Junyoung Oh

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,087,650
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and semiconductor packages including the same
- Patent number 11,742,294
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,742,329
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for conducting plasma surface treatment, board treatment...
- Patent number 11,728,142
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,688,656
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor package and package-on-package
- Patent number 11,508,713
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,101,243
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Jongho Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...
- Publication number 20230343560
- Publication date Oct 26, 2023
- New Power Plasma Co., Ltd.
- Junyoung Oh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230282533
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20220093519
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210375831
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210320042
- Publication date Oct 14, 2021
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE
- Publication number 20210242190
- Publication date Aug 5, 2021
- Samsung Electronics Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...
- Publication number 20210066046
- Publication date Mar 4, 2021
- New Power Plasma Co., Ltd.
- Junyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200350288
- Publication date Nov 5, 2020
- Samsung Electronics Co., Ltd.
- Jongho PARK
- H01 - BASIC ELECTRIC ELEMENTS

Junyoung Oh

Person

Patents Grantslast 30 patents

Interposer and semiconductor package including the same

Interposers and semiconductor packages including the same

Semiconductor package

Apparatus for conducting plasma surface treatment, board treatment...

Interposer and semiconductor package including the same

Methods of manufacturing semiconductor package and package-on-package

Semiconductor package

Patents Applicationslast 30 patents

APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INTERPOSERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE

APPARATUS FOR CONDUCTING PLASMA SURFACE TREATMENT, BOARD TREATMENT...

SEMICONDUCTOR PACKAGE