June CHOI

Person

Portland, OR, US

People

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...
- Publication number 20250220991
- Publication date Jul 3, 2025
- Intel Corporation
- Shao Ming KOH
Information Patent Application
VIA ALIGNED WITH ADJACENT INTERCONNECT LAYERS
- Publication number 20250218942
- Publication date Jul 3, 2025
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20250105148
- Publication date Mar 27, 2025
- Intel Corporation
- Marvin PAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...
- Publication number 20240170394
- Publication date May 23, 2024
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RING STRUCTURES
- Publication number 20240145383
- Publication date May 2, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED...
- Publication number 20240105589
- Publication date Mar 28, 2024
- Intel Corporation
- Shao Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER
- Publication number 20240096785
- Publication date Mar 21, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-DECKED INTERCONNECT FEATURES
- Publication number 20240071913
- Publication date Feb 29, 2024
- Intel Corporation
- June Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE
- Publication number 20230420512
- Publication date Dec 28, 2023
- Intel Corporation
- Sukru YEMENICIOGLU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...

VIA ALIGNED WITH ADJACENT INTERCONNECT LAYERS

DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...

INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...

INTEGRATED RING STRUCTURES

INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED...

INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER

DOUBLE-DECKED INTERCONNECT FEATURES

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE