JUNHO YOON

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 12,062,626
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,854,892
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 11,676,914
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,322,405
- Issue date May 3, 2022
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring units, plasma treatment devices including the same, and...
- Patent number 10,607,820
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a semiconductor device
- Patent number 9,859,163
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Kyounghoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming fine pattern of semiconductor device
- Patent number 9,812,335
- Issue date Nov 7, 2017
- Samsung Electronics Co., Ltd.
- Je-Woo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a support for an electrode and meth...
- Patent number 9,647,056
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of fabricating the same
- Patent number 9,466,629
- Issue date Oct 11, 2016
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a support for an electrode and meth...
- Patent number 9,240,441
- Issue date Jan 19, 2016
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor devices
- Patent number 9,123,657
- Issue date Sep 1, 2015
- Samsung Electronics Co., Ltd.
- Minjoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a semiconductor device with capacitors using...
- Patent number 8,969,167
- Issue date Mar 3, 2015
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a light shielding pattern
- Patent number 8,698,265
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THERE...
- Publication number 20240355678
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240178000
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jesung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS
- Publication number 20240038493
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230395547
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Junyun Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME
- Publication number 20230275037
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20230260845
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20230082384
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20220392851
- Publication date Dec 8, 2022
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20220208610
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME
- Publication number 20220059472
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20210159121
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS
- Publication number 20200373124
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monitoring Units, Plasma Treatment Devices Including the Same, and...
- Publication number 20180090303
- Publication date Mar 29, 2018
- Samsung Electronics Co., Ltd.
- Junho Yoon
- G01 - MEASURING TESTING
Information Patent Application
METHODS FOR MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20170047257
- Publication date Feb 16, 2017
- Samsung Electronics Co., Ltd.
- KYOUNGHOON HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PATTERN USING CYCLIC PROCESSING
- Publication number 20160314981
- Publication date Oct 27, 2016
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FINE PATTERN OF SEMICONDUCTOR DEVICE
- Publication number 20160293445
- Publication date Oct 6, 2016
- Samsung Electronics Co., Ltd.
- Je-Woo HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A SUPPORT FOR AN ELECTRODE AND METH...
- Publication number 20160093686
- Publication date Mar 31, 2016
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20150372031
- Publication date Dec 24, 2015
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20150079791
- Publication date Mar 19, 2015
- Samsung Electronics Co., Ltd.
- Minjoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING A SEMICONDUCTOR DEVICE WITH CAPACITORS USING...
- Publication number 20140065784
- Publication date Mar 6, 2014
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A SUPPORT FOR AN ELECTRODE AND METH...
- Publication number 20140065785
- Publication date Mar 6, 2014
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND PACKAGE INCLUDING THE IMAGE SENSOR
- Publication number 20120001286
- Publication date Jan 5, 2012
- JUNHO YOON
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor substrate and method of sawing the same

Substrate dicing method, method of fabricating semiconductor device...

Semiconductor substrate and method of sawing the same

Substrate dicing method, method of fabricating semiconductor device...

Monitoring units, plasma treatment devices including the same, and...

Methods for manufacturing a semiconductor device

Method of forming fine pattern of semiconductor device

Semiconductor devices including a support for an electrode and meth...

Image sensor and method of fabricating the same

Semiconductor devices including a support for an electrode and meth...

Method of fabricating semiconductor devices

Methods of fabricating a semiconductor device with capacitors using...

Image sensor including a light shielding pattern

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THERE...

WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

SEMICONDUCTOR PROCESSING APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME

WAFER STRUCTURE AND SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICOND...

SEMICONDUCTOR CHIP AND MANUFACTURING METHOD THEREOF

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME

SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR PROCESSING APPARATUS

Monitoring Units, Plasma Treatment Devices Including the Same, and...

METHODS FOR MANUFACTURING A SEMICONDUCTOR DEVICE

METHODS FOR FORMING PATTERN USING CYCLIC PROCESSING

METHOD OF FORMING FINE PATTERN OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING A SUPPORT FOR AN ELECTRODE AND METH...

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR DEVICES

METHODS OF FABRICATING A SEMICONDUCTOR DEVICE WITH CAPACITORS USING...

SEMICONDUCTOR DEVICES INCLUDING A SUPPORT FOR AN ELECTRODE AND METH...

IMAGE SENSOR AND PACKAGE INCLUDING THE IMAGE SENSOR