Jyu-Horng Shieh

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,153,350
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,127,489
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yen Peng
Information Patent Grant
Self-aligned double patterning
- Patent number 12,068,167
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with magnetic tunnel junctions
- Patent number 11,980,040
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 11,944,017
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yen Peng
Information Patent Grant
Double patterning method
- Patent number 11,923,202
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer etching process for integrated circuit design
- Patent number 11,854,820
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 11,854,766
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient protection layer in MTJ manufacturing
- Patent number 11,856,865
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 11,796,922
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ru-Gun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,800,812
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yen Peng
Information Patent Grant
Self-aligned double patterning
- Patent number 11,784,056
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,735,469
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 11,710,657
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 11,683,991
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning
- Patent number 11,676,821
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etching stop layer in magnetic tunnel junction memory cells
- Patent number 11,665,971
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 11,588,107
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning method
- Patent number 11,482,426
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method for manufacturing the same
- Patent number 11,456,210
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gradient protection layer in MTJ manufacturing
- Patent number 11,411,176
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 11,404,245
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for back end of line semiconductor device proc...
- Patent number 11,398,405
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,322,393
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 11,271,150
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure of a semiconductor device
- Patent number 11,217,476
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning method
- Patent number 11,177,138
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug without seam hole and methods of forming the same
- Patent number 11,127,630
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal etching stop layer in magnetic tunnel junction memory cells
- Patent number 11,101,429
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal Contacts on Metal Gates and Methods Thereof
- Publication number 20240379378
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Pang-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MAGNETIC TUNNEL JUNCTIONS
- Publication number 20240251568
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
- G11 - INFORMATION STORAGE
Information Patent Application
GRADIENT PROTECTION LAYER IN MTJ MANUFACTURING
- Publication number 20240099150
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
Information Patent Application
DC Bias in Plasma Process
- Publication number 20240071722
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240019787
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ru-Gun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20240023457
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen PENG
Information Patent Application
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...
- Publication number 20230360966
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Device
- Publication number 20230343636
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Double Patterning
- Publication number 20230282488
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230276715
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- TAI-YEN PENG
Information Patent Application
Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells
- Publication number 20230263068
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20230210028
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen PENG
Information Patent Application
Dual Damascene Structure in Forming Source/Drain Contacts
- Publication number 20230155001
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220384241
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Double Patterning
- Publication number 20220384201
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...
- Publication number 20220384243
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gradient Protection Layer in MTJ Manufacturing
- Publication number 20220367794
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING METHOD
- Publication number 20220359222
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Back End of Line Semiconductor Device Proc...
- Publication number 20220359274
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC Bias in Plasma Process
- Publication number 20220359158
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20220262674
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20220190237
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115266
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-WEI HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...
- Publication number 20220102192
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Via Formation Using Spacers
- Publication number 20220102212
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells
- Publication number 20210384418
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20210343937
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Magnetic Tunnel Junctions
- Publication number 20210313396
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yen Peng
- G11 - INFORMATION STORAGE
Information Patent Application
DOUBLE PATTERNING METHOD
- Publication number 20210143020
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Device
- Publication number 20210134657
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS

Jyu-Horng Shieh

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor devices

Middle-of-line interconnect structure having air gap and method of...

Integrated circuit structure

Self-aligned double patterning

Semiconductor device with magnetic tunnel junctions

Semiconductor structure and manufacturing method of the same

Double patterning method

Spacer etching process for integrated circuit design

DC bias in plasma process

Gradient protection layer in MTJ manufacturing

Method of manufacturing semiconductor devices

Integrated circuit

Self-aligned double patterning

Method of forming a semiconductor device

Middle-of-line interconnect structure having air gap and method of...

Semiconductor structure and manufacturing method of the same

Self-aligned double patterning

Metal etching stop layer in magnetic tunnel junction memory cells

Integrated circuit structure

Double patterning method

Integrated circuit and method for manufacturing the same

Gradient protection layer in MTJ manufacturing

DC bias in plasma process

Method and apparatus for back end of line semiconductor device proc...

Method of forming a semiconductor device

Integrated circuit

Method of forming an interconnect structure of a semiconductor device

Double patterning method

Contact plug without seam hole and methods of forming the same

Metal etching stop layer in magnetic tunnel junction memory cells

Patents Applicationslast 30 patents

Metal Contacts on Metal Gates and Methods Thereof

SEMICONDUCTOR DEVICE WITH MAGNETIC TUNNEL JUNCTIONS

GRADIENT PROTECTION LAYER IN MTJ MANUFACTURING

DC Bias in Plasma Process

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT

Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...

Method of Forming a Semiconductor Device

Self-Aligned Double Patterning

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells

INTEGRATED CIRCUIT STRUCTURE

Dual Damascene Structure in Forming Source/Drain Contacts

INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME

Self-Aligned Double Patterning

Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...

Gradient Protection Layer in MTJ Manufacturing

DOUBLE PATTERNING METHOD

Method and Apparatus for Back End of Line Semiconductor Device Proc...

DC Bias in Plasma Process

METHOD OF FORMING A SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT

INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME

Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...

Self-Aligned Via Formation Using Spacers

Metal Etching Stop Layer in Magnetic Tunnel Junction Memory Cells

INTEGRATED CIRCUIT STRUCTURE

Semiconductor Device With Magnetic Tunnel Junctions

DOUBLE PATTERNING METHOD

Method of Forming a Semiconductor Device