Kai Ma

Person

Mountain View, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing for copper dishing control
- Patent number 12,033,964
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD deposition and anneal of multi-layer metal-dielectric film
- Patent number 10,879,177
- Issue date Dec 29, 2020
- Applied Materials, Inc.
- Minrui Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Post treatment methods for oxide layers on semiconductor devices
- Patent number 9,431,237
- Issue date Aug 30, 2016
- Applied Materials, Inc.
- Kai Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiant anneal throughput optimization and thermal history minimiza...
- Patent number 8,319,149
- Issue date Nov 27, 2012
- Applied Materials, Inc.
- Kai Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of aligning and positioning a cold substrate o...
- Patent number 8,309,475
- Issue date Nov 13, 2012
- Applied Materials, Inc.
- Blake Koelmel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method of aligning and positioning a cold substrate o...
- Patent number 8,097,543
- Issue date Jan 17, 2012
- Applied Materials, Inc.
- Blake Koelmel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual frequency low temperature oxidation of a semiconductor device
- Patent number 8,043,981
- Issue date Oct 25, 2011
- Applied Materials, Inc.
- Kai Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate process using an optically writable carbon-...
- Patent number 7,429,532
- Issue date Sep 30, 2008
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for low temperature plasma deposition of an optical absorpt...
- Patent number 7,422,775
- Issue date Sep 9, 2008
- Applied Materials, Inc.
- Kartik Ramaswamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper conductor annealing process employing high speed optical ann...
- Patent number 7,335,611
- Issue date Feb 26, 2008
- Applied Materials, Inc.
- Kartik Ramaswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate process using a low temperature deposited c...
- Patent number 7,323,401
- Issue date Jan 29, 2008
- Applied Materials, Inc.
- Kartik Ramaswamy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature plasma deposition process for carbon layer deposition
- Patent number 7,312,162
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- Kartik Ramaswamy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper barrier reflow process employing high speed optical annealing
- Patent number 7,312,148
- Issue date Dec 25, 2007
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor junction formation process including low temperature...
- Patent number 7,109,098
- Issue date Sep 19, 2006
- Applied Materials, Inc.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL
- Publication number 20230066610
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PVD DEPOSITION AND ANNEAL OF MULTI-LAYER METAL-DIELECTRIC FILM
- Publication number 20160372330
- Publication date Dec 22, 2016
- Applied Materials, Inc.
- Minrui YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE O...
- Publication number 20120122253
- Publication date May 17, 2012
- Applied Materials, Inc.
- Blake Koelmel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Post Treatment Methods for Oxide Layers on Semiconductor Devices
- Publication number 20100267248
- Publication date Oct 21, 2010
- Applied Materials, Inc.
- Kai Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Frequency Low Temperature Oxidation of a Semiconductor Device
- Publication number 20100267247
- Publication date Oct 21, 2010
- Applied Materials, Inc.
- Kai Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIANT ANNEAL THROUGHPUT OPTIMIZATION AND THERMAL HISTORY MINIMIZA...
- Publication number 20090261078
- Publication date Oct 22, 2009
- Applied Materials, Inc.
- KAI MA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE O...
- Publication number 20090181553
- Publication date Jul 16, 2009
- Blake Koelmel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper barrier reflow process employing high speed optical annealing
- Publication number 20070032004
- Publication date Feb 8, 2007
- APPLIED MATERIALS, INC.
- Kartik Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate process using a low temperature deposited c...
- Publication number 20070032054
- Publication date Feb 8, 2007
- APPLIED MATERIALS, INC.
- Kartik Ramaswamy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor substrate process using an optically writable carbon-...
- Publication number 20070032082
- Publication date Feb 8, 2007
- APPLIED MATERIALS, INC.
- Kartik Ramaswamy
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Copper conductor annealing process employing high speed optical ann...
- Publication number 20070032095
- Publication date Feb 8, 2007
- APPLIED MATERIALS, INC.
- Kartik Ramaswamy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low temperature absorption layer deposition and high speed optical...
- Publication number 20060260545
- Publication date Nov 23, 2006
- Kartik Ramaswamy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low temperature plasma deposition process for carbon layer deposition
- Publication number 20060264060
- Publication date Nov 23, 2006
- Kartik Ramaswamy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for low temperature plasma deposition of an optical absorpt...
- Publication number 20060263540
- Publication date Nov 23, 2006
- Kartik Ramaswamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate processing platform allowing processing in different ambi...
- Publication number 20060240680
- Publication date Oct 26, 2006
- APPLIED MATERIALS, INC.
- Yoshitaka Yokota
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Chemical mechanical polishing for copper dishing control

PVD deposition and anneal of multi-layer metal-dielectric film

Post treatment methods for oxide layers on semiconductor devices

Radiant anneal throughput optimization and thermal history minimiza...

Apparatus and method of aligning and positioning a cold substrate o...

Apparatus and method of aligning and positioning a cold substrate o...

Dual frequency low temperature oxidation of a semiconductor device

Semiconductor substrate process using an optically writable carbon-...

Process for low temperature plasma deposition of an optical absorpt...

Copper conductor annealing process employing high speed optical ann...

Semiconductor substrate process using a low temperature deposited c...

Low temperature plasma deposition process for carbon layer deposition

Copper barrier reflow process employing high speed optical annealing

Semiconductor junction formation process including low temperature...

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL

PVD DEPOSITION AND ANNEAL OF MULTI-LAYER METAL-DIELECTRIC FILM

APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE O...

Post Treatment Methods for Oxide Layers on Semiconductor Devices

Dual Frequency Low Temperature Oxidation of a Semiconductor Device

RADIANT ANNEAL THROUGHPUT OPTIMIZATION AND THERMAL HISTORY MINIMIZA...

APPARATUS AND METHOD OF ALIGNING AND POSITIONING A COLD SUBSTRATE O...

Copper barrier reflow process employing high speed optical annealing

Semiconductor substrate process using a low temperature deposited c...

Semiconductor substrate process using an optically writable carbon-...

Copper conductor annealing process employing high speed optical ann...

Low temperature absorption layer deposition and high speed optical...

Low temperature plasma deposition process for carbon layer deposition

Process for low temperature plasma deposition of an optical absorpt...

Substrate processing platform allowing processing in different ambi...