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Patents Grantslast 30 patents

Information Patent Grant
Lower IC package structure for coupling with an upper IC package to...
- Patent number 10,879,219
- Issue date Dec 29, 2020
- Intel Corporation
- Shaw Fong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 9,397,016
- Issue date Jul 19, 2016
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,847,368
- Issue date Sep 30, 2014
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly process for ultra thin substrate and package on...
- Patent number 8,258,019
- Issue date Sep 4, 2012
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STIFFENER FOR A PACKAGE SUBSTRATE
- Publication number 20190006294
- Publication date Jan 3, 2019
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOWER IC PACKAGE STRUCTURE FOR COUPLING WITH AN UPPER IC PACKAGE TO...
- Publication number 20180374833
- Publication date Dec 27, 2018
- Intel Corporation
- Shaw Fong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER HAVING VARIABLY-SIZED PADS
- Publication number 20170170108
- Publication date Jun 15, 2017
- Intel Corporation
- Chee Ling WONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20150076692
- Publication date Mar 19, 2015
- Intel Corporation
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20120319276
- Publication date Dec 20, 2012
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON...
- Publication number 20090321928
- Publication date Dec 31, 2009
- Weng Khoon Mong
- H01 - BASIC ELECTRIC ELEMENTS