Junhua Luo

Person

Tianjin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package with cap element
- Patent number 9,093,438
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor die with cap element
- Patent number 8,859,336
- Issue date Oct 14, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with cap element
- Patent number 8,836,105
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor device including insulating subs...
- Patent number 8,722,465
- Issue date May 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor device including insulating subs...
- Patent number 8,643,170
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor package with improved standoff
- Patent number 8,481,369
- Issue date Jul 9, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
- Publication number 20140357023
- Publication date Dec 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE DIE ATTACHMENT
- Publication number 20140284806
- Publication date Sep 25, 2014
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...
- Publication number 20140127862
- Publication date May 8, 2014
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT
- Publication number 20140027896
- Publication date Jan 30, 2014
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE DIE BONDING
- Publication number 20130037966
- Publication date Feb 14, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Shunan QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...
- Publication number 20120264258
- Publication date Oct 18, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Junhua LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT
- Publication number 20120238058
- Publication date Sep 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Junhua LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH IMPROVED STANDOFF
- Publication number 20110189823
- Publication date Aug 4, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Junhua Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20100283135
- Publication date Nov 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong YAO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device package with cap element

Method of packaging semiconductor die with cap element

Semiconductor device package with cap element

Method of assembling semiconductor device including insulating subs...

Method of assembling semiconductor device including insulating subs...

Method of making semiconductor package with improved standoff

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT

SEMICONDUCTOR DEVICE DIE ATTACHMENT

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...

SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT

SEMICONDUCTOR DEVICE DIE BONDING

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBS...

METHOD OF PACKAGING SEMICONDUCTOR DIE WITH CAP ELEMENT

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH IMPROVED STANDOFF

LEAD FRAME FOR SEMICONDUCTOR DEVICE