TREA

Jung-Chih Hu

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  • Yangmei Township, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Backside process for a substrate
    • Patent number 8,691,664
    • Issue date Apr 8, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Ku-Feng Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Component stacking using pre-formed adhesive films
    • Patent number 8,664,749
    • Issue date Mar 4, 2014
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Weng-Jin Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods of forming through via
    • Patent number 8,486,823
    • Issue date Jul 16, 2013
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Wen-Chih Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Particle free wafer separation
    • Patent number 8,058,150
    • Issue date Nov 15, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Weng-Jin Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Component stacking using pre-formed adhesive films
    • Patent number 7,943,421
    • Issue date May 17, 2011
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Weng-Jin Wu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents