Junli Shentu

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Hangzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package structure of light emitter and light sensor with light-bloc...
- Patent number 10,333,019
- Issue date Jun 25, 2019
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Junli Shentu
- G01 - MEASURING TESTING
Information Patent Grant
Chip package assembly and manufacturing method thereof
- Patent number 9,508,677
- Issue date Nov 29, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170345961
- Publication date Nov 30, 2017
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Junli Shentu
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20160284663
- Publication date Sep 29, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS