Junggeun SHIN

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 12,062,626
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,854,892
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 11,676,914
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,322,405
- Issue date May 3, 2022
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240178000
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jesung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230420352
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME
- Publication number 20230275037
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20230082384
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20220208610
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME
- Publication number 20220059472
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20210159121
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS

Junggeun SHIN

Person

Patents Grantslast 30 patents

Semiconductor substrate and method of sawing the same

Substrate dicing method, method of fabricating semiconductor device...

Semiconductor substrate and method of sawing the same

Substrate dicing method, method of fabricating semiconductor device...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...