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Kan Wae Lam
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Utrecht, NL
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Patents Grants
last 30 patents
Information
Patent Grant
Through hole side wettable flank
Patent number
11,227,820
Issue date
Jan 18, 2022
Nexperia B.V.
Kan Wae Lam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device with interior polygonal pads
Patent number
10,056,343
Issue date
Aug 21, 2018
Nexperia B.V.
Roelf A. J. Groenhuis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device with interior polygonal pads
Patent number
9,269,690
Issue date
Feb 23, 2016
NXP B.V.
Roelf A. J. Groenhuis
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF SINGULATION OF DIES FROM A WAFER
Publication number
20240105514
Publication date
Mar 28, 2024
NEXPERIA B.V.
Randolph Estal Flauta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STEP INTERCONNECT METALLIZATION TO ENABLE PANEL LEVEL PACKAGING
Publication number
20230178507
Publication date
Jun 8, 2023
NEXPERIA B.V.
Randolph Estal Flauta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH HOLE SIDE WETTABLE FLANK
Publication number
20200357728
Publication date
Nov 12, 2020
NEXPERIA B.V.
Kan Wae Lam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
Publication number
20160118357
Publication date
Apr 28, 2016
NXP B.V.
Roelf A.J. Groenhuis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
Publication number
20150162298
Publication date
Jun 11, 2015
NXP B.V.
Roelf A.J. Groenhuis
H01 - BASIC ELECTRIC ELEMENTS