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last 30 patents
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Patent Grant
Semiconductor device and method of forming dual-sided interconnect...
Patent number
11,569,136
Issue date
Jan 31, 2023
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having an embedded conductive layer for power/...
Patent number
11,488,838
Issue date
Nov 1, 2022
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
11,370,655
Issue date
Jun 28, 2022
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming openings through insulat...
Patent number
11,127,666
Issue date
Sep 21, 2021
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
Patent number
11,024,561
Issue date
Jun 1, 2021
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
Patent number
10,790,158
Issue date
Sep 29, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming embedded conductive laye...
Patent number
10,741,416
Issue date
Aug 11, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
Patent number
10,707,150
Issue date
Jul 7, 2020
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
10,662,056
Issue date
May 26, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method for forming a low profile embedded...
Patent number
10,622,293
Issue date
Apr 14, 2020
JCET Semiconductor (Shaoxing) Co., Ltd.
Seung Wook Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interconnect substrate f...
Patent number
10,607,946
Issue date
Mar 31, 2020
JCET Semiconductor (Shaoxing) Co., Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a vertical interconnect...
Patent number
10,475,779
Issue date
Nov 12, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
Patent number
10,446,479
Issue date
Oct 15, 2019
STATS ChipPAC Pte. Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming build-up interconnect st...
Patent number
10,304,817
Issue date
May 28, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming supporting layer over se...
Patent number
10,297,518
Issue date
May 21, 2019
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
Patent number
10,297,556
Issue date
May 21, 2019
STATS ChipPAC Pte. Ltd.
Kian Meng Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
Patent number
10,217,702
Issue date
Feb 26, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming shielding layer over int...
Patent number
10,211,183
Issue date
Feb 19, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming sacrificial protective l...
Patent number
10,204,866
Issue date
Feb 12, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming wafer-level interconnect...
Patent number
10,204,879
Issue date
Feb 12, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
10,189,702
Issue date
Jan 29, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming dual-sided interconnect...
Patent number
10,192,796
Issue date
Jan 29, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming vertical interconnect st...
Patent number
10,192,801
Issue date
Jan 29, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
Patent number
10,177,010
Issue date
Jan 8, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming stacked vias within inte...
Patent number
10,170,385
Issue date
Jan 1, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming build-up interconnect st...
Patent number
10,163,737
Issue date
Dec 25, 2018
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
Patent number
10,163,747
Issue date
Dec 25, 2018
STATS ChipPAC Pte. Ltd.
Kian Meng Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with dummy metal protective structure around s...
Patent number
10,163,815
Issue date
Dec 25, 2018
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
Patent number
10,049,964
Issue date
Aug 14, 2018
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming dual-sided interconnect...
Patent number
9,978,654
Issue date
May 22, 2018
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Dual-Sided Interconnect...
Publication number
20230096463
Publication date
Mar 30, 2023
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
Publication number
20220289560
Publication date
Sep 15, 2022
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
Publication number
20200399117
Publication date
Dec 24, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Device and Method of Forming Embedded Conductive Laye...
Publication number
20200335358
Publication date
Oct 22, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
Publication number
20200294890
Publication date
Sep 17, 2020
STATS ChipPAC Pte Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Dual-Sided Interconnect...
Publication number
20190115268
Publication date
Apr 18, 2019
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
Publication number
20190109015
Publication date
Apr 11, 2019
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
Publication number
20190047845
Publication date
Feb 14, 2019
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Device and Method of Forming a Fan-Out PoP Device wit...
Publication number
20180331018
Publication date
Nov 15, 2018
STATS ChipPAC Pte Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
Publication number
20180068937
Publication date
Mar 8, 2018
STATS ChipPAC Pte Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
Publication number
20180026023
Publication date
Jan 25, 2018
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Build-Up Interconnect St...
Publication number
20180006008
Publication date
Jan 4, 2018
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
Publication number
20170297903
Publication date
Oct 19, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Device and Method of Forming Embedded Conductive Laye...
Publication number
20170263470
Publication date
Sep 14, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Interconnect Substrate f...
Publication number
20170236788
Publication date
Aug 17, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Controlling Warpage in Reconstit...
Publication number
20170194228
Publication date
Jul 6, 2017
STATS ChipPAC Pte Ltd.
Kian Meng Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Openings Through Insulat...
Publication number
20170148721
Publication date
May 25, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Controlling Warpage in Reconstit...
Publication number
20170133330
Publication date
May 11, 2017
STATS ChipPAC Pte Ltd.
Kian Meng Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
Publication number
20170098612
Publication date
Apr 6, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Repassivation Layer for...
Publication number
20170084526
Publication date
Mar 23, 2017
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Balancing Surfaces of an Embedde...
Publication number
20160351419
Publication date
Dec 1, 2016
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Supporting Layer Over Se...
Publication number
20160276238
Publication date
Sep 22, 2016
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out...
Publication number
20160276258
Publication date
Sep 22, 2016
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Stacked Vias Within Inte...
Publication number
20160276239
Publication date
Sep 22, 2016
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Build-Up Interconnect St...
Publication number
20160276232
Publication date
Sep 22, 2016
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Shielding Layer over Int...
Publication number
20160197059
Publication date
Jul 7, 2016
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Forming a Low Profile Embedded...
Publication number
20160141238
Publication date
May 19, 2016
STATS ChipPAC, Ltd.
Seung Wook Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Wafer-Level Interconnect...
Publication number
20160013148
Publication date
Jan 14, 2016
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
Publication number
20150294962
Publication date
Oct 15, 2015
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
Publication number
20150287708
Publication date
Oct 8, 2015
STATS ChipPAC, Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS