Junichi Kimura

Person

Nishikasugai-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,297,516
- Issue date May 21, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masayuki Nagamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of top surface connection t...
- Patent number 10,211,144
- Issue date Feb 19, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinichi Kohda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mounting substrate and method for manufacturing the same
- Patent number 8,217,515
- Issue date Jul 10, 2012
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor mounting substrate and method for manufacturing the same
- Patent number 7,919,359
- Issue date Apr 5, 2011
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and method of manufacturing the same
- Patent number 7,704,797
- Issue date Apr 27, 2010
- Panasonic Corporation
- Junichi Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing component-embedded printed wiring board
- Patent number 7,694,415
- Issue date Apr 13, 2010
- Panasonic Corporation
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer module and method of manufacturing the same
- Patent number 7,532,485
- Issue date May 12, 2009
- Panasonic Corporation
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module, method of manufacturing module, and electronic apparatus us...
- Patent number 7,394,029
- Issue date Jul 1, 2008
- Matsushita Electric Industrial Co., Ltd.
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board and its manufacturing method, and manufactu...
- Patent number 7,317,621
- Issue date Jan 8, 2008
- Matsushita Electric Industrial Co., Ltd.
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module and electronic device using the module
- Patent number 7,183,498
- Issue date Feb 27, 2007
- Matsushita Electric Industrial Co., Ltd.
- Tomohide Ogura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer board
- Patent number 7,161,241
- Issue date Jan 9, 2007
- Matsushita Electric Industrial Co., Ltd.
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 6,870,260
- Issue date Mar 22, 2005
- Matsushita Electric Industrial Co., Ltd.
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and method of manufacturing the module
- Patent number 6,798,665
- Issue date Sep 28, 2004
- Matsushita Electric Industrial Co., Ltd.
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing high-frequency modules
- Patent number 6,675,471
- Issue date Jan 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module and method of manufacturing the same
- Patent number 6,487,085
- Issue date Nov 26, 2002
- Matsushita Electric Industrial Co. Ltd.
- Junichi Kimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230163055
- Publication date May 25, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- JUNICHI KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210013183
- Publication date Jan 14, 2021
- Pansonic Intellectual Property Management Co., Ltd.
- SHINGO OKAURA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180197802
- Publication date Jul 12, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- MASAYUKI NAGAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180145020
- Publication date May 24, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- SHINICHI KOHDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PROVIDED WITH ELECTRICAL ELEMENT AND TEMPERATURE...
- Publication number 20160320244
- Publication date Nov 3, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- JUNICHI KIMURA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160322342
- Publication date Nov 3, 2016
- Panasonic Intellectual Property Management Co. Lt
- JUNICHI KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110140270
- Publication date Jun 16, 2011
- Junichi KIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED WIRING BOARD
- Publication number 20100146779
- Publication date Jun 17, 2010
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED PRINTED WIRING BOARD
- Publication number 20100147569
- Publication date Jun 17, 2010
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080093739
- Publication date Apr 24, 2008
- Junichi KIMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTU...
- Publication number 20080073024
- Publication date Mar 27, 2008
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module and method of manufacturing the same
- Publication number 20080017969
- Publication date Jan 24, 2008
- Junichi Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module, method of manufacturing module, and electronic apparatus us...
- Publication number 20070049122
- Publication date Mar 1, 2007
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer module and method of manufacturing the same
- Publication number 20060261472
- Publication date Nov 23, 2006
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component-embedded printed wiring board and method of manufacturing...
- Publication number 20060260122
- Publication date Nov 23, 2006
- Kazuhiko Honjo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-frequency module and electronic device using the module
- Publication number 20060072292
- Publication date Apr 6, 2006
- Tomohide Ogura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of laminated substrate, and manufacturing appa...
- Publication number 20050233122
- Publication date Oct 20, 2005
- Mikio Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated circuit board and its manufacturing method, and manufactu...
- Publication number 20050117312
- Publication date Jun 2, 2005
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scrambler, descrambler and the program for scrambling or descrambling
- Publication number 20040075773
- Publication date Apr 22, 2004
- Junichi Kimura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Multi-layer board
- Publication number 20030168727
- Publication date Sep 11, 2003
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module and method of manufacturing the module
- Publication number 20030169571
- Publication date Sep 11, 2003
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module
- Publication number 20030098505
- Publication date May 29, 2003
- Junichi Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Junichi Kimura

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device having a plurality of top surface connection t...

Semiconductor mounting substrate and method for manufacturing the same

Semiconductor mounting substrate and method for manufacturing the same

Module and method of manufacturing the same

Method of manufacturing component-embedded printed wiring board

Multilayer module and method of manufacturing the same

Module, method of manufacturing module, and electronic apparatus us...

Laminated circuit board and its manufacturing method, and manufactu...

High-frequency module and electronic device using the module

Multi-layer board

Semiconductor module

Module and method of manufacturing the module

Method of producing high-frequency modules

High-frequency module and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PROVIDED WITH ELECTRICAL ELEMENT AND TEMPERATURE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING COMPONENT-EMBEDDED PRINTED WIRING BOARD

COMPONENT-EMBEDDED PRINTED WIRING BOARD

SEMICONDUCTOR MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTU...

Module and method of manufacturing the same

Module, method of manufacturing module, and electronic apparatus us...

Multilayer module and method of manufacturing the same

Component-embedded printed wiring board and method of manufacturing...

High-frequency module and electronic device using the module

Manufacturing method of laminated substrate, and manufacturing appa...

Laminated circuit board and its manufacturing method, and manufactu...

Scrambler, descrambler and the program for scrambling or descrambling

Multi-layer board

Module and method of manufacturing the module

Semiconductor module