Jun Zhou

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated circuit device
- Patent number 11,804,458
- Issue date Oct 31, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating gate fabrication method
- Patent number 11,107,697
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Chaoran Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate hole defect relieving method
- Patent number 10,784,355
- Issue date Sep 22, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for alleviating etching defect of salicide barrier layer
- Patent number 10,566,203
- Issue date Feb 18, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Chenglong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paper-base flexible power-generation apparatus, and manufacturing m...
- Patent number 9,755,553
- Issue date Sep 5, 2017
- Huazhong University of Science & Technology
- Jun Zhou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054808
- Publication date Feb 13, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD, BONDING METHOD AND DIE
- Publication number 20240332079
- Publication date Oct 3, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE PIXEL CIRCUIT, IMAGE SENSOR, AND ELECTRONIC DEVICE
- Publication number 20240205564
- Publication date Jun 20, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Jun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BLOCK AND CONTROL METHOD THEREOF
- Publication number 20240145005
- Publication date May 2, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- KAIWEI CAO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS FOR THE SAME
- Publication number 20240128339
- Publication date Apr 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...
- Publication number 20240038631
- Publication date Feb 1, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HANDLING TEST PAD AND METHOD OF FABRICATING SEMICONDUCTOR...
- Publication number 20230395440
- Publication date Dec 7, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Structure
- Publication number 20230073118
- Publication date Mar 9, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei CAO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE
- Publication number 20230020810
- Publication date Jan 19, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415644
- Publication date Dec 29, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME
- Publication number 20220399282
- Publication date Dec 15, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20200144111
- Publication date May 7, 2020
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE HOLE DEFECT RELIEVING METHOD
- Publication number 20190371612
- Publication date Dec 5, 2019
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING GATE FABRICATION METHOD
- Publication number 20190363096
- Publication date Nov 28, 2019
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chaoran ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELIMINATING DISLOCATIONS IN ACTIVE AREA AS WELL AS SEMIC...
- Publication number 20190341262
- Publication date Nov 7, 2019
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qingwei LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAPER-BASE FLEXIBLE POWER-GENERATION APPARATUS, AND MANUFACTURING M...
- Publication number 20150048715
- Publication date Feb 19, 2015
- HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY
- Jun Zhou
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Person

Patents Grantslast 30 patents

Semiconductor device and method of fabricating the same

Method of fabricating integrated circuit device

Floating gate fabrication method

Gate hole defect relieving method

Method for alleviating etching defect of salicide barrier layer

Paper-base flexible power-generation apparatus, and manufacturing m...

Patents Applicationslast 30 patents

SOI SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

DICING METHOD, BONDING METHOD AND DIE

ACTIVE PIXEL CIRCUIT, IMAGE SENSOR, AND ELECTRONIC DEVICE

MEMORY BLOCK AND CONTROL METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS FOR THE SAME

THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...

METHOD OF HANDLING TEST PAD AND METHOD OF FABRICATING SEMICONDUCTOR...

Semiconductor Structure

METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

LARGE DIE WAFER, LARGE DIE AND METHOD OF FORMING THE SAME

METAL INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING SAME

GATE HOLE DEFECT RELIEVING METHOD

FLOATING GATE FABRICATION METHOD

METHOD FOR ELIMINATING DISLOCATIONS IN ACTIVE AREA AS WELL AS SEMIC...

PAPER-BASE FLEXIBLE POWER-GENERATION APPARATUS, AND MANUFACTURING M...