Kambhampati Ramakrishna

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe-based mold array package heat spreader and fabrication me...
- Patent number 8,581,375
- Issue date Nov 12, 2013
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual molded multi-chip package system
- Patent number 8,558,399
- Issue date Oct 15, 2013
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package to package stacking system
- Patent number 8,395,251
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a component in an encapsul...
- Patent number 8,309,397
- Issue date Nov 13, 2012
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based mold array package heat spreader and fabrication me...
- Patent number 8,211,753
- Issue date Jul 3, 2012
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual molded multi-chip package system
- Patent number 8,178,982
- Issue date May 15, 2012
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging system with stacking and method of manufact...
- Patent number 8,106,496
- Issue date Jan 31, 2012
- Stats Chippac, Inc.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flexible substrate and reces...
- Patent number 8,050,047
- Issue date Nov 1, 2011
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flexible substrate and mound...
- Patent number 8,031,475
- Issue date Oct 4, 2011
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulant cavity integrated circuit package system and method of...
- Patent number 8,021,924
- Issue date Sep 20, 2011
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array-molded package heat spreader and fabrication method therefor
- Patent number 7,863,730
- Issue date Jan 4, 2011
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with an encapsulant cavity and me...
- Patent number 7,855,100
- Issue date Dec 21, 2010
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package for MEMS microphone assembly
- Patent number 7,795,078
- Issue date Sep 14, 2010
- STATS ChipPAC, Ltd.
- Kambhampati Ramakrishna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit package system
- Patent number 7,790,504
- Issue date Sep 7, 2010
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages and method therefor
- Patent number 7,622,800
- Issue date Nov 24, 2009
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for a large die
- Patent number 7,595,551
- Issue date Sep 29, 2009
- ST Assembly Test Services Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package for MEMS microphone assembly
- Patent number 7,550,828
- Issue date Jun 23, 2009
- Stats Chippac, Inc.
- Kambhampati Ramakrishna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor assembly including chip scale package and second subs...
- Patent number 7,429,787
- Issue date Sep 30, 2008
- Stats Chippac Ltd.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframe and method therefor
- Patent number 7,399,658
- Issue date Jul 15, 2008
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stacked package assembly having exposed substrate sur...
- Patent number 7,372,141
- Issue date May 13, 2008
- Stats Chippac Ltd.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting an integrated circuit package in an encapsulant...
- Patent number 7,364,945
- Issue date Apr 29, 2008
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 7,309,913
- Issue date Dec 18, 2007
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages and method therefor
- Patent number 7,242,091
- Issue date Jul 10, 2007
- Stats Chippac Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for optoelectronic devices
- Patent number 7,091,469
- Issue date Aug 15, 2006
- ST Assembly Test Services Ltd.
- Dean Paul Kossives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package for a die larger th...
- Patent number 6,927,479
- Issue date Aug 9, 2005
- ST Assembly Test Services Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages and method for the fabrication thereof
- Patent number 6,861,288
- Issue date Mar 1, 2005
- ST Assembly Test Services, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for die stacking applications and related die stacking co...
- Patent number 6,841,858
- Issue date Jan 11, 2005
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor package including stacked semicond...
- Patent number 6,650,019
- Issue date Nov 18, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced stacked die package
- Patent number 6,627,990
- Issue date Sep 30, 2003
- ST Assembly Test Service Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with spacer strips
- Patent number 6,531,784
- Issue date Mar 11, 2003
- Amkor Technology, Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME-BASED MOLD ARRAY PACKAGE HEAT SPREADER AND FABRICATION ME...
- Publication number 20120241929
- Publication date Sep 27, 2012
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM
- Publication number 20120193805
- Publication date Aug 2, 2012
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...
- Publication number 20120007217
- Publication date Jan 12, 2012
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...
- Publication number 20110018084
- Publication date Jan 27, 2011
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY
- Publication number 20090263937
- Publication date Oct 22, 2009
- STATS ChipPAC, Inc.
- Kambhampati Ramakrishna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND RECES...
- Publication number 20090016032
- Publication date Jan 15, 2009
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUND...
- Publication number 20090016033
- Publication date Jan 15, 2009
- Seng Guan Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20080296759
- Publication date Dec 4, 2008
- STATS ChipPAC, Inc.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20080179729
- Publication date Jul 31, 2008
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM
- Publication number 20080157402
- Publication date Jul 3, 2008
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY
- Publication number 20080157301
- Publication date Jul 3, 2008
- Stats ChipPAC, Inc
- Kambhampati Ramakrishna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES AND METHOD THEREFOR
- Publication number 20070228545
- Publication date Oct 4, 2007
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070210425
- Publication date Sep 13, 2007
- STATS ChipPAC Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor stacked package assembly having exposed substrate sur...
- Publication number 20060220209
- Publication date Oct 5, 2006
- STATS ChipPAC Ltd.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor assembly including chip scale package and second subs...
- Publication number 20060220210
- Publication date Oct 5, 2006
- STATS ChipPAC Ltd.
- Marcos Karnezos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging for optoelectronic devices
- Publication number 20050258216
- Publication date Nov 24, 2005
- Dean Paul Kossives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package for a large die
- Publication number 20050236702
- Publication date Oct 27, 2005
- STATS ChipPAC, Inc.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor packages
- Publication number 20050090050
- Publication date Apr 28, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based mold array package heat spreader and fabrication me...
- Publication number 20050046012
- Publication date Mar 3, 2005
- STATS ChipPAC Ltd.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array-molded package heat spreader and fabrication method therefor
- Publication number 20050046015
- Publication date Mar 3, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package for a large die
- Publication number 20040262718
- Publication date Dec 30, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Kambhampati Ramakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor packages and method for the fabrication thereof
- Publication number 20040145039
- Publication date Jul 29, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe for die stacking applications and related die stacking co...
- Publication number 20040061202
- Publication date Apr 1, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor package including stacked semicond...
- Publication number 20020195624
- Publication date Dec 26, 2002
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS

Kambhampati Ramakrishna

Person

Patents Grantslast 30 patents

Leadframe-based mold array package heat spreader and fabrication me...

Dual molded multi-chip package system

Integrated circuit package to package stacking system

Integrated circuit packaging system with a component in an encapsul...

Leadframe-based mold array package heat spreader and fabrication me...

Dual molded multi-chip package system

Semiconductor packaging system with stacking and method of manufact...

Integrated circuit package system with flexible substrate and reces...

Integrated circuit package system with flexible substrate and mound...

Encapsulant cavity integrated circuit package system and method of...

Array-molded package heat spreader and fabrication method therefor

Integrated circuit package system with an encapsulant cavity and me...

Leadframe package for MEMS microphone assembly

Integrated circuit package system

Stacked semiconductor packages and method therefor

Semiconductor package for a large die

Leadframe package for MEMS microphone assembly

Semiconductor assembly including chip scale package and second subs...

Pre-molded leadframe and method therefor

Semiconductor stacked package assembly having exposed substrate sur...

Method of mounting an integrated circuit package in an encapsulant...

Stacked semiconductor packages

Stacked semiconductor packages and method therefor

Packaging for optoelectronic devices

Method of manufacturing a semiconductor package for a die larger th...

Stacked semiconductor packages and method for the fabrication thereof

Leadframe for die stacking applications and related die stacking co...

Method of making a semiconductor package including stacked semicond...

Thermally enhanced stacked die package

Semiconductor package with spacer strips

Patents Applicationslast 30 patents

LEADFRAME-BASED MOLD ARRAY PACKAGE HEAT SPREADER AND FABRICATION ME...

DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM

ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...

ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...

LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND RECES...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUND...

SEMICONDUCTOR PACKAGES

ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM

DUAL MOLDED MULTI-CHIP PACKAGE SYSTEM

LEADFRAME PACKAGE FOR MEMS MICROPHONE ASSEMBLY

STACKED SEMICONDUCTOR PACKAGES AND METHOD THEREFOR

INTEGRATED CIRCUIT PACKAGE SYSTEM

Semiconductor stacked package assembly having exposed substrate sur...

Semiconductor assembly including chip scale package and second subs...

Packaging for optoelectronic devices

Semiconductor package for a large die

Stacked semiconductor packages

Leadframe-based mold array package heat spreader and fabrication me...

Array-molded package heat spreader and fabrication method therefor

Semiconductor package for a large die

Stacked semiconductor packages and method for the fabrication thereof

Leadframe for die stacking applications and related die stacking co...

Method of making a semiconductor package including stacked semicond...