Kai-Hung HSIAO

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer processing system and method
- Patent number 11,901,207
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER TRANSPORT METHOD AND APPARATUS
- Publication number 20240079263
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Hung HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD
- Publication number 20220406639
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hung HSIAO
- H01 - BASIC ELECTRIC ELEMENTS