Junqing He

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Dongguan, CN

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Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench FET Device and Method of Manufacturing Trench FET Device
- Publication number 20240113186
- Publication date Apr 4, 2024
- Huawei Technologies Co., Ltd
- Mo huai Chang
- H01 - BASIC ELECTRIC ELEMENTS