Kanda Hiroyuki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless plating apparatus and electroless plating method
- Patent number 9,293,364
- Issue date Mar 22, 2016
- Ebara Corporation
- Hiroyuki Kanda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 8,029,653
- Issue date Oct 4, 2011
- Ebara Corporation
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 7,947,156
- Issue date May 24, 2011
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,736,474
- Issue date Jun 15, 2010
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,479,213
- Issue date Jan 20, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic processing apparatus and substrate processing method
- Patent number 7,374,646
- Issue date May 20, 2008
- Ebara Corporation
- Hidenao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for substrate
- Patent number 7,311,809
- Issue date Dec 25, 2007
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and apparatus
- Patent number 7,202,161
- Issue date Apr 10, 2007
- Ebara Corporation
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,169,705
- Issue date Jan 30, 2007
- Ebara Corporation
- Kunihito Ide
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANODE HOLDER, AND PLATING APPARATUS
- Publication number 20220307153
- Publication date Sep 29, 2022
- EBARA CORPORATION
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS
- Publication number 20220228285
- Publication date Jul 21, 2022
- EBARA CORPORATION
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS PLATING APPARATUS
- Publication number 20160160352
- Publication date Jun 9, 2016
- EBARA CORPORATION
- Hiroyuki KANDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD
- Publication number 20130122704
- Publication date May 16, 2013
- Dainippon Screen Mfg. Co., Ltd.
- Hiroyuki KANDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20100219078
- Publication date Sep 2, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and electrolytic processing method
- Publication number 20100032315
- Publication date Feb 11, 2010
- Junko Mine
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing a substrate
- Publication number 20090045067
- Publication date Feb 19, 2009
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20090020434
- Publication date Jan 22, 2009
- Akira Susaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus and substrate processing method
- Publication number 20080099340
- Publication date May 1, 2008
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cleaning method and cleaning apparatus for porous member
- Publication number 20080035171
- Publication date Feb 14, 2008
- Hiroyuki Kanda
- B08 - CLEANING
Information Patent Application
Electroplating apparatus and electroplating method
- Publication number 20080029398
- Publication date Feb 7, 2008
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method for controlling plating solution
- Publication number 20070158202
- Publication date Jul 12, 2007
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20060086616
- Publication date Apr 27, 2006
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050241946
- Publication date Nov 3, 2005
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing apparatus
- Publication number 20050236268
- Publication date Oct 27, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20050164498
- Publication date Jul 28, 2005
- Kunihito Ide
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing substrate
- Publication number 20050145482
- Publication date Jul 7, 2005
- Hidenao Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method and plating apparatus
- Publication number 20050139482
- Publication date Jun 30, 2005
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus for substrate
- Publication number 20050077173
- Publication date Apr 14, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050061659
- Publication date Mar 24, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for controlling electrolytic solution
- Publication number 20050051434
- Publication date Mar 10, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20050051437
- Publication date Mar 10, 2005
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus, plating method and substrate processing apparatus
- Publication number 20050023149
- Publication date Feb 3, 2005
- Tsutomu Nakada
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for processing a substrate
- Publication number 20050000820
- Publication date Jan 6, 2005
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method
- Publication number 20040262165
- Publication date Dec 30, 2004
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic processing apparatus and substrate processing method
- Publication number 20040256238
- Publication date Dec 23, 2004
- Hidenao Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing method and apparatus
- Publication number 20040241985
- Publication date Dec 2, 2004
- Koji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plating method
- Publication number 20040149584
- Publication date Aug 5, 2004
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kanda Hiroyuki

Person

Patents Grantslast 30 patents

Plating method, insoluble anode for plating, and plating apparatus

Electroless plating apparatus and electroless plating method

Electroplating apparatus and electroplating method

Substrate processing apparatus and substrate processing method

Plating apparatus and plating method

Plating apparatus and plating method

Plating method and plating apparatus

Electrolytic processing apparatus and substrate processing method

Plating apparatus for substrate

Substrate processing method and apparatus

Plating method and plating apparatus

Patents Applicationslast 30 patents

ANODE HOLDER, AND PLATING APPARATUS

PLATING METHOD, INSOLUBLE ANODE FOR PLATING, AND PLATING APPARATUS

ELECTROLESS PLATING APPARATUS

ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD

PLATING APPARATUS AND PLATING METHOD

Electrolytic processing apparatus and electrolytic processing method

Apparatus and method for processing a substrate

Substrate processing method and substrate processing apparatus

Substrate processing apparatus and substrate processing method

Cleaning method and cleaning apparatus for porous member

Electroplating apparatus and electroplating method

Plating apparatus and method for controlling plating solution

Plating apparatus and plating method

Plating apparatus and plating method

Substrate processing apparatus

Plating method and plating apparatus

Apparatus and method for processing substrate

Plating method and plating apparatus

Plating apparatus for substrate

Plating apparatus and plating method

Method and apparatus for controlling electrolytic solution

Plating apparatus and plating method

Plating apparatus, plating method and substrate processing apparatus

Apparatus and method for processing a substrate

Plating method

Electrolytic processing apparatus and substrate processing method

Substrate processing method and apparatus

Plating method