Justin Oberst

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for flow isolation and focusing during electr...
- Patent number 11,001,934
- Issue date May 11, 2021
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for achieving uniformity across a redistributio...
- Patent number 10,714,436
- Issue date Jul 14, 2020
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...
- Publication number 20240312778
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Stephen J. BANIK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER
- Publication number 20230212773
- Publication date Jul 6, 2023
- LAM RESEARCH CORPORATION
- Justin OBERST
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEAL EDGE EXCLUSION ENGINEERING TO MAINTAIN MATERIAL INTEGRITY A...
- Publication number 20230167571
- Publication date Jun 1, 2023
- LAM RESEARCH CORPORATION
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20220275531
- Publication date Sep 1, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES
- Publication number 20220010446
- Publication date Jan 13, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALTERNATIVE INTEGRATION FOR REDISTRIBUTION LAYER PROCESS
- Publication number 20210193514
- Publication date Jun 24, 2021
- LAM RESEARCH CORPORATION
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CHEMICAL AND HEATED WETTING OF SUBSTRATES PRI...
- Publication number 20200035484
- Publication date Jan 30, 2020
- LAM RESEARCH CORPORATION
- Justin OBERST
- B08 - CLEANING
Information Patent Application
METHODS AND APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTR...
- Publication number 20190055665
- Publication date Feb 21, 2019
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR ACHIEVING UNIFORMITY ACROSS A REDISTRIBUTIO...
- Publication number 20170243839
- Publication date Aug 24, 2017
- LAM RESEARCH CORPORATION
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS

Justin Oberst

Person

Patents Grantslast 30 patents

Alternative integration for redistribution layer process

Methods and apparatus for flow isolation and focusing during electr...

Systems and methods for achieving uniformity across a redistributio...

Patents Applicationslast 30 patents

TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...

SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

LIPSEAL EDGE EXCLUSION ENGINEERING TO MAINTAIN MATERIAL INTEGRITY A...

DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES

ALTERNATIVE INTEGRATION FOR REDISTRIBUTION LAYER PROCESS

SYSTEM AND METHOD FOR CHEMICAL AND HEATED WETTING OF SUBSTRATES PRI...

METHODS AND APPARATUS FOR FLOW ISOLATION AND FOCUSING DURING ELECTR...

SYSTEMS AND METHODS FOR ACHIEVING UNIFORMITY ACROSS A REDISTRIBUTIO...