Kang Sub YIM

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 12,198,925
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Shaunak Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single precursor low-k film deposition and UV cure for advanced tec...
- Patent number 12,119,223
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,967,498
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for forming UV-cured low-κ dielectric films
- Patent number 11,621,162
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depositing low-κdielectric films
- Patent number 11,600,486
- Issue date Mar 7, 2023
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,594,409
- Issue date Feb 28, 2023
- Applied Materials, Inc.
- Shaunak Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cleaning low-k deposition chambers
- Patent number 11,572,622
- Issue date Feb 7, 2023
- Applied Materials, Inc.
- Bo Xie
- B08 - CLEANING
Information Patent Grant
Low-k dielectric films
- Patent number 11,393,678
- Issue date Jul 19, 2022
- Applied Materials, Inc.
- William J. Durand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low-k dielectric with self-forming barrier layer
- Patent number 11,289,369
- Issue date Mar 29, 2022
- Applied Materials, Inc.
- Yi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric constant oxide and low resistance OP stack for 3D NA...
- Patent number 10,553,427
- Issue date Feb 4, 2020
- Applied Materials, Inc.
- Xinhai Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
UV assisted silylation for porous low-k film sealing
- Patent number 10,113,234
- Issue date Oct 30, 2018
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming a low-k dielectric layer with reduced dielectric constant a...
- Patent number 9,850,574
- Issue date Dec 26, 2017
- Applied Materials, Inc.
- Taewan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhancement of modulus and hardness for UV-cured ultra low-k dielec...
- Patent number 9,659,765
- Issue date May 23, 2017
- Applied Materials, Inc.
- Kang Sub Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt selectivity improvement in selective cobalt process sequence
- Patent number 9,478,460
- Issue date Oct 25, 2016
- APPLIED MATERIALS, INC.
- Mei-yee Shek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer dielectric stack for plasma damage protection
- Patent number 9,391,024
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post treatment for dielectric constant reduction with pore generati...
- Patent number 9,324,571
- Issue date Apr 26, 2016
- Applied Materials, Inc.
- Kang Sub Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-gap structure formation with ultra low-k dielectric layer on PE...
- Patent number 9,312,167
- Issue date Apr 12, 2016
- Applied Materials, Inc.
- Taewan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layer to minimize dielectric constant increase with good a...
- Patent number 9,165,998
- Issue date Oct 20, 2015
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt selectivity improvement in selective cobalt process sequence
- Patent number 9,105,695
- Issue date Aug 11, 2015
- Applied Materials, Inc.
- Mei-yee Shek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce dielectric constant of a porous low-k film
- Patent number 8,993,444
- Issue date Mar 31, 2015
- Applied Materials, Inc.
- Kelvin Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
UV assisted silylation for recovery and pore sealing of damaged low...
- Patent number 8,492,170
- Issue date Jul 23, 2013
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention and reduction of solvent and solution penetration into p...
- Patent number 8,481,422
- Issue date Jul 9, 2013
- Applied Materials, Inc.
- Kelvin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structure including a low k dielectric and a method...
- Patent number 8,349,746
- Issue date Jan 8, 2013
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Prevention and reduction of solvent and solution penetration into p...
- Patent number 8,236,684
- Issue date Aug 7, 2012
- Applied Materials, Inc.
- Kelvin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric recovery of plasma damaged low-k films by UV-assisted ph...
- Patent number 8,216,861
- Issue date Jul 10, 2012
- Applied Materials, Inc.
- Kang Sub Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon precursors to make ultra low-K films of K<2.2 with high mec...
- Patent number 7,998,536
- Issue date Aug 16, 2011
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon precursors to make ultra low-K films with high mechanical p...
- Patent number 7,989,033
- Issue date Aug 2, 2011
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus of creating airgap in dielectric layers for t...
- Patent number 7,879,683
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Amir Al-Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric (low k) barrier films with oxygen doping by plasma-e...
- Patent number 7,745,328
- Issue date Jun 29, 2010
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for porous SiCOH dielectric layers and adhesio...
- Patent number 7,615,482
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20240290611
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single Precursor Low-K Film Deposition and UV Cure for Advanced Tec...
- Publication number 20230142684
- Publication date May 11, 2023
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20230094180
- Publication date Mar 30, 2023
- Applied Materials, Inc.
- Shaunak Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING UV-CURED LOW-K DIELECTRIC FILMS
- Publication number 20220108884
- Publication date Apr 7, 2022
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20220084815
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CLEANING LOW-K DEPOSITION CHAMBERS
- Publication number 20220081765
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Bo Xie
- B08 - CLEANING
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20210407792
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20210272800
- Publication date Sep 2, 2021
- Applied Materials, Inc.
- Shaunak Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-K Dielectric Films
- Publication number 20210050212
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- William J. Durand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low-K Dielectric With Self-Forming Barrier Layer
- Publication number 20200388532
- Publication date Dec 10, 2020
- Applied Materials, Inc.
- Yi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NA...
- Publication number 20200126784
- Publication date Apr 23, 2020
- Applied Materials, Inc.
- Xinhai HAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-UV HIGH HARDNESS LOW K FILM DEPOSITION
- Publication number 20200075321
- Publication date Mar 5, 2020
- Applied Materials, Inc.
- Shaunak MUKHERJEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NA...
- Publication number 20180315592
- Publication date Nov 1, 2018
- Applied Materials, Inc.
- Xinhai HAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW TEMP SINGLE PRECURSOR ARC HARD MASK FOR MULTILAYER PATTERNING A...
- Publication number 20170125241
- Publication date May 4, 2017
- Applied Materials, Inc.
- Shaunak MUKHERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE
- Publication number 20160141203
- Publication date May 19, 2016
- Applied Materials, Inc.
- MEI-YEE SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER DIELECTRIC STACK FOR PLASMA DAMAGE PROTECTION
- Publication number 20160111373
- Publication date Apr 21, 2016
- Applied Materials, Inc.
- Bo XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP STRUCTURE FORMATION WITH ULTRA LOW-K DIELECTRIC LAYER ON PE...
- Publication number 20160099167
- Publication date Apr 7, 2016
- Applied Materials, Inc.
- Taewan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-ENHANCED AND RADICAL-BASED CVD OF POROUS CARBON-DOPED OXIDE...
- Publication number 20160017495
- Publication date Jan 21, 2016
- Applied Materials, Inc.
- Yihong CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCEMENT OF MODULUS AND HARDNESS FOR UV-CURED ULTRA LOW-K DIELEC...
- Publication number 20160020090
- Publication date Jan 21, 2016
- Applied Materials, Inc.
- Kang Sub YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV ASSISTED SILYLATION FOR POROUS LOW-K FILM SEALING
- Publication number 20160017492
- Publication date Jan 21, 2016
- Applied Materials, Inc.
- Bo XIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POST TREATMENT FOR DIELECTRIC CONSTANT REDUCTION WITH PORE GENERATI...
- Publication number 20150380265
- Publication date Dec 31, 2015
- Applied Materials, Inc.
- Kang Sub YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV CURING PROCESS TO IMPROVE MECHANICAL STRENGTH AND THROUGHPUT ON...
- Publication number 20150368803
- Publication date Dec 24, 2015
- Kang Sub YIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-K FILMS WITH ENHANCED CROSSLINKING BY UV CURING
- Publication number 20150284849
- Publication date Oct 8, 2015
- Applied Materials, Inc.
- Kang Sub YIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-K DIELECTRIC LAYER WITH REDUCED DIELECTRIC CONSTANT AND STRENGT...
- Publication number 20150232992
- Publication date Aug 20, 2015
- Applied Materials, Inc.
- Taewan KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE
- Publication number 20140349480
- Publication date Nov 27, 2014
- Mei-yee SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION LAYER TO MINIMIZE DIELECTRIC CONSTANT INCREASE WITH GOOD A...
- Publication number 20140264780
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Kang Sub YIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO REDUCE DIELECTRIC CONSTANT OF A POROUS LOW-K FILM
- Publication number 20140017895
- Publication date Jan 16, 2014
- Kelvin CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UV ASSISTED SILYLATION FOR RECOVERY AND PORE SEALING OF DAMAGED LOW...
- Publication number 20120270339
- Publication date Oct 25, 2012
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION AND REDUCTION OF SOLVENT AND SOLUTION PENETRATION INTO P...
- Publication number 20120208366
- Publication date Aug 16, 2012
- Applied Materials, Inc.
- KELVIN CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE
- Publication number 20120156890
- Publication date Jun 21, 2012
- Applied Materials, Inc.
- KANG SUB YIM
- H01 - BASIC ELECTRIC ELEMENTS

Kang Sub YIM

Person

Patents Grantslast 30 patents

Systems and methods for depositing low-k dielectric films

Single precursor low-k film deposition and UV cure for advanced tec...

Systems and methods for depositing low-k dielectric films

Systems and methods for forming UV-cured low-κ dielectric films

Systems and methods for depositing low-κdielectric films

Systems and methods for depositing low-k dielectric films

Systems and methods for cleaning low-k deposition chambers

Low-k dielectric films

Low-k dielectric with self-forming barrier layer

Low dielectric constant oxide and low resistance OP stack for 3D NA...

UV assisted silylation for porous low-k film sealing

Forming a low-k dielectric layer with reduced dielectric constant a...

Enhancement of modulus and hardness for UV-cured ultra low-k dielec...

Cobalt selectivity improvement in selective cobalt process sequence

Multi-layer dielectric stack for plasma damage protection

Post treatment for dielectric constant reduction with pore generati...

Air-gap structure formation with ultra low-k dielectric layer on PE...

Adhesion layer to minimize dielectric constant increase with good a...

Cobalt selectivity improvement in selective cobalt process sequence

Method to reduce dielectric constant of a porous low-k film

UV assisted silylation for recovery and pore sealing of damaged low...

Prevention and reduction of solvent and solution penetration into p...

Microelectronic structure including a low k dielectric and a method...

Prevention and reduction of solvent and solution penetration into p...

Dielectric recovery of plasma damaged low-k films by UV-assisted ph...

Silicon precursors to make ultra low-K films of K<2.2 with high mec...

Silicon precursors to make ultra low-K films with high mechanical p...

Methods and apparatus of creating airgap in dielectric layers for t...

Low dielectric (low k) barrier films with oxygen doping by plasma-e...

Structure and method for porous SiCOH dielectric layers and adhesio...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

Single Precursor Low-K Film Deposition and UV Cure for Advanced Tec...

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR FORMING UV-CURED LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR CLEANING LOW-K DEPOSITION CHAMBERS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

Low-K Dielectric Films

Low-K Dielectric With Self-Forming Barrier Layer

LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NA...

NON-UV HIGH HARDNESS LOW K FILM DEPOSITION

LOW DIELECTRIC CONSTANT OXIDE AND LOW RESISTANCE OP STACK FOR 3D NA...

LOW TEMP SINGLE PRECURSOR ARC HARD MASK FOR MULTILAYER PATTERNING A...

COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE

MULTI-LAYER DIELECTRIC STACK FOR PLASMA DAMAGE PROTECTION

AIR-GAP STRUCTURE FORMATION WITH ULTRA LOW-K DIELECTRIC LAYER ON PE...

PLASMA-ENHANCED AND RADICAL-BASED CVD OF POROUS CARBON-DOPED OXIDE...

ENHANCEMENT OF MODULUS AND HARDNESS FOR UV-CURED ULTRA LOW-K DIELEC...

UV ASSISTED SILYLATION FOR POROUS LOW-K FILM SEALING

POST TREATMENT FOR DIELECTRIC CONSTANT REDUCTION WITH PORE GENERATI...

UV CURING PROCESS TO IMPROVE MECHANICAL STRENGTH AND THROUGHPUT ON...

LOW-K FILMS WITH ENHANCED CROSSLINKING BY UV CURING

LOW-K DIELECTRIC LAYER WITH REDUCED DIELECTRIC CONSTANT AND STRENGT...

COBALT SELECTIVITY IMPROVEMENT IN SELECTIVE COBALT PROCESS SEQUENCE

ADHESION LAYER TO MINIMIZE DIELECTRIC CONSTANT INCREASE WITH GOOD A...

METHOD TO REDUCE DIELECTRIC CONSTANT OF A POROUS LOW-K FILM

UV ASSISTED SILYLATION FOR RECOVERY AND PORE SEALING OF DAMAGED LOW...

PREVENTION AND REDUCTION OF SOLVENT AND SOLUTION PENETRATION INTO P...

IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE