Kai Liu

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin film resistor (TFR) device structure for high performance radi...
- Patent number 12,040,268
- Issue date Jul 16, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High harmonic performance radio frequency filter
- Patent number 11,757,423
- Issue date Sep 12, 2023
- QUALCOMM Incorporated
- Kai Liu
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Thermal paths for glass substrates
- Patent number 11,177,065
- Issue date Nov 16, 2021
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband filter with resonators and inductors
- Patent number 11,121,699
- Issue date Sep 14, 2021
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for thermal matching of integrated circuits
- Patent number 10,923,436
- Issue date Feb 16, 2021
- QUALCOMM Incorporated
- Bin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductors for power management circuits
- Patent number 10,879,169
- Issue date Dec 29, 2020
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband filter including an acoustic resonator chip integrated wit...
- Patent number 10,749,499
- Issue date Aug 18, 2020
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film variable metal-oxide-semiconductor (MOS) capacitor for pa...
- Patent number 10,741,702
- Issue date Aug 11, 2020
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced substrate
- Patent number 10,453,774
- Issue date Oct 22, 2019
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional high quality passive structure with conductive pi...
- Patent number 10,433,425
- Issue date Oct 1, 2019
- QUALCOMM Incorporated
- Kai Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 10,211,171
- Issue date Feb 19, 2019
- STATS ChipPAC Pte. Ltd.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 9,806,040
- Issue date Oct 31, 2017
- STATS ChipPAC Pte. Ltd.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RF FEM with LC filter an...
- Patent number 9,704,857
- Issue date Jul 11, 2017
- STATS ChipPAC, Pte. Ltd.
- HyunTai Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for performing commands from a remote source
- Patent number 9,571,489
- Issue date Feb 14, 2017
- Sony Corporation
- Nobukazu Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming directional RF coupler w...
- Patent number 9,484,334
- Issue date Nov 1, 2016
- STATS ChipPAC Pte. Ltd.
- Robert C. Frye
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device including integrated passive device formed ove...
- Patent number 9,368,563
- Issue date Jun 14, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming IPD in fan-out wafer lev...
- Patent number 9,343,396
- Issue date May 17, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RF FEM and RF transceive...
- Patent number 9,190,340
- Issue date Nov 17, 2015
- STATS ChipPAC, Ltd.
- YongTaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enabling wireless device communication
- Patent number 9,185,066
- Issue date Nov 10, 2015
- Sony Corporation
- Ludovic Douillet
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method of forming RF balun having reduced...
- Patent number 8,981,866
- Issue date Mar 17, 2015
- STATS ChipPAC, Ltd.
- Robert C. Frye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having balanced band-pass filter implemented w...
- Patent number 8,975,980
- Issue date Mar 10, 2015
- STATS ChipPAC, Ltd.
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of simultaneous testing of multiple...
- Patent number 8,921,127
- Issue date Dec 30, 2014
- STATS ChipPAC, Ltd.
- Robert C. Frye
- G01 - MEASURING TESTING
Information Patent Grant
Miniaturized wide-band baluns for RF applications
- Patent number 8,823,466
- Issue date Sep 2, 2014
- STATS ChipPAC, Ltd.
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Miniaturized wide-band baluns for RF applications
- Patent number 8,803,630
- Issue date Aug 12, 2014
- STATS ChipPAC, Ltd.
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming high-attenuation balance...
- Patent number 8,791,775
- Issue date Jul 29, 2014
- STATS ChipPAC, Ltd.
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method and apparatus for enabling device communication and control...
- Patent number 8,782,150
- Issue date Jul 15, 2014
- Sony Corporation
- Nobukazu Sugiyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming integrated passive devic...
- Patent number 8,624,353
- Issue date Jan 7, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device having balanced band-pass filter implemented w...
- Patent number 8,576,026
- Issue date Nov 5, 2013
- STATS ChipPAC, Ltd.
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Miniaturized wide-band baluns for RF applications
- Patent number 8,564,382
- Issue date Oct 22, 2013
- STATS ChipPAC, Ltd.
- Kai Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of integrating balun and RF coupler...
- Patent number 8,390,391
- Issue date Mar 5, 2013
- STATS ChipPAC, Ltd.
- Robert C. Frye
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...
- Publication number 20240322417
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
- Publication number 20240321507
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...
- Publication number 20240304545
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...
- Publication number 20240258363
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE
- Publication number 20240258995
- Publication date Aug 1, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...
- Publication number 20240204039
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
- Publication number 20240105760
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...
- Publication number 20240038439
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS
- Publication number 20240021353
- Publication date Jan 18, 2024
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
- Publication number 20240006308
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...
- Publication number 20230395491
- Publication date Dec 7, 2023
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...
- Publication number 20230307355
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER
- Publication number 20230275004
- Publication date Aug 31, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKEND AND ACOUSTIC PROCESS INTEGRATION FOR HIGH-Q FILTER
- Publication number 20230121565
- Publication date Apr 20, 2023
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH HARMONIC PERFORMANCE RADIO FREQUENCY FILTER
- Publication number 20220406288
- Publication date Dec 22, 2022
- QUALCOMM Incorporated
- Kai LIU
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
THERMAL PATHS FOR GLASS SUBSTRATES
- Publication number 20210304944
- Publication date Sep 30, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND FILTER WITH RESONATORS AND INDUCTORS
- Publication number 20210257989
- Publication date Aug 19, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20210057404
- Publication date Feb 25, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICES COMPRISING UNIFORM METAL LAYER THICKNESS ACROSS...
- Publication number 20210005545
- Publication date Jan 7, 2021
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ON GLASS PLANARIZATION
- Publication number 20200350124
- Publication date Nov 5, 2020
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR THERMAL MATCHING OF INTEGRATED CIRCUITS
- Publication number 20200312786
- Publication date Oct 1, 2020
- QUALCOMM Incorporated
- Bin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDEBAND FILTER WITH RESONATORS AND INDUCTORS
- Publication number 20200266512
- Publication date Aug 20, 2020
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTORS FOR POWER MANAGEMENT CIRCUITS
- Publication number 20200211958
- Publication date Jul 2, 2020
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM VARIABLE METAL-OXIDE-SEMICONDUCTOR (MOS) CAPACITOR FOR PA...
- Publication number 20200111921
- Publication date Apr 9, 2020
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES
- Publication number 20200091094
- Publication date Mar 19, 2020
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WIDEBAND FILTER INCLUDING AN ACOUSTIC RESONATOR CHIP INTEGRATED WIT...
- Publication number 20200076405
- Publication date Mar 5, 2020
- QUALCOMM Incorporated
- Kai LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20180012851
- Publication date Jan 11, 2018
- STATS ChipPAC Pte Ltd.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna In Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20170033062
- Publication date Feb 2, 2017
- STATS ChipPAC Pte Ltd.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Integrated Passive Devic...
- Publication number 20140084415
- Publication date Mar 27, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Balanced Band-Pass Filter Implemented w...
- Publication number 20140002207
- Publication date Jan 2, 2014
- STATS ChipPAC, Ltd.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thin film resistor (TFR) device structure for high performance radi...

High harmonic performance radio frequency filter

Thermal paths for glass substrates

Wideband filter with resonators and inductors

Techniques for thermal matching of integrated circuits

Integrated inductors for power management circuits

Wideband filter including an acoustic resonator chip integrated wit...

Thin-film variable metal-oxide-semiconductor (MOS) capacitor for pa...

Thermally enhanced substrate

Three-dimensional high quality passive structure with conductive pi...

Antenna in embedded wafer-level ball-grid array package

Antenna in embedded wafer-level ball-grid array package

Semiconductor device and method of forming RF FEM with LC filter an...

System and method for performing commands from a remote source

Semiconductor device and method of forming directional RF coupler w...

Semiconductor device including integrated passive device formed ove...

Semiconductor device and method of forming IPD in fan-out wafer lev...

Semiconductor device and method of forming RF FEM and RF transceive...

Enabling wireless device communication

Semiconductor device and method of forming RF balun having reduced...

Semiconductor device having balanced band-pass filter implemented w...

Semiconductor device and method of simultaneous testing of multiple...

Miniaturized wide-band baluns for RF applications

Miniaturized wide-band baluns for RF applications

Semiconductor device and method of forming high-attenuation balance...

Method and apparatus for enabling device communication and control...

Semiconductor device and method of forming integrated passive devic...

Semiconductor device having balanced band-pass filter implemented w...

Miniaturized wide-band baluns for RF applications

Semiconductor device and method of integrating balun and RF coupler...

Patents Applicationslast 30 patents

RADIO FREQUENCY OSCILLATOR WITH CERAMIC RESONATOR AND SURFACE-MOUNT...

THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES

COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-L...

INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MAT...

COMPACT HYBRID ACOUSTIC WAVE FILTER STRUCTURE

DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE IN...

INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD

INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM IN...

THREE-DIMENSIONAL VERTICAL CO-SPIRAL INDUCTORS

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...

THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...

INTEGRATED DEVICE AND INTEGRATED PASSIVE DEVICE COMPRISING MAGNETIC...

CAPACITOR EMBEDDED 3D RESONATOR FOR BROADBAND FILTER

BACKEND AND ACOUSTIC PROCESS INTEGRATION FOR HIGH-Q FILTER

HIGH HARMONIC PERFORMANCE RADIO FREQUENCY FILTER

THERMAL PATHS FOR GLASS SUBSTRATES

WIDEBAND FILTER WITH RESONATORS AND INDUCTORS

ON-DIE ELECTROSTATIC DISCHARGE PROTECTION

INTEGRATED DEVICES COMPRISING UNIFORM METAL LAYER THICKNESS ACROSS...

PASSIVE ON GLASS PLANARIZATION

TECHNIQUES FOR THERMAL MATCHING OF INTEGRATED CIRCUITS

WIDEBAND FILTER WITH RESONATORS AND INDUCTORS

INTEGRATED INDUCTORS FOR POWER MANAGEMENT CIRCUITS

THIN-FILM VARIABLE METAL-OXIDE-SEMICONDUCTOR (MOS) CAPACITOR FOR PA...

INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES

WIDEBAND FILTER INCLUDING AN ACOUSTIC RESONATOR CHIP INTEGRATED WIT...

Antenna in Embedded Wafer-Level Ball-Grid Array Package

Antenna In Embedded Wafer-Level Ball-Grid Array Package

Semiconductor Device and Method of Forming Integrated Passive Devic...

Semiconductor Device Having Balanced Band-Pass Filter Implemented w...