Kai Wang

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
High-density low-loss cable and connector assembly
- Patent number 11,276,911
- Issue date Mar 15, 2022
- Intel Corporation
- Jingbo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth connector for internal and external IO interfaces
- Patent number 9,391,378
- Issue date Jul 12, 2016
- Intel Corporation
- Michael Leddige
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING...
- Publication number 20240421025
- Publication date Dec 19, 2024
- Intel Corporation
- Lianchang DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid-Proof Edge Connector Designs for Immersion Cooling
- Publication number 20230318211
- Publication date Oct 5, 2023
- Intel Corporation
- Xiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY LOW-LOSS CABLE AND CONNECTOR ASSEMBLY
- Publication number 20190051963
- Publication date Feb 14, 2019
- Intel Corporation
- Jingbo LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH CONNECTOR FOR INTERNAL AND EXTERNAL IO INTERFACES
- Publication number 20140377968
- Publication date Dec 25, 2014
- Michael Leddige
- H01 - BASIC ELECTRIC ELEMENTS