH COMPRESSION-BASED CONNECTORS

GDDR MEMORY EXPANDER USING CMT CONNECTOR

ADAPTER CARD WITH COMPRESSION ATTACHED MEMORY MODULES

MEMORY MODULE ADAPTER CARD WITH MULTIPLEXER CIRCUITRY

DIFFERENTIAL I/O CARD USING CMT CONNECTOR

POWER CONVERSION MODULE USING CMT CONNECTOR

MEMORY DEVICE PACKAGE WITH NOISE SHIELDING

ELECTROMAGNETIC INTERFERENCE SHIELDING FOR A CIRCUIT BOARD

DEVICE, SYSTEM AND METHOD TO MITIGATE SIGNAL NOISE IN COMMUNICATION...

STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE

CONNECTOR WITH ACTIVE CIRCUIT

CROSSTALK REDUCING CONNECTOR PIN GEOMETRY

SNAP-ON ELECTROMAGNETIC INTERFERENCE (EMI)-SHIELDING WITHOUT MOTHER...

MEMORY CHANNEL HAVING MORE THAN ONE DIMM PER MOTHERBOARD DIMM CONNE...

PACKED INTERCONNECT STRUCTURE WITH REDUCED CROSS COUPLED NOISE

DISCRETE CIRCUIT HAVING CROSS-TALK NOISE CANCELLATION CIRCUITRY

CONNECTOR, BOARD ASSEMBLY, COMPUTING SYSTEM, AND METHODS THEREOF

SODIMM CONNECTOR SHIELD TO REDUCE RADIO FREQUENCY INTERFERENCE (RFI)

PRINTED CIRCUIT BOARD (PCB) WITH THREE-DIMENSIONAL INTERCONNECTS TO...