TREA

Jyong-Yue Tian

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  • Taichung County, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    MEMS microphone package
    • Patent number 10,362,377
    • Issue date Jul 23, 2019
    • Lingsen Precision Industries, Ltd.
    • Hsien-Ken Liao
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    MEMS microphone package
    • Patent number 10,362,406
    • Issue date Jul 23, 2019
    • LINGSEN PRECISION INDSUTRIES, LTD.
    • Yao-Ting Yeh
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    MEMS microphone package
    • Patent number 10,299,046
    • Issue date May 21, 2019
    • Lingsen Precision Industries, Ltd.
    • Hsien-Ken Liao
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microelectromechanical microphone carrier module
    • Patent number 8,254,619
    • Issue date Aug 28, 2012
    • Lingsen Precision Industries Ltd.
    • Jen-Chuan Yeh
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

  • Information Patent Application

    MEMS MICROPHONE PACKAGE
    • Publication number 20180063615
    • Publication date Mar 1, 2018
    • LINGSEN PRECISION INDUSTRIES, LTD.
    • Hsien-Ken LIAO
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MICROELECTROMECHANICAL MICROPHONE PACKAGE STRUCTURE
    • Publication number 20180063616
    • Publication date Mar 1, 2018
    • LINGSEN PRECISION INDUSTRIES, LTD.
    • Hsien-Ken LIAO
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS MICROPHONE PACKAGE
    • Publication number 20180063645
    • Publication date Mar 1, 2018
    • LINGSEN PRECISION INDUSTRIES, LTD.
    • Yao-Ting YEH
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MEMS MICROPHONE PACKAGE
    • Publication number 20180063646
    • Publication date Mar 1, 2018
    • LINGSEN PRECISION INDUSTRIES, LTD.
    • Hsien-Ken LIAO
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MICROELECTROMECHANICAL MICROPHONE CARRIER MODULE
    • Publication number 20110293119
    • Publication date Dec 1, 2011
    • LINGSEN PRECISION INDUSTRIES LTD.
    • Jen-Chuan YEH
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MEMS MODULE PACKAGE
    • Publication number 20110180924
    • Publication date Jul 28, 2011
    • Lingsen Precision Industries, Ltd.
    • Jyong-Yue TIAN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    MICROELECTROMECHANICAL SYSTEM MICROPHONE PACKAGE
    • Publication number 20100096711
    • Publication date Apr 22, 2010
    • LINGSEN PRECISION INDUSTRIES, LTD.
    • Jyong-Yue TIAN
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE