Jung Kyu Han

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to reduce defects in interconnects between se...
- Patent number 12,341,117
- Issue date Jun 24, 2025
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to reduce defects in interconnects between se...
- Patent number 12,334,422
- Issue date Jun 17, 2025
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture to manage FLI bump height delta and reliability needs...
- Patent number 11,955,448
- Issue date Apr 9, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
- Patent number 11,935,857
- Issue date Mar 19, 2024
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finishes with low rBTV for fine and mixed bump pitch archit...
- Patent number 11,488,918
- Issue date Nov 1, 2022
- Intel Corporation
- Kristof Darmawaikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,854,541
- Issue date Dec 1, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,431,537
- Issue date Oct 1, 2019
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
- Publication number 20250218953
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED MOLD UNDERFILL (MUF) FILMS FOR DEEP TRENCH FILLING
- Publication number 20250218885
- Publication date Jul 3, 2025
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...
- Publication number 20250218984
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...
- Publication number 20250201720
- Publication date Jun 19, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING SYSTEM AND MOLDING METHOD
- Publication number 20250144857
- Publication date May 8, 2025
- Intel Corporation
- Zhixin XIE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER
- Publication number 20250006671
- Publication date Jan 2, 2025
- Intel Corporation
- Marcel Arlan Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...
- Publication number 20240387396
- Publication date Nov 21, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...
- Publication number 20240332134
- Publication date Oct 3, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE...
- Publication number 20240312924
- Publication date Sep 19, 2024
- Intel Corporation
- Shishir Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS
- Publication number 20240210634
- Publication date Jun 27, 2024
- Intel Corporation
- Zhixin XIE
- G02 - OPTICS
Information Patent Application
INTERCONNECT DEVICE AND METHOD
- Publication number 20240213163
- Publication date Jun 27, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS FOR WARPAGE REDUCTION
- Publication number 20240186263
- Publication date Jun 6, 2024
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
MATERIAL DEPOSITION APPARATUS AND METHOD
- Publication number 20240188223
- Publication date Jun 6, 2024
- Intel Corporation
- Zhixin XIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT
- Publication number 20240178151
- Publication date May 30, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...
- Publication number 20230420358
- Publication date Dec 28, 2023
- Intel Corporation
- Cemil S. Geyik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT
- Publication number 20230317642
- Publication date Oct 5, 2023
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT HIERARCHY FOR HETEROGENEOUS ELECTRONIC DEVICE P...
- Publication number 20230197660
- Publication date Jun 22, 2023
- Intel Corporation
- Yue DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...
- Publication number 20230197543
- Publication date Jun 22, 2023
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...
- Publication number 20230097624
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS

Jung Kyu Han

Person

Patents Grantslast 30 patents

Omni directional interconnect with magnetic fillers in mold matrix

Methods and apparatus to reduce defects in interconnects between se...

Methods and apparatus to reduce defects in interconnects between se...

Architecture to manage FLI bump height delta and reliability needs...

Surface finishes with low RBTV for fine and mixed bump pitch archit...

Patternable die attach materials and processes for patterning

Electromigration resistant and profile consistent contact arrays

Surface finishes with low rBTV for fine and mixed bump pitch archit...

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Electromigration resistant and profile consistent contact arrays

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

Technologies for Components Embedded in a Substrate Core

PATTERNED MOLD UNDERFILL (MUF) FILMS FOR DEEP TRENCH FILLING

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...

MOLDING SYSTEM AND MOLDING METHOD

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

SEMICONDUCTOR LAYER WITH DRY DEPOSITION LAYER

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...

SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...

METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...

FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE...

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS

INTERCONNECT DEVICE AND METHOD

STRUCTURE AND PROCESS FOR WARPAGE REDUCTION

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

MATERIAL DEPOSITION APPARATUS AND METHOD

OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-L...

ELECTRONIC DEVICE SUBSTRATE HAVING A PASSIVE ELECTRONIC COMPONENT

SOLDER INTERCONNECT HIERARCHY FOR HETEROGENEOUS ELECTRONIC DEVICE P...

MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN S...