Kalyan C. Kolluru

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gate-all-around integrated circuit structures having devices with s...
- Patent number 11,908,856
- Issue date Feb 20, 2024
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures including varactors
- Patent number 11,869,987
- Issue date Jan 9, 2024
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having adjacent deep...
- Patent number 11,837,641
- Issue date Dec 5, 2023
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having devices with c...
- Patent number 11,824,116
- Issue date Nov 21, 2023
- Intel Corporation
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures including backside vias
- Patent number 11,791,331
- Issue date Oct 17, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-less FinFET diode architectures with backside metal conta...
- Patent number 11,652,107
- Issue date May 16, 2023
- Intel Corporation
- Nicholas Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures including varactors
- Patent number 11,417,781
- Issue date Aug 16, 2022
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistors with dual thickness gate dielectrics
- Patent number 11,145,732
- Issue date Oct 12, 2021
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods, and apparatuses for implementing die recovery in...
- Patent number 10,249,597
- Issue date Apr 2, 2019
- Intel Corporation
- Lakshminarayana Pappu
- G11 - INFORMATION STORAGE
Information Patent Grant
Pulsed testing of through-body-vias
- Patent number 9,891,269
- Issue date Feb 13, 2018
- Intel Corporation
- Kalyan C. Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge sharing testing of through-body-vias
- Patent number 9,513,330
- Issue date Dec 6, 2016
- Intel Corporation
- Mladenko Vukic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL
- Publication number 20240332285
- Publication date Oct 3, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL
- Publication number 20240332432
- Publication date Oct 3, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTED SUB-FIN DIODES
- Publication number 20240170581
- Publication date May 23, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH S...
- Publication number 20240145471
- Publication date May 2, 2024
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODES WITH BACKSIDE CONTACT
- Publication number 20240088131
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH INTEGRATED DIODES
- Publication number 20240088133
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TARGETED SUB-FIN ETCH DEPTH
- Publication number 20240088134
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN
- Publication number 20240088132
- Publication date Mar 14, 2024
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICES WITH EXTENDED DRAIN
- Publication number 20240088136
- Publication date Mar 14, 2024
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP...
- Publication number 20240055497
- Publication date Feb 15, 2024
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH C...
- Publication number 20240038889
- Publication date Feb 1, 2024
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT
- Publication number 20230420578
- Publication date Dec 28, 2023
- Intel Corporation
- Ayan Kar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH DIODES INTEGRATED IN SUBFINS
- Publication number 20230420443
- Publication date Dec 28, 2023
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20230402449
- Publication date Dec 14, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-EPITAXIAL ELECTRICAL COUPLING BETWEEN A FRONT SIDE TRENCH CONNE...
- Publication number 20230317850
- Publication date Oct 5, 2023
- Intel Corporation
- Shaun MILLS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
- Publication number 20230087444
- Publication date Mar 23, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
- Publication number 20230089395
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
- Publication number 20230088578
- Publication date Mar 23, 2023
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220415925
- Publication date Dec 29, 2022
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS SILICON CONTROLLED RECTIFIER (SCR) INTEGRATED CIRCUI...
- Publication number 20220415881
- Publication date Dec 29, 2022
- Intel Corporation
- Rui MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRU...
- Publication number 20220416022
- Publication date Dec 29, 2022
- Intel Corporation
- Nicholas THOMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DIODE FOR BACK-SIDE POWER DELIVE...
- Publication number 20220415877
- Publication date Dec 29, 2022
- Intel Corporation
- Benjamin Orr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS DIODE, BIPOLAR AND FEEDTHROUGH INTEGRATED CIRCUIT ST...
- Publication number 20220415880
- Publication date Dec 29, 2022
- Intel Corporation
- Ayan KAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE...
- Publication number 20220406773
- Publication date Dec 22, 2022
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES
- Publication number 20220399277
- Publication date Dec 15, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES INCLUDING VARACTORS
- Publication number 20220344519
- Publication date Oct 27, 2022
- Intel Corporation
- Ayan KAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES
- Publication number 20220102385
- Publication date Mar 31, 2022
- Intel Corporation
- Biswajeet GUHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20220077140
- Publication date Mar 10, 2022
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES INCLUDING VARACTORS
- Publication number 20210305436
- Publication date Sep 30, 2021
- Intel Corporation
- Ayan KAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS
- Publication number 20210202472
- Publication date Jul 1, 2021
- Intel Corporation
- Nicholas A. Thomson
- H01 - BASIC ELECTRIC ELEMENTS

Kalyan C. Kolluru

Person

Patents Grantslast 30 patents

Gate-all-around integrated circuit structures having devices with s...

Gate-all-around integrated circuit structures including varactors

Gate-all-around integrated circuit structures having adjacent deep...

Gate-all-around integrated circuit structures having devices with c...

Integrated circuit structures including backside vias

Substrate-less FinFET diode architectures with backside metal conta...

Gate-all-around integrated circuit structures including varactors

Field-effect transistors with dual thickness gate dielectrics

Systems, methods, and apparatuses for implementing die recovery in...

Pulsed testing of through-body-vias

Charge sharing testing of through-body-vias

Patents Applicationslast 30 patents

CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL

VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL

BACKSIDE CONTACTED SUB-FIN DIODES

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH S...

DIODES WITH BACKSIDE CONTACT

TRANSISTOR DEVICES WITH INTEGRATED DIODES

TARGETED SUB-FIN ETCH DEPTH

WIDE CHANNEL DIODE STRUCTURE INCLUDING SUB-FIN

TRANSISTOR DEVICES WITH EXTENDED DRAIN

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT DEEP...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEVICES WITH C...

VARACTOR DEVICE WITH BACKSIDE ELECTRICAL CONTACT

INTEGRATED CIRCUIT DEVICES WITH DIODES INTEGRATED IN SUBFINS

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

NON-EPITAXIAL ELECTRICAL COUPLING BETWEEN A FRONT SIDE TRENCH CONNE...

LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES

VERTICAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES

LATERAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES

SUBSTRATE-LESS LATERAL DIODE INTEGRATED CIRCUIT STRUCTURES

SUBSTRATE-LESS SILICON CONTROLLED RECTIFIER (SCR) INTEGRATED CIRCUI...

SUBSTRATE-LESS NANOWIRE-BASED LATERAL DIODE INTEGRATED CIRCUIT STRU...

ELECTROSTATIC DISCHARGE PROTECTION DIODE FOR BACK-SIDE POWER DELIVE...

SUBSTRATE-LESS DIODE, BIPOLAR AND FEEDTHROUGH INTEGRATED CIRCUIT ST...

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE...

SELECTIVE ROUTING THROUGH INTRA-CONNECT BRIDGE DIES

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES INCLUDING VARACTORS

SUBSTRATE-FREE INTEGRATED CIRCUIT STRUCTURES

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES INCLUDING VARACTORS

INTEGRATED CIRCUIT STRUCTURES INCLUDING BACKSIDE VIAS